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    • 15. 发明专利
    • LOCAL SOLDERING METHOD
    • JPH04111390A
    • 1992-04-13
    • JP22935690
    • 1990-08-30
    • FUJITSU LTD
    • HOSOYA KIMIOSHINJO MAMORUKUROKAWA TETSUO
    • H05K3/34H05K1/18H05K3/30
    • PURPOSE:To correctly solder a lead to a pad on a printed-circuit board by a method wherein the lead of an IC package is positioned to the pad on the printed-circuit board simultaneously with a local soldering operation. CONSTITUTION:Positions of leads 1A of an IC package 1 are positioned accurately to pads 3 on a printed-circuit board 2 by using a positioning means 10. (e.g. the dislocation in the x-axis direction and the dislocation in the y-axis direction of the center of the leads 1A from the center of the pads 3 are adjusted to be respectively '0'). Simultaneously with their positioning operations, the leads 1A of the IC package 1 are soldered to the pads 3 on the printed-circuit board 2 by using soldering means 20. Thereby, the IC package 1 can be mounted without causing its dislocation. In the figure, two split pins 1B are installed at both ends on a diagonal line of the IC package 1, and holes 2A into which the split pins 1B are inserted are formed in the printed-circuit board 2. The split pins 1B are formed in such a way that their tips are made thin and that splits are formed at their tips. Regarding their size, e.g. the thickness of the split pins 1B is set at 2.0mm and the size of each groove of the split pins is set at 0.5mm. When the split pins 1B are inserted into the holes 2A, the split pins 1B are opened in the holes 2A and their gap to the holes 2A becomes nearly '0' and a positioning operation can be executed accurately.
    • 18. 发明专利
    • METHOD AND DEVICE FOR CONFIRMING CUT PATTERN OF PRINTED WIRING BOARD
    • JPH04196599A
    • 1992-07-16
    • JP32842990
    • 1990-11-28
    • FUJITSU LTD
    • ICHIHARA YASUHIROSHINJO MAMORU
    • B26D5/32H05K3/22
    • PURPOSE:To accurately confirm the cut state of the pattern of a printed wiring board by performing pattern cutting work by using a tool provided with a cutter having a structure composed of an insulating section crossing the central part of the cutter in the radial direction and conductive sections on both sides of the insulating section in a state where the probes of an oscilloscope are brought into contact with through holes on both sides of the cutting position of the pattern. CONSTITUTION:A cutter 12 is provided with an insulating section 13 crossing the central part of the cutter 12 in the radial direction and conductor sections 14 and 15 on both sides of the section 13. Probes 21 and 22 are brought into contact with through holes 7 and 8 on both sides of the cutting position P1 of a pattern 2 to be cut. Under such condition, the pattern 2 is cut from the position P1 by using a tool 11. When an insulating state changes to a conducted state, a transient phenomenon occurs and a voltage waveform 32 appears on an oscilloscope 20. It can be confirmed that the cutting of the pattern 2 is completed when the appearance of voltage waveforms 32 and 33 is visually conformed on the oscilloscope 20.
    • 19. 发明专利
    • METHOD AND APPARATUS FOR CONNECTING SIGNAL TERMINAL
    • JPH04127066A
    • 1992-04-28
    • JP24952390
    • 1990-09-18
    • FUJITSU LTD
    • SHINJO MAMORUICHIHARA YASUHIRO
    • G01R1/06G01R31/28H01R13/03H01R13/52H01R33/76
    • PURPOSE:To certainly connect a signal terminal to a tester by small pressing force by providing the terminal coming into contact with the lower part of the conductive liquid received in the hole bored in an insulator to pierce through the insulator. CONSTITUTION:Holes 41 not piercing through an insulator 40 are provided to the insulator 40 at the respective positions corresponding to the signal terminals 20 of a printed wiring board 10 and a conductive liquid 42 is injected in the holes 41 and a terminal 43 coming into contact with the lower part of the conductive liquid 42 at one end thereof and piercing through the insulator 40 at the other end thereof is provided to each of the holes 41. Further, the holes 41 are covered with plastic covers 44 for preventing the scattering of the liquid 42 when the terminals 20 are inserted in the holes 41. The terminals 20 are inserted in the holes 41 of a connection apparatus 40A (insulator 40) and output is taken out of the terminals 43 to be connected to a tester 30 by a cable 30A. At this time, since the terminals 20, 43 are connected through the liquid 42, they can be stably connected by small pressing force.
    • 20. 发明专利
    • STRUCTURE AND METHOD FOR MOUNTING OF SEMICONDUCTOR CHIP
    • JPH0472652A
    • 1992-03-06
    • JP21351790
    • 1990-08-10
    • FUJITSU LTD
    • TEJIMA YASUHIROSHINJO MAMORUMATSUBAYASHI AKINORI
    • H01L23/40H01L21/56
    • PURPOSE:To enhance a heat-dissipating property by a method wherein the edge of a shaft-shaped boss is fixed and bonded to the surface of a semiconductor chip via an adhesive, a heat-dissipating body is mounted on the semiconductor chip and the semiconductor chip is covered with a sealing agent. CONSTITUTION:A heat-dissipating body 10 is constituted of the following: a square-pillar shaft-shaped boss 11 on the surface pf a semiconductor chip 2; and two fins. The heat-dissipating body 10 is mounted on the chip 2 while the lower edge of the shaft-shaped boss is fixed and bonded to the surface of the chip 2 by using an adhesive 20. The mounting face between the lower- stage fins 12 and a circuit board 1 is filled with a sealing agent 6, and the semiconductor chip 2 is covered with the sealing agent 6. Thereby, heat of the chip 2 is conducted to the heat-dissipating body 10 and is released to the outside form the fins 12. That is to say, the heat-dissipating property of the semiconductor chip becomes good. Since the sealing agent 6 is filled into the mounting face between the fins 12 and the circuit board 1, a sealing moistureproof property becomes good.