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91. 发明专利

JP2013110367A Probe card and inspection device 审中-公开
标题翻译：探针卡和检查装置
公开(公告)号：JP2013110367A
公开(公告)日：2013-06-06
申请号：JP2011256564
申请日：2011-11-24
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： SUZUKI TAIKI , FUKITA RYUJI , KIMURA AKIRA , TAKAHASHI NOBUYASU
IPC分类号： H01L21/66 , G01R1/073 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a probe card which, when connected to an inspection object, can adjust the relative positions of a light source and the inspection object.SOLUTION: The present invention relates to an inspection device which is electrically connected to an inspection object W1 having a light-receiving part W11 and an electrode W12 via a probe card to execute inspection processing on the inspection object W1. The probe card is the one which is used to attach, to a board, a board 20 having a contact maker 11 to electrically connect with the inspection object W1 disposed on a surface on one side thereof and a light source 41 capable of applying light toward the inspection object W1. The probe card includes a fitting member having a plurality of light source support parts 52 to support the light source 41. On a board surface 30 different from the surface of the board 20 on which the contact maker 11 is disposed are erected struts 61 to respectively support the light source support parts 52, each of the light source support parts 52 being operably supported along the struts 61.
摘要翻译：要解决的问题：提供一种当连接到检查对象时可以调节光源和检查对象的相对位置的探针卡。检测装置技术领域本发明涉及一种检查装置，其通过探针卡电连接到具有受光部W11的检查对象W1和电极W12，以对检查对象W1进行检查处理。探针卡是用于连接到板的板，具有接触器11的电路板20，其与设置在其一侧的表面上的检查对象W1电连接，以及能够朝向检查对象W1。探针卡包括具有多个用于支撑光源41的光源支撑部52的配合构件。在与设置有接触器11的基板20的表面不同的基板面30上分别竖立着支柱61 支撑光源支撑部分52，每个光源支撑部分52沿着支柱61可操作地支撑。版权所有：（C）2013，JPO＆INPIT

92. 发明专利

JP5193934B2 Inspection method of electrical components 有权
公开(公告)号：JP5193934B2
公开(公告)日：2013-05-08
申请号：JP2009108591
申请日：2009-04-28
申请人：株式会社日本マイクロニクス
发明人：聡成田
IPC分类号： G01R31/28 , G01R1/067 , G01R31/26

93. 发明专利

JP5190195B2 Electrical connecting apparatus 有权
公开(公告)号：JP5190195B2
公开(公告)日：2013-04-24
申请号：JP2006321204
申请日：2006-11-29
申请人：株式会社日本マイクロニクス
发明人：雄治宮城 , 英博清藤 , 明久赤平 , 義徳菊地
IPC分类号： G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R31/2889 , G01R31/2891

94. 发明专利

JP5184996B2 Contact and electrical connection devices 有权
公开(公告)号：JP5184996B2
公开(公告)日：2013-04-17
申请号：JP2008178242
申请日：2008-07-08
申请人：株式会社日本マイクロニクス
发明人：雅彦庄
IPC分类号： H01R13/24 , G01R1/067 , H01R33/76

95. 发明专利

JP5137336B2 Movable probe unit mechanism and electrical testing equipment 有权
公开(公告)号：JP5137336B2
公开(公告)日：2013-02-06
申请号：JP2006148562
申请日：2006-05-29
申请人：株式会社日本マイクロニクス
发明人：司工藤 , 齋藤　　健
IPC分类号： G01R31/28 , G02F1/1345

96. 发明专利

JP5134803B2 Electrical connecting apparatus 有权
公开(公告)号：JP5134803B2
公开(公告)日：2013-01-30
申请号：JP2006274118
申请日：2006-10-05
申请人：株式会社日本マイクロニクス
发明人：衛知大里 , 福仁新間 , 智晴荒井
IPC分类号： G01R31/26 , G01R1/073 , H01R33/76
CPC分类号： G01R1/0466

97. 发明专利

JP5113481B2 Contact and electrical connection apparatus using the same 有权
公开(公告)号：JP5113481B2
公开(公告)日：2013-01-09
申请号：JP2007275074
申请日：2007-10-23
申请人：株式会社日本マイクロニクス
发明人：衛知大里 , 秀和三浦
IPC分类号： G01R1/073 , H01R33/76
CPC分类号： G01R1/0466 , H01R12/714

98. 发明专利

JP5087371B2 Method of manufacturing the electrical test for contacts 有权
公开(公告)号：JP5087371B2
公开(公告)日：2012-12-05
申请号：JP2007299220
申请日：2007-11-19
申请人：株式会社日本マイクロニクス
发明人：孝幸林崎 , 秀樹平川 , 亮相馬 , 裕香山谷
IPC分类号： G01R1/073 , G01R31/28 , H01L21/66

99. 发明专利

JP2012218823A Maintenance mechanism of repair device 审中-公开
标题翻译：维修设备维护机制
公开(公告)号：JP2012218823A
公开(公告)日：2012-11-12
申请号：JP2011082941
申请日：2011-04-04
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： SAITO TAKESHI , KIKUTA MAKOTO
IPC分类号： B65G49/06 , B23K26/00 , G02F1/13 , G09F9/00 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To improve workability during the maintenance of an enlarged device.SOLUTION: A maintenance mechanism of a repair device includes a worktable with a plate to be repaired is placed, guide rails arranged on both sides of the worktable, a portal stage which is movably supported by each guide rail and stretched over the worktable, and a repair unit which is slidably supported by the portal stage in the direction perpendicular to the guide rails, and repairs the plate to be repaired on the worktable. The maintenance mechanism is constituted of foot rests to be fitted to each guide rail, and a top plate which is placed on each foot rest and stretched over the worktable.
摘要翻译：要解决的问题：为了提高在扩大装置的维护期间的可操作性。解决方案：修理装置的维护机构包括具有待修复的板的工作台，布置在工作台两侧的导轨，由每个导轨可移动地支撑并在工作台上延伸的入口台，以及维修单元，其在垂直于导轨的方向上由入口台可滑动地支撑，并且在工作台上修理待修理的板。维护机构由要搁置在每个导轨上的搁脚板构成，顶板设置在每个脚踏板上并在工作台上延伸。版权所有（C）2013，JPO＆INPIT

100. 发明专利

JP5052597B2 Terminal formation of the stacked package elements, and method for forming a stacked package 有权
公开(公告)号：JP5052597B2
公开(公告)日：2012-10-17
申请号：JP2009505029
申请日：2007-03-20
申请人：株式会社日本マイクロニクス
发明人：真人池田
IPC分类号： H01L23/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L25/0657 , H01L24/16 , H01L24/24 , H01L24/742 , H01L24/82 , H01L2224/05573 , H01L2224/1131 , H01L2224/13025 , H01L2224/24011 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2225/06551 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2224/05599
摘要： A semiconductor chip module having high degree of freedom in assignment of a circuit to each semiconductor chip and in position of a connection terminal of each semiconductor chip is provided. The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips, each provided on the side face thereof with a part of a connection terminal coupled with a circuit pattern formed on the front face, have been stacked and bonded. Connection terminal portions on the side faces of the respective semiconductor chips are interconnected by a wiring pattern. The connection terminal on the semiconductor chip is led from the front face to the side face and formed by applying spraying of a conductive material in a mist state.

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