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11. 发明专利

JP2011124443A Method of manufacturing semiconductor photonic device 审中-公开
标题翻译：制造半导体光电器件的方法
公开(公告)号：JP2011124443A
公开(公告)日：2011-06-23
申请号：JP2009282007
申请日：2009-12-11
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： NAKAMURA ATSUSHI , YASUHARA NOZOMI , YAMAMOTO HIROSHI , MUKAIKUBO MASARU
IPC分类号： H01S5/343 , H01S5/22
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor photonic device including a quantum well structure for achieving characteristic improvement.
SOLUTION: This method of manufacturing a semiconductor photonic device includes processes of: determining distortion amounts and layer thicknesses of respective layers located in lower sides relative to first height to set, to zero, cumulative distortion from an upper surface of a substrate to the first height located in a quantum well structure included in a multilayer structure out of the multilayer structure laminated on the substrate; and introducing respective distortions of the distortion amounts into the respective layers, and laminating the respective layers at the respective layer thicknesses.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种制造包括用于实现特征改进的量子阱结构的半导体光子器件的方法。解决方案：制造半导体光子器件的该方法包括以下处理：确定相对于第一高度位于下侧的各层的失真量和层厚度，以将从衬底的上表面到所述第一高度位于层叠在所述基板上的所述多层结构中的多层结构中的量子阱结构中; 并将各个失真量的失真引入到各个层中，并且以相应的层厚层叠各个层。版权所有（C）2011，JPO＆INPIT

12. 发明专利

JP2011124388A Optical device and method of manufacturing the same 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：JP2011124388A
公开(公告)日：2011-06-23
申请号：JP2009280936
申请日：2009-12-10
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： HAMADA HIROSHI , HIRATAKA TOSHINORI , WASHINO TAKASHI , TOYONAKA TAKASHI , DOMEN MEGUMI
IPC分类号： H01L31/107
摘要： PROBLEM TO BE SOLVED: To prevent a film of an optical device from peeling. SOLUTION: The optical device includes a substrate 101, a light emission portion or light reception portion 122 formed on a first surface 120 of the substrate 101, and an antireflection film 115 formed on a second surface 124 of the substrate 101 on the opposite side from the first surface 120 and having lower light reflectivity than a surface of the substrate 101. On the second surface 124, a groove 116 is formed which surrounds a region opposed to the light emission portion or light reception portion 122. The antireflection film 115 is formed continuously in contact with the region surrounded with the groove 116, the inside of the groove 116, and the outside of the groove 116. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：防止光学装置的膜剥离。解决方案：光学器件包括形成在基板101的第一表面120上的基板101，发光部分或光接收部分122以及形成在基板101的第二表面124上的抗反射膜115 与第一表面120相反一侧并且具有比基板101的表面更低的光反射率。在第二表面124上形成有围绕与发光部分或光接收部分122相对的区域的凹槽116.防反射膜 115与凹槽116，凹槽116的内部和凹槽116的外侧连续地形成区域。（C）2011，JPO和INPIT

13. 发明专利

JP2011086714A Wavelength tunable laser 审中-公开
标题翻译：波长能激光
公开(公告)号：JP2011086714A
公开(公告)日：2011-04-28
申请号：JP2009237290
申请日：2009-10-14
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ARIMOTO HIDEO , SUZUKI TAKAYOSHI , OTOSHI SO
IPC分类号： H01S5/14 , H01S5/125
摘要： PROBLEM TO BE SOLVED: To prevent the increase of components even in a wavelength tunable laser using a wavelength selection filter having a sub-peak in addition to a main peak, and also to achieve stable single-mode oscillation, even in a transmission-type wavelength selection filter or a reflection-type wavelength selection filter.
SOLUTION: The wavelength selection filter is integrated in a gain chip, so as to select only the main peak. Thus, the stable single-mode oscillation is achieved.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在使用除了主峰之外具有次峰的波长选择滤波器的波长可调激光器中，即使在一个波长可调激光器中也能实现稳定的单模振荡，即使在透射型波长选择滤波器或反射型波长选择滤波器。
解决方案：波长选择滤波器集成在增益芯片中，仅选择主峰。因此，实现了稳定的单模振荡。版权所有（C）2011，JPO＆INPIT

14. 发明专利

JP2011054667A Photo-receiving module and photo-detector 有权
标题翻译：摄影模块和摄影机
公开(公告)号：JP2011054667A
公开(公告)日：2011-03-17
申请号：JP2009200507
申请日：2009-08-31
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： YOKOZAWA MASATAKA , SASADA MICHIHIDE , YAMAMOTO HIROSHI
IPC分类号： H01L31/02 , H01L31/10 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/67 , H04B10/69
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of improving frequency characteristics without damaging assembling workability in a light-receiving module. SOLUTION: A base of a light-receiving module includes a stepped part connecting a lower-stage surface, a rising surface and an upper-stage surface in this order, and a width of a top face is shorter than that of an underside and film wiring for a reference voltage arranged extensively over the top face and a front and wiring for a signal voltage are positioned in a carrier disposing a photo-detector. The carrier is arranged along the lower-stage surface and the rising surface and a preamplifier is disposed on the upper-stage surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够改善频率特性而不损害光接收模块中的组装可操作性的技术。解决方案：光接收模块的基座包括依次连接下级表面，上升表面和上级表面的阶梯部分，并且顶面的宽度比用于参考电压的底面和薄膜布线，其布置在顶面上，前端和信号电压的布线位于布置光检测器的载体中。载体沿着下层表面和上升表面布置，并且前置放大器设置在上级表面上。版权所有（C）2011，JPO＆INPIT

15. 发明专利

JP2011003781A Optical output device 有权
标题翻译：光输出设备
公开(公告)号：JP2011003781A
公开(公告)日：2011-01-06
申请号：JP2009146524
申请日：2009-06-19
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： NAGOYA KAZUTAKA , MOTOSAWA YOICHI , NAKAO TAKAYUKI , SAGARA KOHEI
IPC分类号： H01S5/0687
摘要： PROBLEM TO BE SOLVED: To surely tune wavelength of laser beam to objective wavelength, in an optical output device with variable wavelength of the laser beam.SOLUTION: In the optical output device (31), an electric current is applied to a laser element x chosen from laser elements in a laser array (33). The temperature of the laser element x is adjusted to a reference temperature relevant to the laser element x. When the temperature of the laser element x reaches the reference temperature by temperature control, the temperature of the laser element x is adjusted, so that the wavelength of the laser beam becomes an objective wavelength corresponding to the laser element x, based on a result of comparison between powers of the laser beams before and after transmitting an optical filter (40). When a laser element y is chosen, the temperature of the laser element y is adjusted, so as to become a reference temperature relevant to the laser element y, which is corrected based on the temperature of the laser element x when the temperature control towards the reference temperature is performed, and the reference temperature relevant to the laser element x.
摘要翻译：要解决的问题：在具有可变波长的激光束的光输出装置中，确定将激光束的波长调谐到目标波长。解决方案：在光输出装置（31）中，向激光元件x施加电流选自激光器阵列中的激光元件（33）。激光元件x的温度被调节到与激光元件x相关的参考温度。当激光元件x的温度通过温度控制达到参考温度时，调节激光元件x的温度，使得激光束的波长根据激光元件x的结果变为对应于激光元件x的物镜波长在发送光学滤波器（40）之前和之后激光束的功率之间的比较。当选择激光元件y时，调整激光元件y的温度，以便成为与激光元件y相关的参考温度，该温度基于激光元件x的温度被校正时，当朝向执行参考温度，以及与激光元件x相关的参考温度。

16. 发明专利

JP2011003638A Photodetector 有权
标题翻译：光电探测器
公开(公告)号：JP2011003638A
公开(公告)日：2011-01-06
申请号：JP2009144115
申请日：2009-06-17
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： RI EIKON , NAGATSUMA KAZUYUKI
IPC分类号： H01L31/10
摘要： PROBLEM TO BE SOLVED: To provide a face type photo-diode having a high sensibility at a high speed.SOLUTION: In a reflector composed of a metallic film for an electrode and a dielectric multilayer film, the reflection factor of the mirror is improved by optimizing the dielectric film so as to keep identical the phases of reflected lights from the dielectric multilayer film and the metallic film. The increases of the speed and sensibility of the face type photo-diode are made to coexist by using the high reflector.
摘要翻译：要解决的问题：提供高速度的高感光度的面型光电二极管。解决方案：在由电极用金属膜和电介质多层膜构成的反射镜中，反射镜的反射系数由优化电介质膜以使反射光的相位与电介质多层膜和金属膜保持相同。通过使用高反射体使面型光电二极管的速度和灵敏度的增加共存。

17. 发明专利

JP2010245207A Multi-beam semiconductor laser device 有权
标题翻译：多光子半导体激光器件
公开(公告)号：JP2010245207A
公开(公告)日：2010-10-28
申请号：JP2009090716
申请日：2009-04-03
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： IGA YOSHIHIKO , MORIYA HIROSHI , INOUE HIROTAKA , HARA HIDEKI , MIYAUCHI KEIICHI
IPC分类号： H01S5/022 , H01S5/042
CPC分类号： H01S5/4031 , H01S5/0224 , H01S5/02272 , H01S5/024 , H01S5/02476 , H01S5/0425
摘要： PROBLEM TO BE SOLVED: To provide a multi-beam semiconductor laser device that uniforms characteristics of beams from respective laser elements by improving heat dissipation and reducing thermal stress generated after mounting. SOLUTION: Within a semiconductor laser device having a semiconductor laser element array of multi-beam structure mounted on a sub-mount, the semiconductor laser element array of multi-beam structure includes: one piece of a semiconductor substrate 11; a common electrode 1, which is formed on one surface of the semiconductor substrate; a semiconductor layer 2, which is formed on the other surface of the semiconductor substrate, and includes a plurality of light emitting portions 7 within an inside thereof; a plurality of anode electrodes 3 of a second conductivity type, which are formed above the plurality of light emitting portions, respectively; and a supporting portion 25, which is provided outside a region of forming the light emitting portions, wherein to one surface of the sub-mount is connected an electrode 3 of the semiconductor laser element array through a solder 4, and that solder 4 is formed to cover a supporting portion and an electrode neighboring thereto, and further on the electrode 3 is formed a groove portion 9 between the neighboring supporting portion 25 and the light emitting portions 7. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过改善散热并降低安装后产生的热应力来均匀来自各个激光元件的光束的特性的多光束半导体激光器件。解决方案：在具有安装在子座上的多光束结构的半导体激光元件阵列的半导体激光器件中，多光束结构的半导体激光元件阵列包括：一片半导体衬底11; 公共电极1，其形成在半导体衬底的一个表面上; 半导体层2，其形成在半导体衬底的另一个表面上，并且在其内部包括多个发光部分7; 分别形成在多个发光部分上方的多个第二导电类型的阳极电极3; 以及支撑部25，其设置在形成发光部的区域的外侧，其中，通过焊料4将半导体激光元件阵列的电极3与副安装座的一个面连接，形成焊料4 覆盖支撑部分和与其相邻的电极，并且还在电极3上形成在相邻的支撑部分25和发光部分7之间的槽部分9.版权所有（C）2011，JPO＆INPIT

18. 发明专利

JP2010211164A Optical transmission module 审中-公开
标题翻译：光传输模块
公开(公告)号：JP2010211164A
公开(公告)日：2010-09-24
申请号：JP2009060226
申请日：2009-03-12
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： SHISHIKURA MASATO , KATO TETSUYA , ARIMA HIROYUKI , SUZUKI HITOSHI , TAKAMATSU SHOJI
IPC分类号： G02B6/42 , H01S5/50
摘要： PROBLEM TO BE SOLVED: To provide an optical transmission module in which the transmission quality of an optical signal is easily ensured regardless the wavelength intervals of the light emitted from respective lasers.
SOLUTION: The optical transmission module 1 includes: a first semiconductor laser 22-1 which emits light having a first wavelength; a second semiconductor laser 22-2 which emits light having a second wavelength; and an optical filter 31-1. The optical filter 31-1 reflects the light having the first wavelength in a first polarization direction and transmits the light having the second wavelength in a second polarization direction. At least a portion of the light emitted from the first semiconductor laser 22-1 is made incident to the optical filter 31-1 in the first polarization direction and at least a portion of the light emitted from the second semiconductor laser 22-2 is made incident to the optical filter 31-1 in the second polarization direction.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种光传输模块，其中光信号的传输质量容易确保，而不管从各个激光器发射的光的波长间隔如何。光传输模块1包括：发射具有第一波长的光的第一半导体激光器22-1; 发射具有第二波长的光的第二半导体激光器22-2; 和滤光器31-1。滤光器31-1以第一偏振方向反射具有第一波长的光，并将第二波长的光透射在第二偏振方向。从第一半导体激光器22-1发射的光的至少一部分在第一偏振方向入射到滤光器31-1，并且使从第二半导体激光器22-2发射的光的至少一部分在第二偏振方向入射到滤光器31-1。版权所有（C）2010，JPO＆INPIT

19. 发明专利

JP2010141089A Optical receiving module, and method of manufacturing the same 有权
标题翻译：光接收模块及其制造方法
公开(公告)号：JP2010141089A
公开(公告)日：2010-06-24
申请号：JP2008315422
申请日：2008-12-11
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： TAKAMATSU SHOJI , SASADA MICHIHIDE
IPC分类号： H01L31/0232 , G02B6/42 , H01L21/52 , H01L31/02
CPC分类号： G02B6/4203 , H01L2224/48091 , Y10T29/49826 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an optical receiving module and a method of manufacturing the same capable of suppressing increase of amount of reflection return light incoming to an optical fiber and which is caused by tolerance of an angle at manufacturing with ensuring light receiving efficiency. SOLUTION: An optical receiving module has a light receiving element 10 and a sub-mount 20 supporting the light receiving element 10. The light receiving element 10 is arranged with being shifted from a position on a light axis of an optical fiber. The light receiving element 10 is arranged so that a direction of a crossing side where a stretching direction of a side among a plurality of sides included in a surface of the sub-mount 20 side of the light receiving element 10 crosses a region surrounded by a line corresponding to a direction of incoming light, a line corresponding to a direction of the light axis of the optical fiber, and a supporting surface that supports the light receiving element of a supporting member, corresponds to a direction different from a direction orthogonal to the light incoming direction. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种光接收模块及其制造方法，该光接收模块及其制造方法能够抑制入射到光纤的反射返回光量的增加，并且由制造中的角度的公差确保光接收效率。解决方案：光接收模块具有光接收元件10和支撑光接收元件10的子座20.光接收元件10布置成从光纤的光轴上的位置偏移。光接收元件10被布置成使得包含在光接收元件10的副底座20侧的表面中的多个侧面中的一侧的拉伸方向的交叉侧的方向与由对应于入射光的方向的线，对应于光纤的光轴的方向的线和支撑支撑构件的光接收元件的支撑表面对应于与正交于光纤的方向不同的方向光线方向。版权所有（C）2010，JPO＆INPIT

20. 发明专利

JP2010109191A Connector and electronic device 审中-公开
标题翻译：连接器和电子设备
公开(公告)号：JP2010109191A
公开(公告)日：2010-05-13
申请号：JP2008280397
申请日：2008-10-30
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： HATANO OSAMU , ISHII HIROYOSHI
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a connector and an electronic device which is formed by laminating a plurality of printed substrates, can reduce a possibility of terminal dropping.
SOLUTION: In the connector, a plurality of pieces of conductor wiring extending from the edge of a substrate 10 are formed on each of both surfaces of the substrate 10. Each of the conductor wiring includes a terminal contact part 12a contacting with a terminal which a mating connector has, and a connection part for electrically connecting the terminal contact part 12a to an external apparatus. The terminal contact part 12a contained in the conductor wiring formed on a surface 10c which is the rear side of the substrate 10 is formed wider than the terminal contact part 12a contained in the conductor wiring formed on a surface 10b which is the front side of the substrate 10.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供通过层叠多个印刷基板形成的连接器和电子装置，可以减少端子掉落的可能性。解决方案：在连接器中，从基板10的边缘延伸的多条导体布线形成在基板10的两个表面中的每一个上。每个导体布线包括接触部分12a的端子接触部分12a 端子接触部12a与外部设备电连接的连接部。包含在形成在基板10的后侧的表面10c上的导体布线中的端子接触部分12a形成为比包含在形成在作为该基板10的前侧的表面10b的导体布线中的端子接触部分12a 底物10.版权所有（C）2010，JPO＆INPIT

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