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11. 发明专利

JP2014183214A Mounting structure, mounting method, and manufacturing method of capacitor element 审中-公开
标题翻译：电容元件的安装结构，安装方法和制造方法
公开(公告)号：JP2014183214A
公开(公告)日：2014-09-29
申请号：JP2013057019
申请日：2013-03-19
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , KATO SHUNICHI , TAKAGI KENJI
IPC分类号： H01G4/30 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/252 , H05K1/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of a capacitor element that allows reducing sound noise without impairing the degree of freedom of design.SOLUTION: A multilayer ceramic capacitor 10A has a substantially cuboid-shaped laminated body 11 composed of dielectric layers 12 and internal electrode layers 13, and first and second external electrodes 14a and 14b. A wiring substrate 2 has first and second lands 3a and 3b electrically connected to the first and second external electrodes 14a and 14b. The first and second external electrodes 14a and 14b include first and third corner portions 14a1 and 14b1 located on the wiring substrate 2 side, and second and fourth corner portions 14a2 and 14b2 located on the opposite side of the wiring substrate 2 side. The curvature radius of an external surface S1 of the first corner portion 14a1 is larger than that of an external surface S2 of the second corner portion 14a2, and the curvature radius of an external surface S3 of the third corner portion 14b1 is larger than that of an external surface S4 of the fourth corner portion 14b2.
摘要翻译：要解决的问题：提供一种电容器元件的安装结构，其可以在不损害设计自由度的情况下降低声音噪声。解决方案：多层陶瓷电容器10A具有基本上为长方体形的层叠体11，其由电介质层12和内部电极层13，以及第一和第二外部电极14a和14b。布线基板2具有与第一外部电极14a和第二外部电极14b电连接的第一和第二平台3a，3b。第一外部电极14a和第二外部电极14b包括位于布线基板2侧的第一和第三角部14a1和14b1，以及位于布线基板2侧的相对侧的第二和第四角部14a2和14b2。第一角部14a1的外表面S1的曲率半径大于第二角部14a2的外表面S2的曲率半径，第三角部14b1的外表面S3的曲率半径大于第四角部14b2的外表面S4。

12. 发明专利

JP2014049474A Quality evaluation device, quality evaluation method and substrate for evaluation 有权
标题翻译：质量评估设备，质量评估方法和评估基础
公开(公告)号：JP2014049474A
公开(公告)日：2014-03-17
申请号：JP2012188773
申请日：2012-08-29
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU , YAMADA TADATERU
IPC分类号： H01G13/00 , H01G2/06
CPC分类号： G01N29/04 , G01N29/14
摘要： PROBLEM TO BE SOLVED: To provide a quality evaluation device of multilayer capacitor capable of obtaining reliable evaluation results, and to provide a quality evaluation method and a substrate for evaluation.SOLUTION: A square substrate 100 for evaluation provided, in the center, with a mounting region A for mounting a multilayer capacitor 1 is fixed by a plurality of fixed parts 110, 111, 112, 113 provided at respective corners of equidistance from the mounting region A. A voltage is applied to the multilayer capacitor 1 mounted in the mounting region A of the substrate 100 for evaluation. Sound is collected by a microphone provided in the vicinity of the multilayer capacitor 1 mounted on the substrate 100 for evaluation.
摘要翻译：要解决的问题：提供能够获得可靠的评估结果的多层电容器的质量评估装置，并且提供用于评价的质量评估方法和基板。解决方案：用于评估的方形基板100在中心设置有用于安装多层电容器1的安装区域A由设置在与安装区域A等距离的各个角部的多个固定部分110,111,112,113固定。电压施加到安装在安装区域中的多层电容器1 A用于评估。通过设置在安装在基板100上的多层电容器1附近的麦克风收集声音，进行评价。

13. 发明专利

JP2014045055A Multilayer capacitor and multilayer capacitor mounting structure 审中-公开
标题翻译：多层电容器和多层电容器安装结构
公开(公告)号：JP2014045055A
公开(公告)日：2014-03-13
申请号：JP2012186175
申请日：2012-08-27
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G4/232 , H01G2/06 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a multilayer capacitor capable of reducing vibration sound, and a multilayer capacitor mounting structure.SOLUTION: A multilayer capacitor comprises: a laminate 10 formed by laminating an internal electrode and a dielectric layer alternately; and external electrodes 21 and 22 connected electrically with different internal electrodes, respectively. The external electrodes 21 and 22 have a bottom side external electrode, top surface side external electrodes 212 and 222, an end face side external electrode 223, first side surface side external electrodes 214 and 224, and a second side surface side external electrode 223. Strip protective films 31 and 32 are formed in the central part of the end face side external electrode 223, first side surface side external electrodes 214 and 224, and second side surface side external electrode of the external electrodes 21 and 22. Top surface protective films 333 and 334 are formed in the central part of the top surface side external electrodes 212 and 222. A bottom protective film is formed in the central part of the bottom surface side external electrode.
摘要翻译：要解决的问题：提供能够降低振动声音的层叠电容器和多层电容器安装结构。解决方案：层叠电容器包括：层叠体10，其通过交替层叠内部电极和电介质层而形成; 外部电极21和22分别与不同的内部电极电连接。外部电极21和22具有底侧外部电极，顶面侧外部电极212和222，端面侧外部电极223，第一侧面侧外部电极214和224以及第二侧面侧外部电极223。在端面侧外部电极223的中央部分，第一侧面外部电极214和224以及外部电极21和22的第二侧面外部电极上形成带状保护膜31,32。顶表面保护膜 333和334形成在顶表面侧外部电极212和222的中心部分。底部保护膜形成在底表面侧外部电极的中心部分。

14. 发明专利

JP2013038144A Chip component structure 有权
标题翻译：芯片组件结构
公开(公告)号：JP2013038144A
公开(公告)日：2013-02-21
申请号：JP2011171435
申请日：2011-08-05
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H01G4/30 , H05K1/18
CPC分类号： H01G4/30 , H01G2/065 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To realize a chip component structure which effectively cleans a clearance between an interposer and a circuit board after the interposer, equipped with a multilayer capacitor, is mounted on the circuit board.SOLUTION: A chip component structure 1 comprises an interposer 3 equipped with a multilayer capacitor 2. The interposer 3 comprises: a substrate 31; electrodes for component connection 32A, 32B; electrodes for external connection 33A, 33B; and side surface electrodes 34A, 34B. The electrodes for the component connection 32A, 32B are electrically connected with the electrodes for the external connection 33A, 33B through the side surface electrodes 34A, 34B. External electrodes of the multilayer capacitor 2 are joined to the electrodes for the component connection 32A, 32B. A communication hole 39B communicating spaces which are opened on both main surfaces and face each other is formed in the substrate 31.
摘要翻译：要解决的问题：为了实现在搭载有层叠电容器的插入件之后，有效地清洁插入件与电路板之间的间隙的芯片部件结构，安装在电路板上。解决方案：芯片部件结构1包括配备有多层电容器2的插入件3.插入件3包括：基板31; 用于部件连接的电极32A，32B; 用于外部连接的电极33A，33B; 和侧面电极34A，34B。用于部件连接件32A，32B的电极通过侧表面电极34A，34B与用于外部连接件33A，33B的电极电连接。层叠电容器2的外部电极与部件连接用电极32A，32B的电极接合。在基板31中形成有在两个主表面上彼此敞开的连通空间的连通孔39B。（C）2013，JPO＆INPIT

15. 发明专利

JP2012212944A Chip component structure 有权
标题翻译：芯片组件结构
公开(公告)号：JP2012212944A
公开(公告)日：2012-11-01
申请号：JP2012173743
申请日：2012-08-06
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06
摘要： PROBLEM TO BE SOLVED: To realize a chip component structure which enables simple structure and easy mounting, has adequate mounting strength and electric characteristics, and suppresses the occurence of vibration sound.SOLUTION: A lamination ceramic capacitor 20 has a structure formed by laminating a predetermined number of plate like internal electrodes 200. An interposer 30 includes an insulation substrate 31 wider than the outer shape of the lamination ceramic capacitor 20. Electrodes for first mounting 321 and 331 are formed on a first main surface of the insulation substrate 31 for mounting the lamination ceramic capacitor 20, and electrodes for first external connection 322 and 332 are formed on a second main surface for connecting with an external circuit board 90. The lamination ceramic capacitor 20 is mounted on the interposer 30 so that main surfaces of the internal electrodes 200 are arranged parallel to a main surface of the interposer 30, i.e., the first main surface and the second main surfaces of the insulation substrate 31.
摘要翻译：要解决的问题：为了实现结构简单，安装方便的芯片部件结构，具有足够的安装强度和电气特性，并且抑制振动声的发生。层叠陶瓷电容器20具有通过层叠预定数量的板状内部电极200而形成的结构。插入件30包括比层叠陶瓷电容器20的外部形状宽的绝缘基板31.第一安装用电极 321和331形成在用于安装层压陶瓷电容器20的绝缘基板31的第一主表面上，并且用于第一外部连接322和332的电极形成在用于与外部电路板90连接的第二主表面上。层叠陶瓷电容器20安装在插入器30上，使得内部电极200的主表面平行于中介层30的主表面，即绝缘基板31的第一主表面和第二主表面。版权所有（C）2013，JPO＆INPIT

16. 发明专利

JP2012204572A Chip component structure 有权
标题翻译：芯片组件结构
公开(公告)号：JP2012204572A
公开(公告)日：2012-10-22
申请号：JP2011067181
申请日：2011-03-25
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H05K1/18
CPC分类号： H01G4/12 , H01G2/06 , H01G4/01 , H01G4/224 , H01G4/30 , H05K1/0271 , H05K1/141 , H05K1/181 , H05K3/3442 , H05K2201/041 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/611
摘要： PROBLEM TO BE SOLVED: To provide a simple and easy-to-mount chip component structure having necessary and sufficient mounting strength and electrical characteristics, and capable of suppressing generation of vibration sound.SOLUTION: A multilayer ceramic capacitor 20 has a structure where a predetermined number of layers of a planar internal electrode 200 are laminated. An interposer 30 includes an insulating substrate 31 wider than the contour of the multilayer ceramic capacitor 20. First mounting electrodes 321 and 331 for mounting the multilayer ceramic capacitor 20 are formed on the first principal surface of the insulating substrate 31, and a first external connection electrode 332 for connection with an external circuit board 90 is formed on the second principal surface. The multilayer ceramic capacitor 20 is mounted on the interposer 30 so that the principal surface of the internal electrode 200 will be parallel with the principal surface of the interposer 30, i.e. the first and second principal surfaces of the insulating substrate 31.
摘要翻译：要解决的问题：提供具有必要且足够的安装强度和电气特性并且能够抑制振动声产生的简单且易于安装的芯片部件结构。解决方案：多层陶瓷电容器20具有其中层叠有预定数量的平面内部电极200的层的结构。插入器30包括比多层陶瓷电容器20的轮廓宽的绝缘基板31.安装多层陶瓷电容器20的第一安装电极321和331形成在绝缘基板31的第一主表面上，并且第一外部连接用于与外部电路板90连接的电极332形成在第二主表面上。多层陶瓷电容器20安装在插入件30上，使得内部电极200的主表面将与绝缘基板31的第一和第二主表面平行于插入件30的主表面。（C）2013，JPO＆INPIT

17. 发明专利

JP2014199912A 積層コンデンサ有权
标题翻译：多层电容器
公开(公告)号：JP2014199912A
公开(公告)日：2014-10-23
申请号：JP2013268295
申请日：2013-12-26
申请人：株式会社村田製作所 , Murata Mfg Co Ltd
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G4/30 , H01G4/12 , H01G4/232
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/232
摘要：【課題】回路設計に高い自由度を得つつ、可聴音を低減すること。【解決手段】複数の誘電体層を積層してなる直方体形状をなす積層体10と、該積層体の内部に配置された複数のコンデンサ電極11,12と、積層体の少なくとも一面に配置された外部電極15,16とを備えた積層コンデンサ。電極11,12は積層体の第1面及び第2面に対して垂直方向に配置されており、電極11は誘電体層を挟んで電極12と対向する容量部11aと、外部電極15と接続された引出し部11bと、電極12と対向しない中間部11cとを有し、電極12は誘電体層を挟んで電極11と対向する容量部12aと、外部電極16と接続された引出し部12bとを有している。積層方向から見て、引出し部11bの内側露出端部と引出し部12bの内側露出端部を積層体の第1面と第2面とを結ぶ方向に延在する仮想線α1,α2と、容量部11a,12aと第1面とによって囲われるギャップ領域GAに中間部11cが配置されている。【選択図】図5
摘要翻译：要解决的问题：在获得电路设计中的高自由度的同时减少可听见的声音。解决方案：提供一种层叠电容器，包括：叠层体10，其构成长方体形状并通过层叠多个电介质层而形成; 设置在层叠体内的多个电容电极11,12; 以及设置在层叠体的至少一个表面上的外部电极15,16。电极11,12相对于层叠体的第一和第二表面在垂直方向设置，电极11具有跨过电介质层的与电极12相对的电容部11a，与该电极11连接的引出部11b 外部电极15和不面向电极12的中间部分11c，电极12具有跨过电介质层的与电极11相对的电容部分12a和连接到外部电极16的引出部分12b。中间部分11c是设置在由连接引出部分11b的内部暴露端部和引出部分12b的内部暴露端部的方向上延伸的虚拟线α1，α2所包围的间隙区域GA中的第一表面和第二表面层叠体，电容部11a，12a和第一面。

18. 发明专利

JP2014099589A Method of manufacturing mounting substrate on which multilayer ceramic capacitors are mounted and mounting structure body 审中-公开
标题翻译：制造多层陶瓷电容器安装和安装结构体的安装基板的方法
公开(公告)号：JP2014099589A
公开(公告)日：2014-05-29
申请号：JP2013134914
申请日：2013-06-27
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU , SHIRAIWA NORIO
IPC分类号： H01G2/06 , H05K1/18
CPC分类号： H05K1/181 , H01G2/065 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/303 , H05K3/3415 , H05K3/3442 , H05K2201/10015 , H05K2201/10545 , H05K2201/2045 , Y02P70/611 , Y02P70/613 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To efficiently suppress the vibration sound of a circuit board due to the electric-field induced distortion of a multilayer ceramic capacitor.SOLUTION: A method of manufacturing a mounting substrate is provided in which a pair of multilayer ceramic capacitors 1, each having a laminated body 2 in which a plurality of dielectric ceramic sheets and a plurality of planar internal electrodes 5 are stacked and at least a pair of external electrodes 6 formed on surfaces of the laminated body 2 and electrically connected to the internal electrodes 5, are mounted on a circuit board 10. The method includes the step of bonding the external electrodes 6 to each of lands 11 and 12 formed at plane-symmetrical positions on front and rear surfaces of the circuit board 10 with electrically connected to each other so that a surface orientation of flat surfaces of the internal electrodes 5 are matched.
摘要翻译：要解决的问题：为了有效地抑制由于多层陶瓷电容器的电场诱导失真引起的电路板的振动声音。解决方案：提供一种制造安装基板的方法，其中一对多层陶瓷电容器1，每个层叠体层叠有多个介电陶瓷片和多个平面内部电极5以及形成在层叠体2的表面上并电连接到内部电极5的至少一对外部电极6的层叠体2，安装在电路板10上。该方法包括将外部电极6接合到电路板10的前表面和后表面上的平面对称位置处形成的每个焊盘11和12彼此电连接的步骤，使得内部电极5的平坦表面的表面取向相匹配。

19. 发明专利

JP2014036169A Multilayer capacitor and vibration sound reduction method of circuit board 有权
标题翻译：多层电容器和电路板振动减振方法
公开(公告)号：JP2014036169A
公开(公告)日：2014-02-24
申请号：JP2012177638
申请日：2012-08-10
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G4/30 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To obtain a multilayer capacitor in which generation of vibration sound can be suppressed, without using a separate component for mounting the multilayer capacitor on a circuit board.SOLUTION: A multilayer capacitor 10 comprises a rectangular parallelepiped element 11. The element 11 is formed by laminating a dielectric layer and an internal electrode 100 alternately. A first external electrode 21 is formed near the center of the element 11 in the longitudinal direction of a first longitudinal direction side face 113. A second external electrode 22 is formed near the center of the element 11 in the longitudinal direction of a second longitudinal direction side face 114. The length LD of the first and second external electrodes 21 and 22 in the longitudinal direction is about 0.2-0.5 times, preferably about 0.4 times, of the length LC of the element 11 in the longitudinal direction.
摘要翻译：要解决的问题：为了获得可以抑制振动声的产生的层叠电容器，而不需要在电路板上安装多层电容器的单独部件。解决方案：层叠电容器10包括长方体11。元件 11是通过交替层叠电介质层和内部电极100而形成的。第一外部电极21形成在第一纵向侧面113的长度方向上的元件11的中央附近。第二外部电极22形成在元件11的中心附近，沿着第二长度方向的长度方向第一外部电极21和第二外部电极22的长度方向的长度LD在元件11的长度方向上的长度LC为约0.2-0.5倍，优选约0.4倍。

20. 发明专利

JP2013235928A Ceramic electronic component and electronic device 有权
标题翻译：陶瓷电子元件和电子器件
公开(公告)号：JP2013235928A
公开(公告)日：2013-11-21
申请号：JP2012106820
申请日：2012-05-08
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G4/232 , H01G4/12 , H01G4/30
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To provide a ceramic electronic component capable of suppressing a squeal.SOLUTION: A protective layer 15a is disposed on a portion positioned on a first side face 10e of a first external electrode 13. The protective layer 15a exposes at least a part of portion positioned on a first principle plane 10a of the first external electrode 13. A surface layer of a protective layer 15a side of the portion positioned on the first side face 10e of the first external electrode 13 is composed of a material having a melting point higher than that of a solder 16a.
摘要翻译：要解决的问题：提供能够抑制尖叫的陶瓷电子部件。解决方案：保护层15a设置在位于第一外部电极13的第一侧面10e上的部分上。保护层15a暴露至少一个位于第一外部电极13的第一主面10a上的部分部分。位于第一外部电极13的第一侧面10e上的部分的保护层15a侧的表面层由具有熔化的材料高于焊料16a的点。

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