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11. 发明专利

JP2011200951A Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：JP2011200951A
公开(公告)日：2011-10-13
申请号：JP2010069057
申请日：2010-03-25
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： MOCHIZUKI YOSHIMI , MIYASAKA HIROHITO , TATENO TEPPEI
IPC分类号： B24B37/22 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad which makes the flatness of a polishing object uniformed, while suppressing scratches on the polishing object.SOLUTION: This polishing pad 10 includes an urethane sheet 2 by a wet-coagulation method. A base material 8 is stuck to a back surface side of the urethane sheet 2. The base material 8 includes two kinds of sheet members having plasticity and different Shore A hardness. The two kinds of sheet members include each of a plurality of member pieces 8a and a plurality of member pieces 8b. As for the Shore A hardness, the member pieces 8a and the member pieces 8b are set within a range of 80-95° and a range of 5-40°, respectively. In the base material 8, the member pieces 8a and 8b are arranged in grid-shapes to be adjacent to each other in a planar shape viewed from a side of the surface stuck to the urethane sheet 2. When polishing pressure is applied, a difference is produced in a pressing force applied to polishing particles between the polishing object and the polishing pad 10 to make the polishing particles easy to move.
摘要翻译：要解决的问题：提供一种抛光垫，其使抛光对象的平坦度均匀，同时抑制抛光对象上的划痕。解决方案：该抛光垫10通过湿式凝结法包括氨基甲酸酯片2。基材8粘贴在聚氨酯片2的背面侧。基材8具有塑性和肖氏A硬度不同的两种片状构件。两种片状构件包括多个构件片8a和多个构件片8b中的每一个。对于肖氏A硬度，构件片8a和构件片8b分别设定在80-95°的范围和5-40°的范围内。在基材8中，构件片8a和8b从形成在与氨基甲酸乙酯片2相粘合的表面侧的平面形状彼此相邻配置。当施加研磨压力时，以施加到研磨对象和研磨垫10之间的研磨粒子的压力产生，使抛光粒子易于移动。

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