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11. 发明专利

JP2006196813A Wiring board and method for manufacturing same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2006196813A
公开(公告)日：2006-07-27
申请号：JP2005008786
申请日：2005-01-17
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUGAWA TOSHIO , TAKASE YOSHIHISA , HIGASHIYA HIDEKI
IPC分类号： H05K1/11 , H05K3/18 , H05K3/38 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a wiring board having a highly precise and fine wiring pattern without deteriorating peeling strength by maintaining satisfactory inter-layer electric connection reliability by forming a plurality of types of different conductive materials like a layer in a through-hole. SOLUTION: An insulating substrate 1 is formed with a through-hole 2, and a plurality of types of different conductive materials 3 and 4 are packed in the through-hole 2; and the conductive materials 3 and 4 are formed like a layer in the through-hole 2, and electrically connected to a wiring pattern constituted of electroless plating copper 8 and electroplating copper 10, so that a wiring board can be configured. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种具有高精度和精细的布线图案的布线板，而不会通过形成多种类型的不同的导电材料来保持令人满意的层间电连接可靠性而不会降低剥离强度，例如通孔 -孔。解决方案：绝缘基板1形成有通孔2，并且多个不同的导电材料3和4被包装在通孔2中; 并且导电材料3和4在通孔2中形成为类似层，并且电连接到由化学镀铜8和电镀铜10构成的布线图案，使得可以配置布线板。版权所有（C）2006，JPO＆NCIPI

12. 发明专利

JP2005295363A Surface acoustic wave body 审中-公开
标题翻译：表面声波波体
公开(公告)号：JP2005295363A
公开(公告)日：2005-10-20
申请号：JP2004109781
申请日：2004-04-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SHIMAMURA TETSUO , HIGASHIYA HIDEKI
IPC分类号： H03H9/25 , H03H9/145
摘要： PROBLEM TO BE SOLVED: To reduce the thickness of a surface acoustic wave body mainly used for mobile communication equipment.
SOLUTION: This surface acoustic wave body is provided with a silicon substrate 12, piezoelectric thin film 13 provided on the top surface of this silicon substrate 12, surface acoustic wave element configured by an interdigital transducer 14 provided on the top surface of this thin film 13, pad electrode 15 electrically connected to this surface acoustic wave element and provided on a portion other than the surface acoustic wave element on the top surface of the thin film 13, through hole 17 penetrating the thin film 13 and the silicon substrate 12 on a lower part of this pad electrode 15, conductive material filled in this through hole 17, and external terminal 24 provided on the bottom surface side of the silicon substrate 12. The pad electrode 15 and the external terminal 24 are each a surface acoustic wave element electrically connected via the conductive material in the through hole 17. Thus, the surface acoustic wave body is reduced in thickness.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减少主要用于移动通信设备的表面声波体的厚度。解决方案：该表面声波体设置有硅衬底12，设置在该硅衬底12的顶表面上的压电薄膜13，由设置在该硅衬底12的顶表面上的叉指换能器14构成的表面声波元件薄膜13，与该声表面波元件电连接并设置在薄膜13的上表面上的表面声波元件以外的部分的焊盘电极15，贯通薄膜13和硅基板12的通孔17 在该焊盘电极15的下部，填充在该通孔17中的导电材料和设置在硅基板12的底面侧的外部端子24.焊盘电极15和外部端子24各自为表面声波元件通过通孔17中的导电材料电连接。因此，声表面波体的厚度减小。版权所有（C）2006，JPO＆NCIPI

13. 发明专利

JP2004356324A Method and apparatus of manufacturing wiring board 审中-公开
公开(公告)号：JP2004356324A
公开(公告)日：2004-12-16
申请号：JP2003151347
申请日：2003-05-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIGASHIYA HIDEKI , NAKAYA YASUHIRO , MATSUOKA SUSUMU , OKIMOTO RIKIYA
IPC分类号： H05K3/28 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method which enables the formation of a multilayer wiring board having a very fine IVH structure for all the layers.
SOLUTION: This manufacturing method includes a process wherein protection films (102) are pasted on both faces of an electric insulation substrate (101), and via holes (103) are formed in the electric insulation substrate (101). Then the via holes (103) are filled up with a conductor (104), and the protection films (102) are removed and the electric insulation substrate (101) is positioned and stacked on a body which is to be formed with an interconnection. In the positioning and stacking process, with the electric insulation substrate (101) fixed to a supporting body (105), the protection film on the non-fixed face is removed. After the electric insulation substrate is positioned and stacked on the body which is to be formed with an interconnection, the remaining protection film on the opposite side is removed.
COPYRIGHT: (C)2005,JPO&NCIPI

14. 发明专利

JP2004356323A Method and device for manufacturing wiring board 审中-公开
公开(公告)号：JP2004356323A
公开(公告)日：2004-12-16
申请号：JP2003151346
申请日：2003-05-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAKAYA YASUHIRO , HIGASHIYA HIDEKI , MATSUOKA SUSUMU , OKIMOTO RIKIYA
IPC分类号： H05K3/40 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide manufacturing method/device of a fine and highly reliable wiring board realizing interlayer connection with less dispersion and having high positioning precision.
SOLUTION: In the manufacturing method of the wiring board, wiring (308) and an electric insulating sheet (303) where a through hole in a thickness direction is filled with conductive paste (305) are integrated. An adhesive layer and a cover film are installed on both faces of the electric insulating sheet. One of cover films is peeled, and the electric insulating sheet (303) is sucked by an alignment jig for electric insulating sheet whose center is a non-contact face (310), whose periphery is brought into contact with the electric insulating sheet (303), and which has a suction groove (302). The other cover film is peeled, and the electric insulating sheet (303) and wiring (308) are bonded by adhesive.
COPYRIGHT: (C)2005,JPO&NCIPI

15. 发明专利

JP2004128418A Semiconductor device and manufacturing method thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2004128418A
公开(公告)日：2004-04-22
申请号：JP2002294142
申请日：2002-10-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIGASHIYA HIDEKI , NISHIYAMA TOSAKU , NAKAMURA SADASHI
IPC分类号： H05K7/20 , H01L21/60 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/02
CPC分类号： H01L2224/24 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a thin three-dimensional semiconductor device by mounting a plurality of thin semiconductor devices on a flexible board, which has high speed performance, high frequency, and excellent function, and by bending the board while controlling electric interference. SOLUTION: The semiconductor device comprises a bent package which has two or more semiconductors (102, 103) mounted on the flexible board. The bent parts of places (109, 110) without the electronic components of the flexible board (101) mounted, are laminated and arranged at least between a pair of semiconductor elements (102, 103). A metallization layer (104) covering at least one of the semiconductor elements (102, 103) facing is formed in the place laminated and arranged between the semiconductors (102, 103) of the flexible board (101). COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了通过在柔性板上安装多个薄的半导体器件来提供薄的三维半导体器件，该柔性板具有高速性能，高频率和优异的功能，并且通过在控制板的同时弯曲板电干扰。解决方案：半导体器件包括弯曲封装，其具有安装在柔性板上的两个或更多个半导体（102,103）。至少在一对半导体元件（102,103）之间层压并且布置没有安装有柔性板（101）的电子部件的位置（109,110）的弯曲部分。在层叠并布置在柔性板（101）的半导体（102,103）之间的位置处形成覆盖面对的半导体元件（102,103）中的至少一个的金属化层（104）。版权所有（C）2004，JPO

16. 发明专利

JP2002076616A METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER CIRCUIT BOARD 失效
公开(公告)号：JP2002076616A
公开(公告)日：2002-03-15
申请号：JP2000265381
申请日：2000-09-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI , HIGASHIYA HIDEKI , ANDO DAIZO
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a multilayer circuit board capable of suppressing unevenness of a connecting resistance by improving a density of conductive metal fine particles in through holes in the case of filling through holes with conductive paste formed at a base and connecting front and rear wiring layers, lowering the resistance and enhancing a connecting reliability. SOLUTION: The method for manufacturing the multilayer circuit board comprises the steps of forming a coating film layer 45 of the conductive paste 4 on a prepreg sheet base 1 of a semi-cured state formed with the through holes 3 and having releasable films 2 on both side surfaces, mounting the base 1 on a conveying sheet 67 sending and moving between rotary rollers 16 and 19 disposed oppositely and given by a pressing force, and sequentially press filling the holes 3 with the paste 4 by a pressing force of the roller at the rotary roller passing time by sending and moving the sheet. Thus, the holes are filled with the paste in a high density.

17. 发明专利

JP2001308534A WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
公开(公告)号：JP2001308534A
公开(公告)日：2001-11-02
申请号：JP2000126518
申请日：2000-04-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIGASHIYA HIDEKI , ANDO DAIZO , NAKAMURA SADASHI , SUGAWA TOSHIO
IPC分类号： H05K1/11 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a microscopic wiring board which exhibits a high reliability and few variations in connection resistance by realizing a stable inter-layer connection with respect to the wiring board whose several wiring layers separated by electrically insulating base are electrically connected by inner via holes. SOLUTION: The wiring board is provided with an electrically insulating base 401 made of a compressible porous base, wiring patterns 406 placed on both sides of the electrically insulating base 401, via holes 403 formed through the electrically insulating base 401, and conductive paste 404 with which the via holes 403 are filled and whose wiring patterns 406 are electrically connected between both sides of the electrically insulating base 401 by only conductive paste 404. At least one of the wiring patterns 406 is formed by plating, is adhered on the surface of the electrically insulating base 401, and is coupled to conductive particles in the conductive paste 404.

18. 发明专利

JP2000236166A CONNECTING STRUCTURE OF VIA HOLE AND PRINTED WIRING BOARD 失效
公开(公告)号：JP2000236166A
公开(公告)日：2000-08-29
申请号：JP3573499
申请日：1999-02-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA SADASHI , SUGAWA TOSHIO , HIGASHIYA HIDEKI , KONDO SHUJI , ANDO DAIZO
IPC分类号： H05K1/11 , H01L23/12 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To stabilize a connecting resistance value of a via hole by connecting an electrical conductor filled into the via hole to an interconnecting pattern through the intermediary of a protrusive bump formed on the inner face in at least one land. SOLUTION: In a via hole provided in a substrate 1 and filled with an electric conductor 3, a protrusive bump 6 consisting of an electrically conductive material and electrically connected to the electric conductor 3 is formed within a land 5 provided in a part of interconnecting patterns 4, consisting of copper foil positioned on both surfaces of the substrate 1. The electrical conductor filled into the via hole 2 and the interconnecting pattern 4 is then electrically connected through the intermediary of the bump 6. In this case, the bump 6 may be provided in the inner face of at least one of lands 5 covering both of the upper and the lower surfaces of the via hole 2 filled with the electrical conductor.

19. 发明专利

JP2000151097A MANUFACTURE OF PRINTED WIRING BOARD AND MANUFACTURING SYSTEM 失效
公开(公告)号：JP2000151097A
公开(公告)日：2000-05-30
申请号：JP32470098
申请日：1998-11-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIGASHIYA HIDEKI , KONDO SHUJI , NAKAYA YASUHIRO
IPC分类号： H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method thereof with high connection reliability obtained when a high-density wiring is formed in a limited area of the printed wiring board. SOLUTION: A basic fiber material such as aramid nonwoven fabric, etc., is impregnated with thermosetting resin such as epoxy resin, etc., to make a board 1 half-cured, then organic films 2 are applied on both surfaces of the board 1. After that, a plurality of through-holes are formed, the board 1 is placed on a sheet 4. The pressure difference is produced by sucking and pressure-reducing at the lower surface side of the board 1 so that the upper surface side of the board 1 may have a higher pressure than that of the lower surface side. Then, conductive paste 7 applied on the surface of a pressing plate 6 is arranged on the upper surface of the board 1, and pressure is applied. As a result, the through-holes are filled with the conductivity paste 7 with high density.

20. 发明专利

JP2000036664A MULTILAYER WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JP2000036664A
公开(公告)日：2000-02-02
申请号：JP12712499
申请日：1999-05-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA SADASHI , ANDO DAIZO , SUGAWA TOSHIO , HIGASHIYA HIDEKI , TSUKAMOTO KATSUHIDE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high-density and low-cost multilayer wiring board and a method for manufacturing the same. SOLUTION: A first wiring board 101 provided with a specified insulating layer and a wiring layer, and a second wiring board 102 provided with a specified insulating layer and a wiring layer, are laminated through a board bonding element 106 provided with a through hole filled with a conductor 105. A wiring layer 107 in the surface layer of the first wiring board 101 and a wiring layer 108 in the surface layer of the second wiring board 102 are electrically connected through the conductor 105 and at least one of the wiring layers 107 and 108 is buried in the board bonding element 106. In this way, the wiring boards 101 and 102 separately formed can be integrated and electrically joined by the conductor 105 in the through hole 104 provided in the board bonding element 106, and a high-density and low-cost multilayer wiring board can be obtained.

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