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11. 发明专利

JP2011192797A Resin coater and resin coating method 审中-公开
标题翻译：树脂涂料和树脂涂料方法
公开(公告)号：JP2011192797A
公开(公告)日：2011-09-29
申请号：JP2010057786
申请日：2010-03-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOMORI HIDEKI , NAKAJIMA YASUSHI , HIRAYAMA TOMIO
IPC分类号： H01L21/56
CPC分类号： H01L2224/4847 , H01L2224/8592
摘要： PROBLEM TO BE SOLVED: To provide a resin coater that stably applies resin even to a lower region necessary for coating just beneath an upper structure such as a wire or the like, and also to provide a coating method. SOLUTION: A nozzle 10 has a three-fold structure consisting of a coating needle 11, an air nozzle 12 and an air nozzle 13. Namely, the coating needle 11 is arranged at its center, the air nozzle 12 is arranged surrounding the outer circumference of the coating needle 11, and the air nozzle 13 is arranged surrounding the outer circumference of the air nozzle 12. When the resin drop 2d from the coating needle 11 is dropped for coating, the air A2 and high-pressure air A3 are simultaneously supplied from the air nozzles 12 and 13. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种树脂涂布机，其即使在刚刚在诸如线材等的上部结构之下涂覆所需的下部区域也能稳定地施加树脂，并且还提供涂布方法。解决方案：喷嘴10具有由涂覆针11，空气喷嘴12和空气喷嘴13组成的三重结构。即，涂覆针11布置在其中心，空气喷嘴12围绕涂布针11的外周和空气喷嘴13围绕空气喷嘴12的外周布置。当来自涂布针11的树脂滴2d下落以进行涂布时，空气A2和高压空气A3 同时从空气喷嘴12和13供应。版权所有（C）2011，JPO＆INPIT

12. 发明专利

JP2011124457A Solder bonding device 有权
标题翻译：焊接装置
公开(公告)号：JP2011124457A
公开(公告)日：2011-06-23
申请号：JP2009282346
申请日：2009-12-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOMORI HIDEKI , NAKAJIMA YASUSHI , ASAJI NOBUHIRO
IPC分类号： H01L21/52 , B23K1/008 , B23K31/02 , B23K101/42 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain superior solder bonding without causing variations, and to improve the throughput of solder bonding by uniformly cleaning an oxide film of a work and a foreign substance contamination, etc. SOLUTION: A vaporizer for generating a carboxylic acid-contained gas for cleaning the work set in a reflow device is formed of a metal cover, a vaporizing wall at innermost side, a heat insulating material filling a clearance between the metal cover and the vaporizing wall, and a heater set on an outer surface of the vaporizing wall. Furthermore, a space is formed in the vaporizing wall, and the vaporizer has a cylindrical shape whose both end surfaces are closed, and a gas introduction pipe for introducing a carrier gas and a chemical supply pipe for supplying a carboxylic acid-contained liquid are connected to each other. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了获得优异的焊接接合而不引起变化，并且通过均匀地清洁工件的氧化膜和异物污染等来提高焊接接合的通过量。解决方案：用于生成用于清洗回流装置中的工件的含羧酸气体由金属盖，最内侧的汽化壁，填充金属盖和汽化壁之间的间隙的绝热材料形成，以及加热器组在蒸发壁的外表面上。此外，在蒸发壁中形成空间，并且蒸发器具有两个端面封闭的圆筒形状，并且用于引入载气的气体引入管和用于供给含羧酸的液体的化学品供应管被连接对彼此。版权所有（C）2011，JPO＆INPIT

13. 发明专利

JP2011121102A Solder joining apparatus 有权
标题翻译：焊接机
公开(公告)号：JP2011121102A
公开(公告)日：2011-06-23
申请号：JP2009282347
申请日：2009-12-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOMORI HIDEKI , IGARASHI HIROSHI , NAKAJIMA YASUSHI
IPC分类号： B23K1/008 , B23K1/00 , B23K31/02 , B23K101/40 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder joining apparatus which continuously measures the concentration of a carboxylic acid-containing gas in a heating chamber during solder joining in real time, prevents a variation in solder joining, and thus enhances the reliability of solder joining. SOLUTION: The solder joining apparatus comprises a measuring part that is connected to a chamber in a reflow part and measures the concentration of a carboxylic acid-containing gas, a semiconductor-type gas sensor installed in a measuring cavity of the measuring part, a signal processor that calculates the concentration of the carboxylic acid-containing gas based on the signal measured with the semiconductor-type gas sensor, and an indicator that displays data on the concentration of the carboxylic acid-containing gas calculated in the signal processor. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在实时焊接期间连续测量加热室中含羧酸气体浓度的焊料接合装置，防止焊料接合的变化，从而提高焊接接头的可靠性焊接加工。焊接接合装置包括测量部分，其连接到回流部分中的室并测量含羧酸气体的浓度，安装在测量部分的测量腔中的半导体型气体传感器，基于用半导体型气体传感器测量的信号计算含羧酸气体的浓度的信号处理器，以及显示在信号处理器中计算的含羧酸气体浓度的数据的指示器。版权所有（C）2011，JPO＆INPIT

14. 发明专利

JP2011119488A Heat sink and method of manufacturing heat sink 有权
标题翻译：散热器及其制造方法
公开(公告)号：JP2011119488A
公开(公告)日：2011-06-16
申请号：JP2009275970
申请日：2009-12-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOMORI HIDEKI , KIMURA SUSUMU , YOSHIHARA HIROYUKI , TOMONAGA SHINZO , NAKAJIMA YASUSHI
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve a problem that, in a conventional caulking method for inserting fins into grooves in a metal base, enlarging widths of the groove by a press blade, and integrating the fins, pressing forces are not uniformly applied to the grooves and variations are generated in the grooves widths due to the irregularity of a load when enlarging the widths of the metal base grooves, thus resulting in unevenness in fin-fitting and insufficient fin performance (cooling performance). SOLUTION: In a method for enlarging a width of a concave portion of a base groove 2a serving as a side surface of a fin groove 2b formed in a metal base 2 by means of a press blade 3 and fitting the fins 1 into the grooves by pressing them on the side surface of the fin groove 2b, a tip of the press blade 3 has a roller 4. A predetermined allowance (i.e., a clearance) is given for fixing the roller 4 so that the roller moves with a degree of freedom. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题为了解决在以往的用于将金属片中的槽插入翅片的铆接方法中，通过压力刀扩大槽的宽度并且使翅片一体化的问题，压力不均匀地施加由于在扩大金属基底槽的宽度时由于负载的不规则性而在槽宽度上产生变化，从而导致翅片配合不均匀和翅片性能（冷却性能）不足。解决方案：在通过压力叶片3扩大用作形成在金属基座2中的翅片槽2b的侧面的基部槽2a的凹部的宽度的方法中，并将翅片1嵌合凹槽通过将它们压在翅片槽2b的侧表面上，压力叶片3的尖端具有辊4.给定用于固定辊4的预定余量（即，间隙），使得辊以自由度。版权所有（C）2011，JPO＆INPIT

15. 发明专利

JP2011071126A Power semiconductor device having circuit breaking mechanism 有权
标题翻译：具有电路断路机构的功率半导体器件
公开(公告)号：JP2011071126A
公开(公告)日：2011-04-07
申请号：JP2010251956
申请日：2010-11-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAJIMA YASUSHI , YOSHIMATSU NAOKI , UEDA TETSUYA , YONEDA YUTAKA
IPC分类号： H01H37/76 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48472 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device equipped with a circuit breaking mechanism having a thermal fuse fusible at low temperatures while having a small resistance value. SOLUTION: This circuit breaking mechanism 10 includes: one primary wiring conductor 2 and the other primary wiring conductor 2 provided on the upper side of a substrate 1 and each connected to a prescribed electronic circuit; and heater conductors 4 provided on the primary surface of the substrate 1 so as to generate heat when a current flows in it. The circuit breaking mechanism 10 also includes one low-melting point metal conductor 5 for connecting the one primary wiring conductor 2 to an electrode film 3, and the other low-melting point metal conductor 5 for electrically connecting the other primary wiring conductor 2 to the electrode film 3. Each of the one low-melting point metal conductor 5 and the other low-melting point metal conductor 5 has a melting point lower than that of either of the one primary wiring conductor 2 and the other primary wiring conductor 2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有断路机构的功率半导体器件，该电路断路机构具有在低温下易熔融的热熔丝，同时具有小的电阻值。解决方案：该断路机构10包括：一个主布线导体2和设置在基板1的上侧并且各自连接到规定的电子电路的另一个主布线导体2; 以及设置在基板1的主表面上的加热器导体4，以便当电流流入其中时产生热量。断路机构10还包括一个用于将一个一次布线导体2连接到电极膜3的低熔点金属导体5，另一个低熔点金属导体5将另一个初级布线导体2电连接到一个低熔点金属导体5和另一个低熔点金属导体5中的每一个的熔点比一个一次布线导体2和另一个主布线导体2的熔点低。 P>版权所有（C）2011，JPO＆INPIT

16. 发明专利

JP2010219311A Semiconductor device and semiconductor module 审中-公开
标题翻译：半导体器件和半导体器件
公开(公告)号：JP2010219311A
公开(公告)日：2010-09-30
申请号：JP2009064474
申请日：2009-03-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAJIMA YASUSHI , OMORI NOBUHIKO
IPC分类号： H01L29/78 , H01L29/06 , H01L29/41 , H01L29/739
摘要： PROBLEM TO BE SOLVED: To make a semiconductor device compact since the shape and interval of guard rings do not depend upon a shrink rate. SOLUTION: The present invention relates to a vertical type semiconductor device, including a semiconductor substrate 1 having a front surface and a back surface arranged opposite each other and a side surface between the front surface and back surface, an active region 2 provided on the front surface side of the semiconductor substrate 1, the endless guard rings 3 provided surrounding the active region 2, a surface electrode 4 provided on the active region 2 of the semiconductor substrate 1, and a back electrode 5 provided on the back surface side of the semiconductor substrate 1, wherein a voltage is applied between the surface electrode 4 and back electrode 5, and a conductive region is provided along the side surface of the semiconductor substrate 1. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了使半导体器件紧凑，因为保护环的形状和间隔不依赖于收缩率。解决方案：本发明涉及一种垂直型半导体器件，包括具有彼此相对布置的正面和背面以及前表面和背面之间的侧表面的半导体衬底1，所述有源区2设置在半导体基板1的表面侧，设置在有源区域2周围的环形保护环3，设置在半导体基板1的有源区域2上的表面电极4和设置在半导体基板1的背面侧的背面电极5 其中在表面电极4和背面电极5之间施加电压，沿着半导体衬底1的侧表面设置导电区域。（C）2010，JPO＆INPIT

17. 发明专利

JP2008294097A Component-mounting device and component discriminating method 审中-公开
标题翻译：组件安装和组件分辨方法
公开(公告)号：JP2008294097A
公开(公告)日：2008-12-04
申请号：JP2007136114
申请日：2007-05-23
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOBAYASHI NOBORU , NAKAJIMA YASUSHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a component-mounting device in which component reel exchanging work can be performed, in short time and with ease, and the kind of component of the component reel which is held can be discriminated accurately. SOLUTION: When a cartridge detecting sensor 9 detects the mounting of a component cartridge 5, the kind of a component stored in component information storage means 11 and the kind of a component indicated by a component identification 7 read most recently by a component identification reading device 3 are cross-checked for a cartridge-mounting portion 4 in which mounting the component cartridge 5 has been detected. When the result of cross check shows inequality, an indicator 12 is made to indicate that a component reel 3 of the cartridge mounting portion 4 mounting the component cartridge 5 is inappropriate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在短时间内容易地执行部件卷轴更换作业的部件安装装置，并且可以准确地区分保持的部件卷轴的部件的种类。解决方案：当盒式磁带检测传感器9检测到组件盒5的安装时，存储在组件信息存储装置11中的组件的种类和由组件最近读取的组件标识7指示的组件的种类对于已经检测到组件盒5的安装的盒安装部分4，识别读取装置3被交叉检查。当交叉检查的结果显示不等式时，指示器12指示安装部件盒5的盒安装部分4的部件卷轴3是不合适的。版权所有（C）2009，JPO＆INPIT

18. 发明专利

JP2008282597A Temperature fuse 审中-公开
标题翻译：温度保险丝
公开(公告)号：JP2008282597A
公开(公告)日：2008-11-20
申请号：JP2007124165
申请日：2007-05-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YONEDA YUTAKA , NAKAJIMA YASUSHI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To provide a temperature fuse for quickly extinguishing arc discharge generated during fusion of a low fusing point conductor.
SOLUTION: This temperature fuse is equipped with a fuse conductor using electrodes 1, 2 and the low fusing point conductor 4, and an insulator heater 6 to fuse the fuse conductor. The insulator heater is disposed between the electrodes, and the low fusing point conductor is disposed on both sides of the insulator heater as a conductor between the electrodes.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种温度保险丝，用于快速熄灭低熔点点导体熔化过程中产生的电弧放电。
解决方案：该温度保险丝配备有使用电极1,2和低熔点导体4的保险丝导体，以及用于熔断保险丝导体的绝缘体加热器6。绝缘体加热器设置在电极之间，低熔点导体设置在绝缘体加热器的两侧，作为电极之间的导体。版权所有（C）2009，JPO＆INPIT

19. 发明专利

JP2008177411A Power semiconductor device having breaking mechanism 有权
标题翻译：具有断路机构的功率半导体器件
公开(公告)号：JP2008177411A
公开(公告)日：2008-07-31
申请号：JP2007010307
申请日：2007-01-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAJIMA YASUSHI , YOSHIMATSU NAOKI , UEDA TETSUYA , YONEDA YUTAKA
IPC分类号： H01L25/07 , H01L23/60 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device having a breaking mechanism that has a temperature fuse which is blown at a low temperature and has a small resistance value. SOLUTION: The breaking mechanism 10 comprises: one primary wiring conductor 2 and the other primary wiring conductor 2 that are provided above a substrate 1 and are each connected to a given electronic circuit; and heater conductors 4 that are provided on a primary surface of the substrate 1 to produce heat when current flows thereto. Furthermore, the breaking mechanism 10 comprises one low-melting metal conductor 5 for connecting the one primary wiring conductor 2 and an electrode film 3; and the other low-melting metal conductor 5 for electrically connecting the other primary wiring conductor 2 and the electrode film 3. Moreover, each of the one low-melting metal conductor 5 and the other low-melting metal conductor 5 has a melting point lower than that of either of the one primary wiring conductor 2 and the other primary wiring conductor 2. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有断开机构的功率半导体器件，该断开机构具有在低温下被吹制且电阻值小的温度熔丝。解决方案：断路机构10包括：一个主布线导体2和另一个主布线导体2，其设置在基板1上方并且各自连接到给定的电子电路; 以及设置在基板1的主表面上以在电流流过时产生热量的加热器导体4。此外，断开机构10包括用于连接一个一次布线导体2和电极膜3的一个低熔点金属导体5; 和另一个低熔点金属导体5，用于将另一个初级布线导体2和电极膜3电连接。此外，一个低熔点金属导体5和另一个低熔点金属导体5中的每一个具有较低的熔点优于一个主布线导体2和另一个主布线导体2中的任一个。版权所有（C）2008，JPO＆INPIT

20. 发明专利

JP2007324626A Power module 有权
标题翻译：电源模块
公开(公告)号：JP2007324626A
公开(公告)日：2007-12-13
申请号：JP2007225188
申请日：2007-08-31
申请人： Mitsubishi Electric Corp , Renesas Semiconductor Engineering Corp , 三菱電機株式会社 , 株式会社ルネサスセミコンダクタエンジニアリング
发明人： KIMOTO NOBUYOSHI , YOSHIDA TAKANOBU , YOSHIMATSU NAOKI , KOGA MASUO , NAKAJIMA YASUSHI , MAJUMDAR GOLUB , FUKADA MASAKAZU
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2924/01015 , H01L2924/13055 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power module that can reduce circuit inductance, can be miniaturized and made light, and also has vibration resistance. SOLUTION: A box-like smoothing capacitor 20 for smoothing a DC supply voltage applied to a power semiconductor device 5 externally comes into contact with the side of a case frame 6 including a second side (namely, a side where an N terminal 8N and a P terminal 8P are arranged) on the upper surface of the case frame 6, and is arranged while the height of the upper surface of a smoothing capacitor 20 is aligned to the upper surface of the case frame 6. An N electrode 21N and a P electrode 21P of the smoothing capacitor 20 are arranged at locations close to the N terminal 8N and the P terminal 8P at a power module body 99 on the upper surface of the smoothing capacitor 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以降低电路电感的功率模块，可以小型化并且变得轻便，并且还具有抗振动性。解决方案：用于平滑施加到功率半导体器件5的DC电源电压的盒状平滑电容器20外部与壳体框架6的一侧接触，壳体框架6包括第二侧（即，N端 8N和P端子8P）布置在壳体框架6的上表面上，并且在平滑电容器20的上表面的高度与壳体框架6的上表面对准的同时被布置.N电极21N 平滑电容器20的P电极21P被布置在平滑电容器20的上表面上的功率模块主体99处的N端子8N和P端子8P附近的位置。（C）2008 ，JPO＆INPIT

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