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    • 14. 发明专利
    • MOUNTING STRUCTURE OF SEMICONDUCTOR MODULE
    • JPH01290287A
    • 1989-11-22
    • JP12086488
    • 1988-05-18
    • FUJITSU LTD
    • NAKAMURA KIYONORITANAKA MARI
    • H01L23/32H05K1/14H05K1/18H05K3/32
    • PURPOSE:To lower the mounting height and realize the size reduction by fitting a semiconductor module to a square hole provided in a printed wiring board. CONSTITUTION:Patterns are formed in parallel with each other over the upper surface and four side walls of a module board 2 and a semiconductor component 3 is surface-mounted on the upper surface to form a semiconductor module 1. A square hole 12 which is similar to the module board 2, is larger than that and the semiconductor module 1 is fitted to is provided at the required position in a printed wiring board 10. Spring terminals 15 are formed and connected to the ends of patterns on the printed wiring board 10 by soldering so that their contactor parts are arranged on the inner walls of the square hole 12. The semiconductor module 1 is fitted to the square hole 12 and the sidewall patterns of the respective patterns of the semiconductor module 1 are elastically brought into contact with the spring terminals 15. With this constitution, the mounting height of the semiconductor module 1 can be lowered and the thickness of a printed wiring board device can be reduced as a whole.
    • 15. 发明专利
    • CONTACT SPRING
    • JPS63294676A
    • 1988-12-01
    • JP12843587
    • 1987-05-27
    • FUJITSU LTD
    • NAKAMURA KIYONORI
    • H01R13/02
    • PURPOSE:To aim at reduction in cost by forming one end of plural pieces of contact springs being paralleled in the form connected to a connecting part solidly with plastics, and installing an electrical conducting part to be reached to the connecting part on a surface of the spring at each spring. CONSTITUTION:Plural pieces of contact springs 1 are aligned regularly, while the one end is formed in the form connected to a connecting part solidly with plastics, and an electrical conducting part 3 to be reached to the connecting part 2 is formed on one side of the spring 1. At time of its formation, a conductive pattern is formed in advance on a film base with a conductive material, then the film base is set in the inner part of a forming die and, after resin is poured and formed, the film base is separated from the molding. And, in the film base, anticorrosive metallic foil of Au plating or the like is formed in its part corresponding to a contact part 3a of the spring in advance and such one subjected to treatment for ease of soldering or the like in a connecting tab part 3b, respectively, and these parts are set up so as to correspond to each contact spring. With this constitution, reduction in manufacturing cost is contrivable.