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1. 发明专利

JP2001240848A GRINDING ABRASIVE GRAIN AND CHEMICAL MACHINE-GRINDING SLURRY 失效
公开(公告)号：JP2001240848A
公开(公告)日：2001-09-04
申请号：JP2000055761
申请日：2000-03-01
申请人： SHIBAURA MECHATRONICS CORP , TAMA KAGAKU KOGYO KK , TOSHIBA CORP , SHISEIDO CO LTD
发明人： SAKURAI NAOAKI , NONAKA MIKIO , CHIYOU SHIYUNREN , HIRABAYASHI HIDEAKI , KANAMARU TETSUYA , ONO KAZUHISA
IPC分类号： B24B37/00 , C09K3/14 , C23C16/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide grinding abrasive grains not showing a change with time cause by the effect of a co-presenting substance and being washed out from a treated material after its grinding. SOLUTION: In the grinding abrasive grains used as chemical machine- grinding (CMP) slurry, a polysiloxane coated film informed on the entire surface of hard inorganic compound particles such as an alumina, a θ-alumina or the like. The above polysiloxane coated film is formed by performing chemical vapor deposition with a siloxane-based compound and a Si-H group addition reacting on the inorganic compound fine particles in a chamber, and further making them as hydrophilic by performing a heat-treatment or hydroxylation reaction.

2. 发明专利

JPH0857246A TREATMENT OF ACIDIC EXHAUST GAS 失效
公开(公告)号：JPH0857246A
公开(公告)日：1996-03-05
申请号：JP12126195
申请日：1995-05-19
申请人： TAMA KAGAKU KOGYO KK , TOSHIBA CORP
发明人： CHIYOU SHIYUNREN , OYAMA RYUICHI , KAMATA YUTAKA
IPC分类号： B01D53/34 , B01D53/40 , B01D53/68 , B01D53/77
摘要： PURPOSE: To easily and efficiently separate and remove an acidic component in gas under a clean condition by bringing acidic exhaust gas into contact with a gas treatment soln. composed of an aq. soln. of a quaternary ammonium compd. represented by a specific compd. CONSTITUTION: Acidic exhaust gas is brought into contact with a gas treatment soln. composed of an aq. soln. of quaternary ammonium compd./ represented by formula (wherein R1 to R2 are mutually same or different and are each a 1-3C alkyl group or a hydroxy substituted alkyl group and X is OH or 1/2CO 3 ) to separate and remove an acidic component from the acidic exhaust gas. As the quaternary ammonium compd., tetramethylammonium hydroxide, trimethylhydroxyammonium hydroxide or ditetramethylammonum carbonate is especially pref. because it is high in purity, easy to hande and inexpensive. By this constitution, acidic exhaust gas containing an acidic component, especially, fluorine or a fluorine compd. can be easily and efficiently treated.

3. 发明专利

JP2001326198A POLISHED COMPOSITION FOR COPPER-BASED METAL, POLISHED COMPOSITION FOR COPPER DIFFUSION PREVENTING MATERIAL AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001326198A
公开(公告)日：2001-11-22
申请号：JP2000143526
申请日：2000-05-16
申请人： TOSHIBA CORP , TAMA KAGAKU KOGYO KK
发明人： SAITO AKIKO , HIRABAYASHI HIDEAKI , CHIYOU SHIYUNREN , KATO KATSUHIRO
IPC分类号： B24B57/02 , B24B37/00 , C09K3/14 , C09K13/00 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a polished composition for a copper-based metal, which increases the polishing rate of copper (Cu) or a copper alloy (Cu alloy) and also enables increase in the selection ratio of polishing of the polishing composition to a copper diffusion preventing material such as tantalum. SOLUTION: A polished composition for a copper-based metal contain a water-soluble organic acid, which reacts with copper, is substantially insoluble in water and produces a copper complex which is mechanically more brittle than copper, at least one polished abrasive grain which is selected from among aluminas, including a Q-alumina phase or a boehmite phase, an oxidizing agent and water.

4. 发明专利

JP2000183003A POLISHING COMPOSITION FOR COPPER METAL AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000183003A
公开(公告)日：2000-06-30
申请号：JP23876799
申请日：1999-08-25
申请人： TOSHIBA CORP , TAMA KAGAKU KOGYO KK
发明人： HIRABAYASHI HIDEAKI , SAKURAI NAOAKI , CHIYOU SHIYUNREN , KATO KATSUHIRO , SHIMIZU SHUNPEI , SAITO AKIKO
IPC分类号： B24B37/00 , C09G1/02 , C09K3/14 , C09K13/00 , C09K13/06 , H01L21/302 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/461 , H01L21/768 , H01L23/52 , H01L23/532
摘要： PROBLEM TO BE SOLVED: To enable an etching-back process to be carried out in a short time by a method wherein polishing composition for copper metal comprises a first organic acid which reacts on copper, is non-soluble in water, and generates a copper complex, a second organic acid which has a carboxyl group and a hydroxyl group, abrasive particles, oxidizing agent, and water. SOLUTION: This polishing composition for copper metal comprises a first organic acid, a second organic acid, abrasive particles, oxidizing agent, and water. The first organic acid reacts on a copper hydrate, is not soluble in water, and generates a copper complex more fragile than Cu. 2-quinoline carboxylic acid or 2-pyridine carboxylic acid is utilized as the first organic acid. The second organic acid is possessed of a carboxyl group and a hydroxyl group. A lactic acid, a tartaric acid, a mandelic acid, or a malic acid is utilized as the second organic acid. By this setup, an etching-back operation can be carried out in a short time, and a conductive member such as a very accurate buried wiring layer can be formed.

5. 发明专利

JPH10279926A POLISHING LIQUID 失效
公开(公告)号：JPH10279926A
公开(公告)日：1998-10-20
申请号：JP8278597
申请日：1997-04-01
申请人： TOSHIBA CORP , TAMA KAGAKU KOGYO KK
发明人： HIRABAYASHI HIDEAKI , CHIYOU SHIYUNREN , SHIMIZU SHUNPEI
IPC分类号： B24B57/02 , C09K3/14 , C09K13/06 , H01L21/304 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To obtain a polishing liquid capable of polishing the surfaces of metal films at speeds of practical levels, capable of inhibiting the generation of damages on the surfaces of the metal films, and useful for forming the embedded metal wirings of semiconductor devices, etc., by including colloidal alumina and water. SOLUTION: This polishing liquid contains (A) colloidal alumina and (B) water as essential components. In addition to the components A and B, the polishing liquid preferably contains (C) 2-quinoline carboxylic acid and (D) an oxidizing agent in a case of a Cu (alloy)-polishing liquid, the component D and (E) a polish-accelerating agent comprising ferric trichloride or a mixture of trimethyl (ammonium) hydroxide, phosphoric acid-sulfuric acid-acetic acid in a case of an Al (alloy)-polishing liquid, or the component D and (F) a polishing accelerating agent comprising ferric trichloride or ferric trinitrate in a case of a W-polishing liquid.

6. 发明专利

JPH01120552A DEVELOPER FOR POSITIVE TYPE PHOTORESIST 失效
公开(公告)号：JPH01120552A
公开(公告)日：1989-05-12
申请号：JP27872387
申请日：1987-11-02
申请人： TAMA KAGAKU KOGYO KK
发明人： CHIYOU SHIYUNREN , IWAKI AKIRA
IPC分类号： G03C1/72 , G03F7/30 , G03F7/32
摘要： PURPOSE:To improve the heat resisting property of a resist during the development processing of the resist by incorporating silicic acid or a quarternary ammonium salt of alkyl silicate in an aqueous solution of org. quarternary ammonium hydroxide as a main component. CONSTITUTION:The developer for the positive type photoresist is prepared by incorporating the silicic acid or the quarternary ammonium salt of alkyl silicate in the aqueous solution of the org. quarternary ammonium hydroxide as the main component of said aqueous solution. The silicate or the quarternary ammonium salt contd. in said aqueous solution is preferably contnd. in a range of 1-30,000ppm, expressed in terms of silicon atom. Thus, the heat resisting property of the resist can be improved in the development processing of the resist. And, in case of aluminum substrate being used for a substrate, the etching rate of said substrate plate can be reduced.

7. 发明专利

JP2001117240A ALKALI DEVELOPING SOLUTION FOR PHOTOSENSITIVE RESIN COMPOSITION 失效
公开(公告)号：JP2001117240A
公开(公告)日：2001-04-27
申请号：JP29945599
申请日：1999-10-21
申请人： TAMA KAGAKU KOGYO KK
发明人： CHIYOU SHIYUNREN , YAMANISHI EIJI , SANNOMIYA TAEKO
IPC分类号： H01L21/027 , G03F7/32
摘要： PROBLEM TO BE SOLVED: To obtain an alkali developing solution for a photosensitive resin composition using only organic components not substantially containing metal ions, capable of suppressing a change with the lapse of time due to the absorption of gaseous CO2 and the generation of particles during use, capable of repetitive use, excellent in uniform developing performance, free from the problems of scum and film residue, capable of forming an excellent resist pattern or colored pattern and not substantially containing metal ions. SOLUTION: The alkali developing solution comprises an aqueous alkali solution containing the carbonate and/or hydrogencarbonate of an organic alkali and an organic strong alkali and not substantially containing metallic impurities.

8. 发明专利

JPH0517799A LIQUID DETERGENT COMPOSITION 失效
公开(公告)号：JPH0517799A
公开(公告)日：1993-01-26
申请号：JP19361591
申请日：1991-07-09
申请人： TAMA KAGAKU KOGYO KK
发明人： CHIYOU SHIYUNREN , INOUE AKIHIRO
IPC分类号： C11D7/54 , C11D7/60
摘要： PURPOSE:To provide a liquid detergent composition containing a specified amount of an organic quaternary ammonium hydroxide, a hypochlorite and an alkali metal hydroxide, and showing an especially excellent detergency for living stains derived from hairs. CONSTITUTION:A liquid detergent composition containing, as the active components, (A) 0.005-5wt.% organic quaternary ammonium hydroxide having 1-3C alkyl groups and/or hydroxy-substituted alkyl groups, e.g. tetramethylammonium hydroxide, (B) 1-10wt.% hypochlorite containing 1-10wt.% active chlorine, e.g. sodium hypochlorite and (C) 0.5-5wt.% alkali metal hydroxide such as sodium hydroxide, free from a problem about the corrosion of a pipe made of a metal such as iron or its related materials and especially useful for washing pipes in a lavatory or a bath room. In addition, a surfactant is preferably added in an amount of 0.005-5wt.%.

9. 发明专利

JPS63307102A PREPARATION OF CERAMICS RAW MATERIAL BY COPRECIPITATION 失效
公开(公告)号：JPS63307102A
公开(公告)日：1988-12-14
申请号：JP13999887
申请日：1987-06-05
申请人： TAMA KAGAKU KOGYO KK
发明人： YOSHIZAKO MAMORU , CHIYOU SHIYUNREN , IIRI SHIGEO , SUZUKI MITSURU
IPC分类号： C01G49/00 , C01B13/36 , C01G1/02 , C01G3/00 , C04B35/00 , C04B35/626
摘要： PURPOSE:To enable preparation of a ceramics raw material having precisely adjusted chemical composition and high degree of homogeneity, by blending an aqueous solution of metallic compounds prepared by blending the compounds in a specific proportion with an oxalic acid based coprecipitating agent adjusted with an organic amine based pH adjustor. CONSTITUTION:Water-soluble metallic compounds capable of forming oxalates or hydroxides at pH >=9 are dissolved in 2l pure water in a specific proportion, e.g. 18.6g barium acetate with 19.0g copper nitrate and 21.5g yttrium nitrate, to prepare an aqueous solution of the metallic compounds. On the other hand, 40g oxalic acid is dissolved in 250ml aqueous solution of an organic amine based pH adjustor, e.g. 25wt.% tetramethylammonium hydroxide, and then the above-mentioned aqueous solution of the pH adjustor is added to prepare an oxalic acid based coprecipitating agent adjusted to pH 13.0. The afore-mentioned aqueous solution of the metallic compounds is subsequently added to the coprecipitating agent while stirring and the resultant blend is allowed to stand for about 1hr to coprecipitate the receptive barium, copper and yttrium in the form of oxalates or hydroxides. The resultant coprecipitates are then filtered, separated from liquids and dried at about 1,200 deg.C to afford the aimed ceramics raw material.

10. 发明专利

JPS63185401A METHOD AND APPARATUS FOR PRODUCING HIGH PURITY CHEMICALS 失效
公开(公告)号：JPS63185401A
公开(公告)日：1988-08-01
申请号：JP1521987
申请日：1987-01-27
申请人： TAMA KAGAKU KOGYO KK , MOSES LAKE IND INC
发明人： SHIMIZU SHUNPEI , YOSHIZAKO MAMORU , CHIYOU SHIYUNREN
IPC分类号： B01D3/00 , B01D3/16 , B01D3/22 , C01B7/07 , C01B7/13 , C01B7/19 , C01B11/16 , C01B21/46 , C07C17/383 , C07C45/78 , C07C45/81 , C07C45/82 , C07C51/44

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