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91. 发明专利

JP2013136459A Electronic component conveyance apparatus 审中-公开
标题翻译：电子元件输送装置
公开(公告)号：JP2013136459A
公开(公告)日：2013-07-11
申请号：JP2012282442
申请日：2012-12-26
申请人： Futaihua Industrial (Shenzhen) Co Ltd , 富泰華工業(深▲セン▼)有限公司 , Hon Hai Precision Industry Co Ltd , 鴻海精密工業股▲ふん▼有限公司
发明人： MIAO ZHEN-YU , XIAO ZHONG-KUN
IPC分类号： B65G43/08 , B65G35/00
CPC分类号： H05K13/021
摘要： PROBLEM TO BE SOLVED: To provide an electronic component conveyance apparatus which can more correctly record a time required to upload an electronic component.SOLUTION: The electronic component conveyance apparatus includes: a mount; a drive device attached to the mount; a first conveyor which is installed on the mount, driven by the drive device and moves; a second conveyor connected to the first conveyor; a belt connection part for connecting the first and second conveyors; and a detection device including a trigger switch and a detection unit that are connected to each other. The trigger switch is provided on the mount and located between the mount and the first conveyor. When the belt connection part contacts the trigger switch according to the movement of the first conveyor, the trigger switch is electrically conducted. The detection unit detects the electrical conduction of the trigger switch and records the trigger time.
摘要翻译：要解决的问题：提供一种电子部件输送装置，其能够更正确地记录上传电子部件所需的时间。解决方案：电子部件输送装置包括：安装台; 连接到所述支架的驱动装置; 安装在由驱动装置驱动并移动的安装件上的第一输送机; 连接到第一输送机的第二输送机; 用于连接第一和第二输送机的皮带连接部分; 以及包括彼此连接的触发开关和检测单元的检测装置。触发开关设置在支架上并位于支架和第一输送机之间。当皮带连接部分根据第一输送机的运动与触发开关接触时，触发开关是导电的。检测单元检测触发开关的导通并记录触发时间。

92. 发明专利

JP2013120884A Splicing device 有权
标题翻译：分离设备
公开(公告)号：JP2013120884A
公开(公告)日：2013-06-17
申请号：JP2011268867
申请日：2011-12-08
申请人： Fuji Mach Mfg Co Ltd , 富士機械製造株式会社
发明人： CHI XIAO DONG
IPC分类号： H05K13/02 , B65B15/04 , B65B41/12 , B65H21/00
CPC分类号： B65H21/00 , B65H2301/46222 , B65H2301/4631 , B65H2301/4641 , B65H2404/72 , B65H2701/1942 , H05K13/021
摘要： PROBLEM TO BE SOLVED: To provide a splicing device whose splicing accuracy is difficult to deteriorate.SOLUTION: A splicing device 1 comprises a tape coupling part 2 having: a stationary presser member 20; and a movable presser member 21 that can be switched between an opening position at which it is opened to the stationary presser member 20 and a closing position at which it is closed to the stationary presser member 20. By switching it from the opening position to the closing position, the movable presser member 21 is closed to the stationary presser member 20, and the movable presser member 21 is overlaid on the stationary presser member 20 in a top and back direction. A splice tape 9 is folded between the movable presser member 21 and the stationary presser member 20, and a first coupling end 804 and a second coupling end 814 are held by the splice tape 9 from the top and back direction. The first coupling end 804 is coupled with the second coupling end 814.
摘要翻译：要解决的问题：提供拼接精度难以劣化的拼接装置。解决方案：拼接装置1包括带连接部分2，其具有：固定压紧构件20; 以及可以在打开位置和打开位置之间切换到可动的压紧构件21的可动的压紧构件21，并且该闭合位置与静止的压紧构件20关闭。通过将其从打开位置切换到关闭位置，可动按压部件21向固定按压部件20关闭，活动按压部件21在上下方向上重叠在固定按压部件20上。接合带9折叠在可动压紧构件21和固定压紧构件20之间，并且第一联接端804和第二联接端814由接合带9从顶部和后部方向保持。第一耦合端804与第二耦合端814耦合。版权所有（C）2013，JPO和INPIT

93. 发明专利

JP2013098414A Packaging device, component shortage determination method and program 有权
标题翻译：包装设备，组件短路确定方法和程序
公开(公告)号：JP2013098414A
公开(公告)日：2013-05-20
申请号：JP2011241144
申请日：2011-11-02
申请人： Sony Corp , ソニー株式会社
发明人： ISHIDA KEISUKE
IPC分类号： H05K13/02
CPC分类号： H05K13/021 , H05K13/0413 , H05K13/0417 , Y10T29/53061
摘要： PROBLEM TO BE SOLVED: To provide a technology with which component shortage of a supply section can be determined accurately.SOLUTION: A packaging device comprises a supply section, a hold section, a first sensor, a second sensor and a control section. The supply section supplies electronic components. The hold section holds the electronic component supplied from the supply section and packages the electronic component on a substrate. The first sensor and the second sensor are configured to detect component shortage of the electronic component supplied from the supply section. The control section executes first component shortage determination processing to determine whether the component shortage of the electronic component occurs or not on the basis of output from the first sensor and, if the occurrence of the component shortage is determined in the first component shortage determination processing, executes second component shortage determination processing to determine whether the component shortage occurs or not on the basis of output from the second sensor.
摘要翻译：要解决的问题：提供可以准确地确定供应部分不足的技术。解决方案：包装装置包括供应部分，保持部分，第一传感器，第二传感器和控制部分。供应部分提供电子元件。保持部保持从供给部供给的电子部件，将电子部件封装在基板上。第一传感器和第二传感器被配置为检测从供给部提供的电子部件的部件短缺。控制部执行第一部件短缺判定处理，根据第一传感器的输出来判断电子部件的部件短缺是否发生，如果在第一部件短缺判定处理中确定了部件短缺的发生，执行第二部件短缺判定处理，以基于来自第二传感器的输出来确定是否发生部件不足。版权所有（C）2013，JPO＆INPIT

94. 发明专利

JP2013038282A Electronic component attachment device and electronic component attachment method 有权
标题翻译：电子元件附件设备和电子元件附件方法
公开(公告)号：JP2013038282A
公开(公告)日：2013-02-21
申请号：JP2011174378
申请日：2011-08-09
申请人： Hitachi High-Tech Instruments Co Ltd , 株式会社日立ハイテクインスツルメンツ
发明人： ONISHI SEIJI , SASA SHOJI , YAMAGUCHI MASAKI
IPC分类号： H05K13/00
CPC分类号： H05K13/08 , H05K13/021
摘要： PROBLEM TO BE SOLVED: To provide an electronic component attachment device which is a dual line device having two lines capable of initial setup work, e.g. feeder cart exchange, by attaching/detaching a feeder cart of the other line during operation of one line, and to provide an electronic component attachment method.SOLUTION: In an electronic component attachment device or method including two(dual) production lines U, T in the center, taking out an electronic component from a plurality of feeders for feeding electronic components mounted on the feeder carts 50U, 50T attached to feeder areas 3U, 3T located on the outside of the production lines U, T, and attaching the electronic component to a substrate by using two attachment heads, an independent production mode for attaching an electronic component to a substrate in one production line by using one attachment head, and attaching an electronic component to a substrate in the other production line by using the other attachment head is provided, a determination is made as to whether or not a feeder cart on the other side provided on the other production line side can be attached/detached, and then the feeder cart on the other side is attached/detached if possible.
摘要翻译：要解决的问题：提供一种电子部件附接装置，其是具有能够初始设置工作的两条线的双线装置，例如，通过在一条线路的操作期间连接/拆卸另一条线的馈电车，并提供电子部件附接方法，进给车更换。解决方案：在包括两个（双）生产线U，T在中心的电子部件附接装置或方法中，从多个馈送器中取出电子部件，用于馈送安装在连接有馈电推车50U，50T的电子部件到位于生产线U，T外侧的供给区域3U，3T，并且通过使用两个附接头将电子部件附接到基板，通过使用一个生产线将电子部件附接到基板的独立生产模式提供一个附接头，并且通过使用另一个附接头将电子部件附接到另一个生产线中的基板上，确定设置在另一个生产线侧上的另一侧的进给车是否可以拆卸，然后如果可能的话，另一侧的进料器推车被拆卸。版权所有（C）2013，JPO＆INPIT

95. 发明专利

JP2012248626A Electronic component mounting device 有权
标题翻译：电子元件安装设备
公开(公告)号：JP2012248626A
公开(公告)日：2012-12-13
申请号：JP2011118306
申请日：2011-05-26
申请人： Juki Corp , Juki株式会社
发明人： ABE TOMOKI
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/021 , H05K13/0417 , Y10T29/4913 , Y10T29/53087 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device that can quickly and appropriately detect a connection between electronic component accommodating tapes, and mount efficiently electronic components with high accuracy.SOLUTION: The electronic component mounting device comprises: a head body; a component supplying device including a holding section for holding a plurality of electronic component accommodating tapes having storage rooms storing electronic components arranged in a row, and a feeder section for feeding the electronic component accommodating tapes; a camera unit fixed to the head body, for taking a picture of an adsorption region; and a control section for controlling the movement of the head body and the component supply device. The control section analyzes a picture image of the adsorption region in the component supply device taken by the camera unit, and determines, based on the analysis result, whether the electronic component accommodating tape in the adsorption region is a spliced portion, and, when detecting that the electronic component accommodating tape in the adsorption region is the spliced portion, determines that the electronic component accommodating tape has been switched.
摘要翻译：要解决的问题：提供一种电子部件安装装置，其可以快速且适当地检测电子部件容纳带之间的连接，并且以高精度有效地安装电子部件。电子部件安装装置包括：头部主体; 一种部件供应装置，包括：保持部，用于保持多个电子部件容纳带，所述多个电子部件容纳带具有存储排列成行的电子部件的存储室;以及馈送部，用于馈送所述电子部件容纳带; 固定在头体上的照相机单元，用于拍摄吸附区域; 以及用于控制头主体和部件供给装置的移动的控制部。控制部分析由摄像单元拍摄的部件供给装置中的吸附区域的图像，并根据分析结果确定吸附区域中的电子部件容纳带是接合部分，并且当检测到吸附区域中的电子部件容纳带是接合部，确定电子部件容纳带已被切换。版权所有（C）2013，JPO＆INPIT

96. 发明专利

JP2012156220A Tape feeder and tape attaching method for tape feeder 有权
标题翻译：胶带进纸器和胶带连接方法
公开(公告)号：JP2012156220A
公开(公告)日：2012-08-16
申请号：JP2011012605
申请日：2011-01-25
申请人： Panasonic Corp , パナソニック株式会社
发明人： KINOSHITA YUTAKA , NAGAO KAZUHIDE , NAKAI NOBUHIRO
IPC分类号： H05K13/02
CPC分类号： H05K13/021 , H05K13/0084
摘要： PROBLEM TO BE SOLVED: To provide a tape feeder and a tape attaching method for the tape feeder in which positioning can be easily performed in a carrier tape attaching work to enhance workability and increase a working efficiency.SOLUTION: A base tape 15a and a cover tape 15e of a carrier tape 15 are separated from each other in pitch feed of a carrier tape 15 by interposing a cover tape peeling mechanism 50 between attachment faces of the tapes. A lower guide member 40 for guiding the carrier tape 15 from the lower side is pushed up from the lower surface side by a lever member 44 at a peeling start position where a peeling blade edge portion 51f having a sharp-pointed shape provided to the tip portion of the cover tape peeling mechanism 50 starts peeling of the attachment faces. When the carrier tape 15 is attached, the carrier tape 15 is pushed up together with the lower guide member 40, and the peeling blade edge portion 51f is positioned to the attachment faces at the peeling start position and inserted between the attachment faces.
摘要翻译：要解决的问题：提供一种用于带式馈送器的带式馈送器和带附接方法，其中可以容易地在载带安装作业中进行定位以提高可操作性并提高工作效率。解决方案：载带15的基带15a和盖带15e在载带15的间距馈送中通过在带的附接面之间插入覆盖带剥离机构50而彼此分离。用于从下侧引导载带15的下引导构件40在剥离开始位置处通过杆构件44从下表面侧向上推压，在剥离开始位置处具有尖端形状的剥离刀片边缘部51f提供到尖端盖带剥离机构50的一部分开始附着面的剥离。当安装载带15时，载带15与下引导构件40一起被推起，并且剥离叶片边缘部51f位于剥离开始位置处的安装面并且插入在附接面之间。版权所有（C）2012，JPO＆INPIT

97. 发明专利

JP2012106753A Device and method for packaging chip component, and cover tape 有权
标题翻译：用于包装芯片组件和盖带的装置和方法
公开(公告)号：JP2012106753A
公开(公告)日：2012-06-07
申请号：JP2010255828
申请日：2010-11-16
申请人： Lapis Semiconductor Co Ltd , ラピスセミコンダクタ株式会社
发明人： ITO HIROYUKI
IPC分类号： B65B15/04 , B65D65/10 , B65D65/14
CPC分类号： H05K13/021 , B65B7/2814 , B65B7/2864 , B65B9/00 , B65B35/38 , Y10T428/24802
摘要： PROBLEM TO BE SOLVED: To provide a device for packaging chip components capable of preventing defective attachment in a taping process for packaging the chip components, and a cover tape.SOLUTION: The cover tape to which respective cover film pieces each formed with an adhesive part are sequentially attached is arranged in a form intersecting with a longitudinal direction of a carrier tape on which a plurality of component housing recessed parts are sequentially formed side by side. By pressing the cover tape against the front surface of the carrier tape, the cover film piece attached to the cover tape is stuck to the front surface of the carrier tape to seal the chip component housing recessed part.
摘要翻译：要解决的问题：提供一种用于包装芯片组件的装置，其能够防止在用于包装芯片部件的胶带加工中的有缺陷的附着以及覆盖带。解决方案：依次安装各自形成有粘合剂部分的各个覆盖膜片的盖带布置成与其上顺序形成多个部件壳体凹部的载带的纵向相交的形状并排。通过将盖带压靠在载带的前表面上，附着在盖带上的盖膜片粘贴到载带的前表面上，以密封芯片部件壳体凹部。版权所有（C）2012，JPO＆INPIT

98. 发明专利

JP4558644B2 Scissors for parts supply tape 有权
公开(公告)号：JP4558644B2
公开(公告)日：2010-10-06
申请号：JP2005504965
申请日：2004-02-10
申请人：富士機械製造株式会社
发明人：典光阿知波 , 幸則高田
IPC分类号： B26B13/22 , B26B17/00 , B65D73/02 , H05K13/02
CPC分类号： B26B13/22 , B26B17/00 , B65D73/02 , H05K13/021 , Y10T156/12

99. 发明专利

JP4429465B2 Component supply unit cart for batch exchange 有权
公开(公告)号：JP4429465B2
公开(公告)日：2010-03-10
申请号：JP2000098356
申请日：2000-03-31
申请人：パナソニック株式会社
发明人：朗壁下 , 孝男柏崎 , 忠士遠藤
IPC分类号： H05K13/02 , B62B3/00 , H05K13/04
CPC分类号： H05K13/0452 , H05K13/021 , Y10T74/2057

100. 发明专利

JP2010034607A Electronic component mounting device 审中-公开
标题翻译：电子元件安装设备
公开(公告)号：JP2010034607A
公开(公告)日：2010-02-12
申请号：JP2009262353
申请日：2009-11-17
申请人： Hitachi High-Tech Instruments Co Ltd , 株式会社日立ハイテクインスツルメンツ
发明人： WATANABE AKIO , KAWAI AKISUKE , ONO TETSUJI , KAMEDA MAKIO , OYAMA KAZUYOSHI
IPC分类号： H05K13/04
CPC分类号： H05K13/021 , H05K13/0417 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49146 , Y10T29/53174 , Y10T29/53178
摘要： PROBLEM TO BE SOLVED: To prevent a suction rate of electronic components from lowering when storage tapes are connected to each other by a connection tape because of shortage of electronic components. SOLUTION: After a new storage tape C is connected to an old storage tape C, a CPU 110 sends a feed command to a component supply unit 6 to drive a servo motor 28 and a driving motor 42 of the supply unit 6, thereby performing component feed operation. When the suction rate of the component supply unit is below a predetermined value, a substrate recognition camera 14 is moved to a suction take out position of the supply unit 6 to image a storage unit Cc of the storage tape C, and a recognition processing apparatus 117 performs recognition processing. Based on the recognition processing result, a correction value is stored in a RAMI 111, and after an X-axis driving motor 12X and a Y-axis driving motor 12Y are driven while the correction value is taken into consideration, a vertical-axis driving motor 16A is driven, so that a suction nozzle 18 moves down to take out an electronic component. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止由于电子部件的不足而通过连接带将存储带彼此连接时的电子部件的吸入率降低。解决方案：在将新的存储带C连接到旧的存储带C之后，CPU 110向组件供应单元6发送馈送命令以驱动供应单元6的伺服电动机28和驱动电动机42，从而执行组件进给操作。当元件供给单元的吸入率低于预定值时，将基板识别照相机14移动到供给单元6的抽吸取出位置，以对存储带C的存储单元Cc进行成像，并且识别处理装置 117执行识别处理。基于识别处理结果，将校正值存储在RAMI111中，在考虑了校正值的同时驱动X轴驱动电动机12X和Y轴驱动电动机12Y之后，进行垂直轴驱动马达16A被驱动，使得吸嘴18向下移动以取出电子部件。版权所有（C）2010，JPO＆INPIT

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