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91. 实用新型

JPS476758U 失效
公开(公告)号：JPS476758U
公开(公告)日：1972-09-22
申请号：JP777871
申请日：1971-02-12
IPC分类号： F23Q3/00 , F23Q9/00 , H01L41/00 , H01L41/02 , H01L41/113 , H02N2/00 , H02N2/18

92. 发明专利

JP3118702B2 失效
公开(公告)号：JP3118702B2
公开(公告)日：2000-12-18
申请号：JP23992097
申请日：1997-09-04
IPC分类号： H01L21/8247 , G11C11/22 , H01L21/8242 , H01L21/8246 , H01L27/04 , H01L27/10 , H01L27/105 , H01L27/108 , H01L29/788 , H01L29/792 , H01L41/02

93. 发明专利

JPH0666655A RESONANCE PRESSURE SENSOR 失效
公开(公告)号：JPH0666655A
公开(公告)日：1994-03-11
申请号：JP10182492
申请日：1992-03-27
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： MITSUSHIERU DEYUFUURU
IPC分类号： G01L9/00 , H01L41/02
摘要： PURPOSE: To transmit only a pure compressive stress or tensile stress containing no bending moment to a resonator by optimizing the relative dimensions and the arrangement between the components of a conversion system and the resonator and the components of a rigid frame. CONSTITUTION: A pivot 22 is coupled through a hinge 26 with a rigid frame 24. A heel 20 is connected with the frame 24 through fins 28 made of thin strips. A flexible bending beam 18 couples the pivot 22 directly with the heel part 20. The pivot 22 is applied, at the end part thereof, with a pressure shown by an arrow F. The beam 18 is deformed by the pressure F into dome shape. The heal part 20 is designed to correct all residual bend at the inlet 30 of a resonator 16 in conjunction with the fins 28. The pivot 22, the beam 18 and the heel part 20 entirely absorb the bending moment and transmit the pressure F to the conversion systems 22, 18, 20. The resonator 16 composed only of a flat beam is transmitted only with a tensile or compressive pressure.

94. 发明专利

JPH05198858A CONDUCTOR PASTE MATERIAL FOR PIEZOELECTRIC ELEMENT AND ELECTRODE FOR PIEZOELECTRIC ELEMENT 失效
公开(公告)号：JPH05198858A
公开(公告)日：1993-08-06
申请号：JP829192
申请日：1992-01-21
申请人： TOYOTA MOTOR CORP
发明人： TERAI YOICHI
IPC分类号： H01L21/283 , C09D5/24 , H01B1/22 , H01L21/288 , H01L41/02 , H01L41/09
摘要： PURPOSE:To obtain an electrode for a piezoelectic element, at a low cost, which can make the piezoelectric element sufficiently exhibit essential electric characteristics. CONSTITUTION:Conductor paste material containing base metal (Al) particles 3 as matrix, and noble metal (Pd) particles 4 as additive wherein the particle diameter is smaller than that of the particle 3 and the specific gravity is large is spread on the surface of a piezoelectric element, and dried and baked after the element is left at rest in the horizontal state for a specified time. In a formed electrode 21 for the piezoelectric element, a lot of noble metal particles 4 gather and disperse on the interface to the piezoelectric element 1. Since excellent ohmic contact with the piezoelectric element 1 is ensured, polarization properties of the piezoelectric element 1 are improved.

95. 发明专利

JPH05190928A ELECTRONIC PARTS AND ITS MANUFACTURE 失效
公开(公告)号：JPH05190928A
公开(公告)日：1993-07-30
申请号：JP2185492
申请日：1992-01-10
申请人： TDK CORP
发明人： TANIGUCHI MASAAKI , KAIHARA NOBUO , IWATANI SHOICHI , SASAKI SATORU , NOHARA TAKATSUGU , HORI MAKOTO , TAKAHASHI TORU , KATO IKUO , KONNO HISAO
IPC分类号： H01L41/02 , H01L41/09 , H01L41/22
摘要： PURPOSE:To form the electrode of an electronic parts like a piezoelectric parts so as to have a uniform film thickness. CONSTITUTION:A substrate 2 composed of PZT sintered body is subjected to electroless plating, thereby forming electrodes 3, 4 in desired portions of the surface. By electroless plating as the wet system film forming technique, the electrodes 3, 4 of uniform film thickness can be formed in any part of the whole surface of the substrate. Hence it does not occur that the film thickness of the parts where the corner parts 2A, 2B, 2C, 2D of the substrate 2 form shadows becomes thin, as in the case of the conventional sputtering method.

96. 实用新型

JPH0328593Y2 失效
公开(公告)号：JPH0328593Y2
公开(公告)日：1991-06-19
申请号：JP11424581
申请日：1981-07-31
IPC分类号： H03H9/02 , H01L23/10 , H01L41/02 , H03H9/10

97. 发明专利

JPS631727B2 失效
公开(公告)号：JPS631727B2
公开(公告)日：1988-01-13
申请号：JP9293080
申请日：1980-07-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAGI HIROMITSU , SATO NORYA , OGAWA MAKOTO , PPONJO KATSUHIKO , KUGUHARA KUSUO , KURODA SHOJI , HASEGAWA KENICHI , HOASHI HIROYUKI
IPC分类号： H01C7/00 , H01C17/28 , H01G4/008 , H01G4/012 , H01G4/12 , H01L41/02 , H01L41/22

98. 发明专利

JPS6159755A Manufacture of electronic parts 失效
标题翻译：电子零件的制造
公开(公告)号：JPS6159755A
公开(公告)日：1986-03-27
申请号：JP18121884
申请日：1984-08-30
申请人： Tdk Corp
发明人： TAKAHASHI TORU , YAMASHITA YOSHINARI
IPC分类号： H01L23/02 , H01L23/00 , H01L41/02 , H01L41/04
CPC分类号： H01L41/053
摘要： PURPOSE:To curtail manufacturing process and realize cost down by simultaneously sealing an air release hole and engraving marks for pertinent electronic parts such as log numbers, product numbers, etc. through the sealing of air release hole by thermal engraving. CONSTITUTION:An aperture 101 is provided to the one side surface of a resin case 1, an electronic part element 2 such as a ceramic filter, etc. is inserted through this aperture 101 and thereafter a pack mold 3 is loaded to the aperture 101 and these are subjected to the heat processing in order to seal the aperture 101. In this case, the case 1 is formed by thermal dissolving resin and the air release hole 4 is sealed by thermal engraving of mark 6 concerning pertinent electronic part such as log number of product number, etc.
摘要翻译：目的：通过通过热雕刻密封空气释放孔，同时密封空气释放孔和相关电子部件（如原木数量，产品编号等）的雕刻痕迹，减少制造过程并实现成本降低。构成：在树脂外壳1的一个侧面设置有孔101，通过该孔101插入诸如陶瓷过滤器等的电子元件2，然后将包装模具3装载到孔101和为了密封孔101，对它们进行加热处理。在这种情况下，壳体1由热溶树脂形成，并且空气释放孔4通过对相关电子部件如对数的标记6的热雕刻进行密封的产品编号等

99. 发明专利

JPS6059751B2 失效
公开(公告)号：JPS6059751B2
公开(公告)日：1985-12-26
申请号：JP1290277
申请日：1977-02-08
申请人： HARII II EIN , BAARII BUROTSUKU
发明人： BAARII BUROTSUKU
IPC分类号： H01L29/84 , G01P15/08 , G01P15/12 , H01L41/02 , H04R23/00

100. 发明专利

JPS5945243B2 JPS5945243B2 - 失效
公开(公告)号：JPS5945243B2
公开(公告)日：1984-11-05
申请号：JP5116776
申请日：1976-05-04
申请人： Morio Onoe
发明人： ONOE MORIO
IPC分类号： H03H9/19 , H01L41/02

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