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    • 94. 发明专利
    • Manufacture of semiconductor device
    • 半导体器件的制造
    • JPS6136963A
    • 1986-02-21
    • JP15748984
    • 1984-07-30
    • Hitachi Ltd
    • JINRIKI HIROSHINISHIOKA TAIJOMUKAI KIICHIRO
    • H01L27/10H01G4/10H01L21/316H01L21/822H01L21/8242H01L27/04H01L27/108
    • H01L27/04
    • PURPOSE:To obtain a capacitor having large capacitance and a small area by heating a tantalum oxide formed through a chemical vapor phase growth method in a dried oxidizing atmosphere. CONSTITUTION:An element isolation region 2 is formed onto an Si substrate 1, and a tantalum oxide 3 is applied through a chemical vapor phase growth method. The whole is heated for 120min in a dried O2 atmosphere at 800 deg.C. A tungsten electrode 4 is shaped onto the tantalum oxide 3. Accordingly, when using the dried O2 atmosphere, SiO2 is difficult to be shaped on the interface between the tantalum oxide and Si, thus forming a capacitor having high permittivity. Leakage currents are reduced, and withstanding voltage is also increased.
    • 目的:通过在干燥的氧化气氛中加热通过化学气相生长法形成的氧化钽来获得具有大电容和小面积的电容器。 构成:在Si衬底1上形成元件隔离区2,通过化学气相生长法施加氧化钽3。 将整体在800℃的干燥的O 2气氛中加热120分钟。 钨电极4成形在氧化钽3上。因此,当使用干燥的O 2气氛时,难以在氧化钽和Si之间的界面上形成SiO 2,从而形成具有高介电常数的电容器。 泄漏电流降低,耐压也增加。
    • 97. 发明专利
    • CAPACITOR
    • JPS60152049A
    • 1985-08-10
    • JP711084
    • 1984-01-20
    • HITACHI LTD
    • SAKUMA NORIYUKINISHIOKA TAIJIYOUMUKAI KIICHIROU
    • H01G4/10H01L21/822H01L27/04
    • PURPOSE:To form a large capacity for a capacitor in a smaller area by a methed a high-melting point metal film is formed on the surface of the Si substrate of the contact hole part; insulating films having a large specific inductive capacity, a second electrode, etc., are laminated thereon; the patterns are formed at one time; and a thermal treatment is performed in an oxygen atmosphere. CONSTITUTION:Interelement isolation insulating films 2, a W electrode 3 of a film thickness of about 1,000Angstrom , a Ta2O3 film 4 of a film thickness of about 300Angstrom , a W electrode 5 of a film thickness of 1,000Angstrom , an Al electrode 6 and tungsten oxide films 7 are formed on an Si substrate 1. In the manufacturing process of this capacitor, after the W film 3, the Ta2O3 film 4, the W film 5 and the Al film 6 were laminated, each film of Al/W/Ta2O3/W is performed a working for being formed into an electrode by performing a dry etching using the same photo mask. After that, a thermal treatment is performed in an oxygen atmosphere of 450 deg.C.