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1. 发明专利

JP2006012954A Method for manufacturing wiring board and manufacturing facility used therefor 审中-公开
标题翻译：制造接线板的方法及其使用的制造设备
公开(公告)号：JP2006012954A
公开(公告)日：2006-01-12
申请号：JP2004184726
申请日：2004-06-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAEDA TADAYOSHI , OISHI JUNJI , ENDO KENJI
IPC分类号： H05K3/22 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board by which shortcircuiting between terminals becomes hard to be generated during baking of an insulating film.
SOLUTION: In a baking step 14, terminals 4 and 5 are electrically connected with a silver foil 9 and they are baked, and they are electrically isolated with each other after the baking step 14. Thus, the terminals 4 and 5 become nearly the same in potential during the baking step 14, so that shortcircuiting between the terminals 4 and 5 may be hard to be generated during the baking step 14 of the insulating layer.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于制造在绝缘膜烘烤期间端子之间短路难以产生的布线板的方法。解决方案：在烘烤步骤14中，端子4和5与银箔9电连接，并且它们被烘烤，并且在烘烤步骤14之后它们彼此电隔离。因此，端子4和5变成在烘烤步骤14期间几乎相同的电位，使得在绝缘层的烘烤步骤14期间端子4和5之间的短路可能难以产生。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005217005A Resin applying device 有权
标题翻译：树脂应用设备
公开(公告)号：JP2005217005A
公开(公告)日：2005-08-11
申请号：JP2004019595
申请日：2004-01-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OISHI JUNJI
IPC分类号： B05C5/00 , B05C9/12 , B05C9/14 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To uniformly apply resin on a whole semiconductor chip in short time in a resin applying device where underfill resin is applied to a gap between a substrate and the semiconductor chip which is mounted in phase down manner.
SOLUTION: Resin 4 is injected between the semiconductor chip 1 and the substrate 2, and a whole anchor block 7 rocks in cooperation with movement of a nozzle 3 by a nozzle moving means. Since capillarity can be promoted much more with the moving operation of the nozzle 3 after injection of resin 4 as a trigger by such constitution, resin 4 can uniformly be applied to the whole semiconductor chip 1 in short time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了在基板和以相位下降的方式安装的半导体芯片之间的间隙中将树脂施加到底部填充树脂的树脂施加装置中，在短时间内将树脂均匀地涂覆在整个半导体芯片上。解决方案：在半导体芯片1和基板2之间注入树脂4，整个锚块7通过喷嘴移动装置与喷嘴3的移动配合而摇摆。由于通过这种结构注入树脂4作为触发器之后喷嘴3的移动操作可以促进毛细作用，所以树脂4可以在短时间内均匀地施加到整个半导体芯片1上。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004342795A Light-emitting element module and its manufacturing method 审中-公开
公开(公告)号：JP2004342795A
公开(公告)日：2004-12-02
申请号：JP2003136965
申请日：2003-05-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWABE KAZUNARI , OISHI JUNJI
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To realize light-emitting element modules in which the dispersion of places where an LED element and a spherical lens are joined, is reduced and an optic axis displacement is difficult to occur by an extremely simple constitution, and also to provide a manufacturing method for the module.
SOLUTION: When the spherical lens 3 is inserted into a circuit board 1 to which a through-hole 2 having a taper is formed, the light-emitting element module is constituted so that the optic axis of the lens 3 and the optic axis of the LED element 5 coincide while the lens 3 is fixed through a cured resin 6.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004228350A Modular component with lead 有权
标题翻译：模块化元件与引线
公开(公告)号：JP2004228350A
公开(公告)日：2004-08-12
申请号：JP2003014557
申请日：2003-01-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OSHIMA SHIGENORI , OISHI JUNJI , URA AKIHIKO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To realize a modular component with leads having a sufficient self-standing property due to its simple constitution even when the size of the component is increased.
SOLUTION: This modular component has a group of leads 4. Of the leads 4, at least two leads 4 at prescribed spots respectively have bent parts 4a and 4b formed by bending the leads 4 into chevron-like forms at their midpoints. One 4a of the bent parts 4a and 4b comes into contact with the inner peripheral wall of a substrate mounting hole 6 in a direction which is almost perpendicular to the arranging direction of the leads 4 when the part 4a is inserted into the hole 6. In addition, the other bent part 4b comes into contact with the inner peripheral wall of the substrate mounting hole 6 on the opposite side when the part 4b is inserted into the hole 6. In addition, the bent parts 4a and 4b are disposed in a vertically deviated state.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：即使当部件的尺寸增加时，由于其简单的结构，实现具有足够的自立性能的引线的模块化部件。解决方案：该模块化组件具有一组引线4.在引线4中，在规定点处的至少两个引线4分别具有通过在其中点处将引线4弯曲成人字形形状而形成的弯曲部分4a和4b。当部分4a插入孔6中时，弯曲部分4a和4b的一个4a与衬底安装孔6的内周壁在几乎垂直于引线4的排列方向的方向上接触。此外，当部分4b插入孔6中时，另一个弯曲部分4b在相对侧的基板安装孔6的内周壁上接触。此外，弯曲部分4a和4b布置成垂直偏离状态版权所有（C）2004，JPO＆NCIPI

5. 发明专利

JP2004111916A Packaging module, manufacturing method thereof, and electronic equipment using the same 审中-公开
公开(公告)号：JP2004111916A
公开(公告)日：2004-04-08
申请号：JP2003190934
申请日：2003-07-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OISHI JUNJI
IPC分类号： H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To miniaturize with respect to a packaging module and a manufacturing method thereof.
SOLUTION: The packaging module includes a resin main body 1 and a plurality of electronic parts 2 having a part thereof are buried. The electronic parts 2 comprises an electrode 3 exposed outside of the main body 1, and the part of this electrode 3 exposed outside the main body 1 has a connection electrode 4 by a conductive paste. Consequently, electrical and mechanical connection with the electrode of the packaging module surely done by additionally bonding the conductive paste on the electrode of a board side with easily miniaturizing without the need of a drawing electrode to be placed separately.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2004253638A Optical component and method for manufacturing same 审中-公开
公开(公告)号：JP2004253638A
公开(公告)日：2004-09-09
申请号：JP2003042829
申请日：2003-02-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NISHIHARA KAZUNARI , FURUKAWA SHIGEO , YUBINAKA NOBUO , OISHI JUNJI
IPC分类号： G02B6/42 , H01L23/02 , H01L23/08 , H01L31/0232 , H01L33/58 , H01L33/64 , H01S5/022 , H01L33/00
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a compact and inexpensive optical component suitable for surface-mounting and its manufacturing method by achieving the connecting efficiency of an optical fiber and an optical semiconductor device with high precision.
SOLUTION: This optical component is configured of a recessed package 13 constituted of a ceramic laminate substrate, a groove 18 formed on the internal bottom face of the package 13, a light receiving or emitting element 16 mounted inside the groove 18, a lens 20 fixed to the center of a light receiving or emitting part 19 of the light receiving or emitting element 16, a cover 12 formed so that the opening of the package 13 can be covered and a window 11 positioned so as to be faced to the lens 20 as a portion of the cover 12. Thus, it is possible to increase the connecting efficiency with the optical fiber, and to realize the miniaturization and height reduction by providing the lens 20 mounted on the light receiving or emitting face of the light receiving or emitting element 16.
COPYRIGHT: (C)2004,JPO&NCIPI

7. 发明专利

JP2003078229A Component mounting substrate 审中-公开
标题翻译：组件安装基板
公开(公告)号：JP2003078229A
公开(公告)日：2003-03-14
申请号：JP2001326289
申请日：2001-10-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUGANO HIROMOTO , OISHI JUNJI , WATANABE TAKAKO
IPC分类号： H05K1/18
摘要： PROBLEM TO BE SOLVED: To prevent the size of a component mounting surface mounted on a mother substrate from increasing when a cover for vacuum suction is attached to the substrate.
SOLUTION: In a constitution composed of the substrate 1 and parts 2 and 3 mounted on the substrate 1, a suction plate 4 which makes suction easier by means of a suction nozzle is directly connected onto the parts 2 and 3 with an adhesive so as to eliminate the need of a space for attaching the cover for vacuum suction.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：当用于真空吸附的盖子附着到基板上时，防止安装在母体基板上的部件安装表面的尺寸增加。解决方案：在由基板1和安装在基板1上的部件2和3构成的结构中，通过吸嘴更容易吸引的吸板4用粘合剂直接连接到部件2,3上，以便无需安装用于真空抽吸的盖子的空间。

8. 发明专利

JP2005326212A Current sensing device and integrated circuit component using the device, and electrical apparatus using the same 审中-公开
标题翻译：使用该装置的电流感测装置和集成电路组件，以及使用该装置的电气装置
公开(公告)号：JP2005326212A
公开(公告)日：2005-11-24
申请号：JP2004143453
申请日：2004-05-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MATSUMOTO SUEO , URA AKIHIKO , OISHI JUNJI , WATANABE TAKAKO
IPC分类号： G01R15/14
摘要： PROBLEM TO BE SOLVED: To provide a current sensing device for motors and the like with high responsibility. SOLUTION: The present invention is a current sensing circuit wherein a current sensing resistor 72 has resistance which is higher than that of resistance elements 71a and 71b, a current sensing signal supplying pattern 74 is provided to face to or to be in parallel with the resistance elements 71a and 71b approximately, and the current directions of the current sensing signal supplying pattern 74 and the resistance elements 71a and 71b are the same. Therefore, an amplifier 9 can perform a build-up response instantaneously. As a result, influences caused by shapes of connecting patterns and component locations can be decreased, and good response characteristics can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供高效责任的电动机等的电流检测装置。解决方案：本发明是一种电流感测电路，其中电流感测电阻器72的电阻高于电阻元件71a和71b的电阻，电流感测信号提供模式74被设置为面向或并联电阻元件71a和71b近似，并且电流感测信号提供图案74和电阻元件71a和71b的电流方向相同。因此，放大器9可以立即执行积分响应。结果，可以降低由连接图案和部件位置的形状引起的影响，并且可以获得良好的响应特性。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005109136A Modular component and its manufacturing method 审中-公开
标题翻译：模块化组件及其制造方法
公开(公告)号：JP2005109136A
公开(公告)日：2005-04-21
申请号：JP2003340432
申请日：2003-09-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAWARA KYOKO , OISHI JUNJI
IPC分类号： H05K1/14 , H01L23/52 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To achieve the miniaturization of a modular component by using a plurality of mounting substrate on which a plurality of electronic components are mounted with simple configuration.
SOLUTION: This modular component comprises a plurality of mounted components sandwiched between a first substrate 6a and a second substrate 6b. The modular component has at least two or more first reference mounted components 3a, out of a plurality of mounted component which are mounted on the first substrate 6a taller than other mounted components and as tall as the components, the second substrate 6b provided along the top surface of at least two or more first reference mounted components 3a, and a plurality of first resin pillars 1 for positioning and holding the first substrate 6a and the second substrate 6b, wherein the first substrate 6a and the second substrate 6b are electrically connected together via the first reference mounted component 3a.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过使用其上以简单的构造安装有多个电子部件的多个安装基板来实现模块化部件的小型化。解决方案：该模块化部件包括夹在第一基板6a和第二基板6b之间的多个安装部件。模块化部件具有至少两个或更多个第一参考安装部件3a，多个安装部件安装在第一基板6a上，比其他安装部件高，并且与部件一样高，沿着顶部设置的第二基板6b 至少两个以上的第一基准安装部件3a的表面和用于定位和保持第一基板6a和第二基板6b的多个第一树脂柱1，其中第一基板6a和第二基板6b通过第一参考安装部件3a。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004342794A Light emitting element module and its manufacturing method 审中-公开
公开(公告)号：JP2004342794A
公开(公告)日：2004-12-02
申请号：JP2003136964
申请日：2003-05-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OISHI JUNJI , URA AKIHIKO , MATSUTANI TORU , SAKAMOTO MASAHIRO
IPC分类号： H01L33/58 , H01L33/62 , H01L33/00
CPC分类号： H01L2224/48091 , H01L2224/4917 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To realize a light emitting element module wherein the variations in a bonding position of an LED element and a spherical lens are less and the deviation of an optical axis is hardly generated by using a very simple constitution.
SOLUTION: The light emitting element module is provided with the LED element 1 and a spherical lens 2 which is so fixed that the optical axis may be in agreement on the LED element 1 and used for condensing light emitted from the LED element 1. The spherical lens 2 is positioned on the LED element 1 with at least three wires 4 which are formed by wire bonding at periphery of the LED element 1.
COPYRIGHT: (C)2005,JPO&NCIPI

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