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161. 发明专利

JPH06302981A ELECTRONIC EQUIPMENT COOLING STRUCTURE 失效
公开(公告)号：JPH06302981A
公开(公告)日：1994-10-28
申请号：JP8586893
申请日：1993-04-13
申请人： HITACHI LTD
发明人： KOMATSU TOSHIHIRO , MATSUSHIMA HITOSHI , HATADA TOSHIO , IWAI SUSUMU , HONMA TETSURO , KONDO YOSHIHIRO
IPC分类号： H01L23/467 , H05K7/20
摘要： PURPOSE:To cool a plurality of electronic circuit boards mounted with elements which locally generate large quantities of heat in a centralized state at a high cooling efficiency by aligning the centers of slit-like openings with the centers of the circuit boards and making the widths of the slit-like openings wider than those of guide rails. CONSTITUTION:By using a duct structure 8 having a plurality of slit-like openings, semiconductor elements are effectively cooled in an enclosure. In addition, in order to cope with the unbalance between the heat generating quantities of a memory 4, etc., mounted on substrates 1, the shapes of the slits 10 of the duct 8 are changed and, in order to make the temperature distribution of the memory 4, etc., uniform, a cooling fan 9 is mounted on the duct 8 or the duct 8 is constituted in a removable state against the enclosure. Therefore, the plurality of substrates 1 can be simultaneously cooled. Moreover, when the duct 8 is removably housed in the enclosure, a cooling system which is useful for mounting can be obtained. Furthermore, when the shapes of the slits are changed from each other so that different cooling winds can be blown upon the semiconductor elements which locally generate large quantities of heat, the semiconductor elements can be cooled to a uniform temperature.

162. 发明专利

JPH06214067A COOLING DEVICE 失效
公开(公告)号：JPH06214067A
公开(公告)日：1994-08-05
申请号：JP385993
申请日：1993-01-13
申请人： HITACHI LTD
发明人： YOSHITOMI YUJI , SATO KAZUO , TANAKA SHINJI , HARADA TAKESHI , HATADA TOSHIO
IPC分类号： G12B15/06 , F28D20/02 , H01L23/42
摘要： PURPOSE:To provide a convenient cooling device capable of efficiently cooling an electronic circuit element constituting an electronic equipment. CONSTITUTION:A cooling device 3 formed of a package 3a having a latent heat accumulating material 3b sealed therein is thermally brought into contact with an electronic circuit element 2, and the heat generated in the electronic circuit element 2 is transferred to the latent heat accumulating material 3b, and regenerated as a latent heat at state change from solid to liquid, whereby the electronic circuit element 2 is cooled. Since the electronic circuit element can be cooled by a thin cooling device having the latent heat accumulating material packed, an electronic circuit base can be mounted at high density, and the electronic equipment can be thinned.

163. 发明专利

JPH06196887A HEAT SINK, ELECTRONIC DEVICE, AND COMPUTER 失效
公开(公告)号：JPH06196887A
公开(公告)日：1994-07-15
申请号：JP22984793
申请日：1993-09-16
申请人： HITACHI LTD
发明人： SHIN TAKAYUKI , TANAKA TETSUYA , HATADA TOSHIO , KAWASAKI NOBUO , IINO TOSHIYOSHI , OGURO TAKAHIRO , TSUKAGUCHI TAMOTSU , KASAI KENICHI
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
摘要： PURPOSE:To provide a low-noise, cooling structure for semiconductor devices, in which the resistance to flow of coolant is reduced to improve cooling efficiency even when semiconductor devices are densely mounted. CONSTITUTION:Nozzles 23 are provided above heat sinks 22 on the top of semiconductor devices 21, which dissipate heat. The spacing between the nozzles, in the z-direction perpendicular to the x-direction of the supply and discharge of coolant to the heat sink, is greater than the width of the heat sink. The width of the nozzles in the x-direction is smaller than the width of the heat sink. Between adjacent nozzles 23 is provided a space 36 through which the coolant is discharged from the heat sinks.

164. 发明专利

JPH06125187A ELECTRONIC DEVICE 失效
公开(公告)号：JPH06125187A
公开(公告)日：1994-05-06
申请号：JP27398992
申请日：1992-10-13
申请人： HITACHI LTD
发明人： KONDO YOSHIHIRO , HATADA TOSHIO , MATSUSHIMA HITOSHI , KOMATSU TOSHIHIRO , YAMAZAKI SUSUMU , IINO TOSHIYOSHI , IWAI SUSUMU , HONMA TETSURO , YAMADA HIROSHI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H05K7/20 , G11B33/14
摘要： PURPOSE:To provide an electronic device which is improved in reliability by making the temperature distribution uniform inside the enclosure of the device and, at the same time, is reduced in noise from the enclosure as a whole. CONSTITUTION:In the enclosure 15 of the this device, a plurality of systems of flow passages are formed by providing partitions and cooling fans (through fans 14 and axial fans 20) are respectively installed to the flow passages. At the same time, the exits 26 of the flow passages are provided in the bottom and the cooling fans are positioned to the corners of the passages. In addition, the entrance section 41 of the enclosure 15 is constituted in a double structure so as to reduce noise to the outside.

165. 发明专利

JPH06112382A COOLING SYSTEM OF HEATING ELEMENT 失效
公开(公告)号：JPH06112382A
公开(公告)日：1994-04-22
申请号：JP26111892
申请日：1992-09-30
申请人： HITACHI LTD
发明人： OGURO TAKAHIRO , SHIN TAKAYUKI , KOBAYASHI FUMIYUKI , TSUKAGUCHI TAMOTSU , HATADA TOSHIO , KASAI KENICHI , HAYASHI YOSHITO
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
摘要： PURPOSE:To efficiently cool down the title heating elements generating heat in uniform temperature distribution by a method wherein the central part of a heat sink is provided with the through slits for vertically dividing fins. CONSTITUTION:Within a multichip module 1, many semiconductor devices 3 self-containing LSI chips as heating elements are mounted on a ceramic-made multilayer wiring substrate 2 to be sealed with a housing 4. The heat generated by the semiconductor devices 3 is conducted to the housing 4 through thermal conductive contactors 5 in contact with the semiconductor devices 3. A heat sink 6 for effectively conducting the generated heat to cooling fluid such as cooling air etc., is mounted on the housing 4 of the multichip module 1. The through slits 9 extending from the top surface of the heat sink 6 to the roots of many flat plate fins 7 for vertically dividing the same 7 are provided in the central parts of the heat sink 6. Through these procedures, the title heating element generating heat such as LSI etc., can be efficiently cooled down in uniform temperature distribution.

166. 发明专利

JPH06104584A COOLER FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH06104584A
公开(公告)日：1994-04-15
申请号：JP24037192
申请日：1992-09-09
申请人： HITACHI LTD
发明人： KUROSAKI HIDEKI , HARADA TAKESHI , KANAMARU MASATOSHI , OHASHI SHIGEO , KONO AKIOMI , SATO KAZUO , HATADA TOSHIO
IPC分类号： F25D1/00 , H01L23/467 , H05K7/20
摘要： PURPOSE:To allow cooling even if the air flow path is narrow and the flow path resistance is high by fixing a centrifugal cooling fan directly to an electronic component thereby increasing suction pressure and delivery pressure. CONSTITUTION:A centrifugal fan 10 and a drive motor 6 therefor are fixed directly to an electronic component 7 requiring cooling. The centrifugal fan 10 comprises a shaft 3 for coupling a runner 1 to the motor 6, and a casing having an appropriate inner flow path. Air 9 is sucked through suction ports 4 on the opposite sides of the casing 2 and flows in parallel with the shaft 3 into the fan and then blown out downward through a blow-out port 5 made in the lower side of the casing 2. Consequently, the centrifugal fan 10 produces high pressure difference between suction pressure and delivery pressure. Furthermore, suction and delivery air flow is increased resulting in sufficient cooling.

167. 发明专利

JPH064179A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH064179A
公开(公告)日：1994-01-14
申请号：JP15778792
申请日：1992-06-17
申请人： HITACHI LTD
发明人： ASHIWAKE NORIYUKI , NAKAJIMA TADAKATSU , SASAKI SHIGEYUKI , OSONE YASUO , HATADA TOSHIO , IINO TOSHIYOSHI , KASAI KENICHI
IPC分类号： G06F1/20
摘要： PURPOSE:To provide a semiconductor device in which maintenance work for a semiconductor module or a semiconductor element can be easily performed and impurity can be prevented from being mixed while the work is being performed, and furthermore, provided with cooling structure with high performance and high stability. CONSTITUTION:This device is comprised in such a way that the semiconductor module 6 of the semiconductor device, a cooling medium circulating pump 7, a cooling medium cooler 9, and a piping system 8 to connect them are made into a unit, and the cooling medium cooler 9 and the piping of cooling water supplied from the outside to the unit are formed attachably/detachably.

168. 发明专利

JPH05304379A 失效
公开(公告)号：JPH05304379A
公开(公告)日：1993-11-16
申请号：JP10825692
申请日：1992-04-28
申请人： HITACHI LTD
发明人： OHASHI SHIGEO , HATADA TOSHIO , HARADA TAKESHI , KUMAZAWA TETSUO , IWAI SUSUMU
IPC分类号： H01L23/467 , H05K7/20
摘要： PURPOSE:To uniformly cool a heat generating member such as a semiconductor element, etc., placed in a narrow space, and to efficiently fluidize the air raised at its temperature without staying in a housing. CONSTITUTION:A miniature fan 5 is provided near semiconductor elements 1, 2. Spaces are formed at an inlet side and an outlet side of the fan 5. Different surfaces of the spaces of the inlet side and outlet side of the fan 5 are opened 11, 12, and partitioning means for partitioning passages of the air to be input to the fan 5 and the air to be diffused is formed of a fan frame 9 and a frame member 10. Accordingly, the air to be diffused from the fan is not rounded about the inlet side of the fan, and an air introduction into a housing and an air flow into the housing are induced to uniformly cool the elements, etc.

169. 发明专利

JPH05190716A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05190716A
公开(公告)日：1993-07-30
申请号：JP169292
申请日：1992-01-08
申请人： HITACHI LTD
发明人： ASHIWAKE NORIYUKI , OGURO TAKAHIRO , HATSUDA TOSHIO , ZUSHI SHIZUO , NAKAJIMA TADAKATSU , HATADA TOSHIO , SASAKI SHIGEYUKI , INOUE KO
IPC分类号： H01L23/473
摘要： PURPOSE:To provide a semiconductor device which has cooling structure easy of individual inflow and outflow of cooling fluid and high in cooling capacity and excellent in reliability, concerning the cooling structure of a multichip module using a semiconductor chip high in heating density and manufacture thereof. CONSTITUTION:Many integrated circuit packages 4 are mounted on a ceramic multilayer substrate 2, and cooling jackets 5 are mounted on individual packages. Flexible pipes 11a are connected to individual jackets, and a nozzle 10 for letting cooling fluid flow into the cooling jacket as a jet is provided inside a flexible passage 1. A fin 12 and space 13 for returning the cooling fluid are provided inside the cooling jacket. Accordingly, water high in cooling capacity can be made use of for cooling fluid, and a plate-shaped fin easy of enlargement of heat conductive area can be used, and by a slit-shaped jet, cooling fluid can be supplied to each fin equally, so an excellent structure of semiconductor device can be provided.

170. 发明专利

JPH05166983A FLAT PLATE ARRAY HEAT SINK 失效
公开(公告)号：JPH05166983A
公开(公告)日：1993-07-02
申请号：JP33029991
申请日：1991-12-13
申请人： HITACHI LTD
发明人： KOMATSU TOSHIHIRO , HATADA TOSHIO , MATSUSHIMA HITOSHI , KONDO YOSHIHIRO
IPC分类号： H01L23/36 , H01L23/40
摘要： PURPOSE:To enable a flat plate array heat sink to cool down the inside of a computer case by a method wherein the internal heat released from an LSI chip or the like is transmitted enough to the flat plate array heat sink. CONSTITUTION:Considering the position of bolts 2, a flat plate array heat sink is so structured 2 as to enable the heat released from an LSI chip 6 to be transmitted enough to a case heat dissipating section and dissipated. The flat plate array heat sink 1 is previously deformed and the bolts 2 are fastened, whereby the heat sink is prevented from being deformed, and the heat sink 1 is so structured that the heat released from an LSI chip 6 is transmitted to the sink 1 to efficiently cool down the chip 6 the same as above.

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