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91. 发明专利

JP2013536464A Operation proof with a security label or security adhesive tape 有权
公开(公告)号：JP2013536464A
公开(公告)日：2013-09-19
申请号：JP2013523516
申请日：2011-07-30
申请人：ヒュック・フォーリエン・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
发明人：マイルホーファー・マルコ , アイクナー・ゲオルク
IPC分类号： G09F3/03 , G09F3/02
CPC分类号： G09F3/0292 , B42D15/00 , C09J7/29 , C09J2203/338 , C09J2400/163 , G09F3/0341 , G09F3/10 , G09F2003/0239 , G09F2003/0241 , G09F2003/0255 , G09F2003/0277
摘要： The invention relates to a tamper-evident adhesive security tape or label comprising a flexible backing substrate based on a flexible polymeric film, which is characterized in that one surface of the backing substrate 1 bears the following applied layers: a) an embossed varnish layer 2, b) a semitransparent metal layer and/or a high refractive index layer 3, c) a first, partial release varnish layer in the form of letters, signs, symbols, lines, guilloches, numbers or writing 4, d) one or more varnish layers having optical properties 5 e) a second, full-area release varnish layer 6, f) a further full-area varnish layer 7, g) a self-adhesive coating 8, where, in the regions not coated with the release varnish layer 4, the adhesion of all the layers to one another and the adhesion of the layer 8 to the article 9 to be secured are greater than the adhesion of the layer 5 to the layer 6 or of the layer 6 to the layer 7, and where, in the regions coated with the release varnish layer 4, the adhesion of all layers to one another and the adhesion of the layer 8 to the article 9 to be secured are greater than the adhesion of the layer 3 to the layer 4 or of the layer 4 to the layer 5, and where in particular the adhesion of the layer 3 to the layer 4 or of the layer 4 to the layer 5 is lower than the adhesion both of the layer 5 to the layer 6 and of the layer 6 to the layer 7.

92. 发明专利

JP5281416B2 Metal self-adhesive laminate durable 有权
公开(公告)号：JP5281416B2
公开(公告)日：2013-09-04
申请号：JP2008556360
申请日：2007-02-16
申请人：イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company
发明人：バーバラクリモウィッツオローク , ジェイムズディーンカトサロス , ヨアニスヴィーブレトソス
IPC分类号： B32B15/08 , B32B3/28 , E04B1/66 , E06B1/62
CPC分类号： E06B1/62 , C09J7/29 , C09J2400/163 , C09J2400/263 , C09J2433/006 , D06N7/0094 , D06N2209/103 , D06N2209/128 , D06N2209/1678 , E06B2001/628 , Y10T428/14 , Y10T428/141 , Y10T428/1438 , Y10T428/1443 , Y10T428/1462 , Y10T428/1476 , Y10T442/2738
摘要： A self-adhesive laminate with an emissivity of no greater than about 0.40 made of a sheet layer having first and second outer surfaces, the sheet layer comprising at least one layer selected from the group consisting of nonwoven fabrics, woven fabrics, nonwoven fabric-film laminates, woven fabric-film laminates, films, paper-film laminates, and composites thereof with at least one multi-layer coating on said first outer surface of the sheet layer, said multi-layer coating comprising a first metal coating layer adjacent the first outer surface of the sheet layer; and an outer organic coating layer of a composition containing a material selected from the group consisting of organic polymers, organic oligomers, compounds, and combinations thereof, deposited on the metal layer; and with an adhesive layer coating the second outer surface of the sheet layer and wherein the sheet layer coated with said multilayer coating is creped.

93. 发明专利

JP5139514B2 Metal surface treatment composition 有权
公开(公告)号：JP5139514B2
公开(公告)日：2013-02-06
申请号：JP2010506184
申请日：2008-01-17
申请人：マクダーミッドインコーポレーテッドMacdermid,Incorporated
发明人：カシェン・フォン , ミン・デ・ワン , スティーブン・エー・カスタルディ
IPC分类号： C23F1/18 , H05K3/38
CPC分类号： C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124

95. 发明专利

JP5081924B2 Conductive adhesive tape 有权
公开(公告)号：JP5081924B2
公开(公告)日：2012-11-28
申请号：JP2009545482
申请日：2007-05-18
申请人：ジョインセットカンパニーリミテッド
发明人：キム，スン−キ
IPC分类号： C09J7/02 , B32B15/08
CPC分类号： C09J9/02 , B32B15/08 , C09J7/29 , C09J2201/20 , C09J2400/163 , C09J2423/006 , C09J2433/00 , C09J2467/006 , C09J2479/086 , C09J2483/00 , Y10T428/218 , Y10T428/28 , Y10T428/2804 , Y10T428/2848
摘要： A conductive pressure sensitive adhesive tape is provided. The conductive pressure sensitive adhesive tape includes a first metal foil, a polymer film attached to a surface of the first metal foil with a polymer binder interposed therebetween, a second metal foil attached to a surface of the polymer film with a polymer binder interposed therebetween, and a polymer adhesive layer formed on a backside of at least one of the first and second metal foils.

96. 发明专利

JP2012131921A Conductive adhesive tape 审中-公开
标题翻译：导电胶带
公开(公告)号：JP2012131921A
公开(公告)日：2012-07-12
申请号：JP2010285828
申请日：2010-12-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NONAKA TAKAHIRO , DAIGAKU NORIJI , MURAKAMI AI , NAKAO KOTA , YAMAZAKI HIROSHI
IPC分类号： C09J7/02
CPC分类号： C22C13/00 , B23K35/262 , B23K35/264 , C09J7/28 , C09J7/29 , C09J2201/20 , C09J2201/32 , C09J2201/602 , C09J2203/326 , C09J2400/163 , C09J2433/00 , C22C12/00 , H01L2924/00013 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： PROBLEM TO BE SOLVED: To provide a conductive adhesive tape excellent in conductivity and durability.SOLUTION: The conductive adhesive tape 1 comprises a conductive layer 2 and an adhesive layer 3 formed on the surface of the conductive layer 2. In the adhesive layer 3, an adhesive layer through-hole 4 penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer 2 comprises a conductive layer passage portion 5 formed in the adhesive layer through-hole 4. A low melting point metal layer 6 is provided at an upper-side end face 16 of the conductive layer passage portion 5, the end face 16 reaching the surface of the adhesive layer 3.
摘要翻译：要解决的问题：提供导电性和耐久性优异的导电性粘合带。导电胶带1包括导电层2和形成在导电层2的表面上的粘合剂层3.在粘合剂层3中，粘合剂层通孔4以厚度方式穿透粘合剂层形成其方向。导电层2包括形成在粘合剂层通孔4中的导电层通路部分5.低导电层金属层6设置在导电层通道部分5的上侧端面16处，端面16 到达粘合剂层3的表面。版权所有（C）2012，JPO＆INPIT

97. 发明专利

JP4924143B2 Joining method of metal works 有权
标题翻译：空值
公开(公告)号：JP4924143B2
公开(公告)日：2012-04-25
申请号：JP2007085401
申请日：2007-03-28
申请人：マツダ株式会社
发明人：陽一郎北原 , 雄也氷室 , 力田中
IPC分类号： F16B11/00 , B23K26/00 , B23K26/20
CPC分类号： B23K26/211 , B23K2201/006 , B23K2201/185 , C09J5/06 , C09J2400/163
摘要： A gap 3 is provided at joining faces 1a , 2a of a pair of metal works 1 , 2 with an uneven shape when the metal works contact one another for joining. An adhesive agent 4 having a chain-reacting curing reaction function is disposed within the gap 3 . The adhesive agent 4 is cured by an autogenously-generated curing reaction heat caused by an outer energy and an additional heat that is successively generated by the autogenously-generated curing reaction heat within the adhesive agent 4 . A welding portion 5 , where the works 1 , 2 contact one another substantially directly, is welded by a laser beam 31 , and the above-described energy for causing the autogenously-generated curing reaction heat for the adhesive agent 4 is provided by the laser beam 31 . Accordingly, a joining structure and method of metal works that can has less limitation in a joining location is provided.
摘要翻译：当金属制品彼此接触用于接合时，间隙3设置在具有不平坦形状的一对金属制品1,2的接合面1a，2a处。具有链反应固化反应功能的粘合剂4设置在间隙3内。粘合剂4通过由外部能量引起的自发产生的固化反应热和由粘合剂4内的自发生成的固化反应热相继产生的附加热固化。通过激光束31焊接工件1,2基本上直接接触的焊接部5，并且由激光器4提供上述用于引起自发生成的固化反应热的能量梁31。因此，提供了可以在接合位置具有较少限制的金属加工的接合结构和方法。

99. 发明专利

JP2012009884A Conductive body connecting method, conductive body connecting member, connecting structure, and solar cell module 有权
标题翻译：导电体连接方法，导电体连接构件，连接结构和太阳能电池模块
公开(公告)号：JP2012009884A
公开(公告)日：2012-01-12
申请号：JP2011180849
申请日：2011-08-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUKUSHIMA NAOKI , TSUKAGOSHI ISAO , SHIMIZU TAKEHIRO
IPC分类号： H01L31/042
CPC分类号： H01L31/186 , C09J5/06 , C09J7/22 , C09J7/35 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/322 , C09J2400/163 , H01L31/0512 , Y02E10/50 , Y10T29/49194
摘要： PROBLEM TO BE SOLVED: To simplify a connecting step when electrically connecting conductive bodies which are separated from each other.SOLUTION: The method of electrically connecting a first conductive body and a second conductive body which are separated from each other, includes a step of heating and pressurizing a metallic foil 1, a first adhesive layer 2 provided on one surface of the metallic foil 1, and the first conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the first conductive body; and heating and pressurizing the metallic foil 1, the first adhesive layer 2 or a second adhesive layer 3 provided on the other surface of the metallic foil 1, and the second conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the second conductive body.
摘要翻译：要解决的问题：为了简化在彼此分离的导电体电连接时的连接步骤。解决方案：电连接彼此分离的第一导电体和第二导电体的方法包括对金属箔1进行加热和加压的步骤，设置在金属箔1的一个表面上的第一粘合剂层2 箔1和第一导电体，同时依次布置它们以电连接和接合金属箔1和第一导电体; 对设置在金属箔1的另一面上的金属箔1，第一粘合层2或第二粘合剂层3进行加热加压，同时对第二导电体进行按顺序配置，将金属箔 1和第二导电体。版权所有（C）2012，JPO＆INPIT

100. 发明专利

JP2011249613A Electromagnetic wave absorbing adhesive sheet 审中-公开
标题翻译：电磁波吸收胶粘片
公开(公告)号：JP2011249613A
公开(公告)日：2011-12-08
申请号：JP2010122123
申请日：2010-05-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUKUDA YUKI , WANO TAKASHI , TADA MASATAKA , HASHIMOTO OSAMU , TAMARU RYOJI
IPC分类号： H05K9/00 , B32B27/00 , B32B27/30 , C09J7/02 , C09J11/04 , C09J133/00
CPC分类号： H05K9/0003 , C08L75/04 , C09J7/29 , C09J133/06 , C09J2203/326 , C09J2205/11 , C09J2400/163 , C09J2433/00
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorbing adhesive sheet which can be stably adhered to even a surface having curved and rugged portions, which can obtain a strong and stable adhesion state by simply adhering with pressure especially to outdoor buildings and concrete structures, and which can furthermore stably keep an electromagnetic wave absorbing ability.SOLUTION: A electromagnetic wave absorbing adhesive sheet has an electromagnetic wave absorbing laminated structure 10 in which a divided conductive film 1, an electromagnetic wave absorbing sheet 2, and an electromagnetic wave reflecting sheet 3 are stacked in this order. A protection layer 4 is formed on one side 1A which is the opposite side of the electromagnetic wave absorbing sheet of the divided conductive film 1, and a bubble-containing adhesive layer 5 is formed on one side 3A which is the opposite side of the electromagnetic wave absorbing sheet of the electromagnetic wave reflecting sheet 3.
摘要翻译：要解决的问题：提供一种能够稳定地粘附到具有弯曲和粗糙部分的表面的电磁波吸收性粘合片，其能够通过简单地粘附特别是室外建筑物而获得强而稳定的粘附状态，混凝土结构，并且可以进一步稳定地保持电磁波吸收能力。解决方案：电磁波吸收粘合片具有电磁波吸收叠层结构10，其中依次层叠有分割导电膜1，电磁波吸收片2和电磁波反射片3。保护层4形成在作为分隔导电膜1的电磁波吸收片的相对侧的一侧1A上，并且在一侧3A上形成含气泡的粘合剂层5，该侧面3A是与电磁波电波波片3的吸波片。（C）2012，JPO＆INPIT

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