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    • 1. 发明专利
    • Circuit board and chip mounting method
    • 电路板和芯片安装方法
    • JP2005216884A
    • 2005-08-11
    • JP2004017899
    • 2004-01-27
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • ONISHI HIROAKIMORI MASAHITOHIRANO MASATONAKANISHI SEISHIKOTANI AKIHIKO
    • H05K3/34H05K1/18
    • Y02P70/613
    • PROBLEM TO BE SOLVED: To mount a chip in a substrate with a high density and to miniaturize the circuit substrate. SOLUTION: The circuit board 1 includes the board 2 in which a circuit pattern 22 is formed, first chips 3a, 3b which are chip capacitors mounted through a solder 70a on the board 2, and a second chip 4 which is a chip resistor mounted in the opposite side through a solder 70b in the board 2 on the electrodes 31 of the first chips 3a, 3b. One electrode 41 of the second chip 4 is connected to the electrode 31 of the first chip 3a, and the electrode 41 of another side is connected to the electrode 31 of the first chip 3b. The chip is accumulated on a multiple step, the chip can be thereby mounted in the substrate with high density, and the circuit board 1 is miniaturized. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:将芯片安装在高密度的基板中并使电路基板小型化。 解决方案:电路板1包括其中形成电路图案22的板2,作为通过板2上的焊料70a安装的片状电容器的第一芯片3a,3b和作为芯片的第二芯片4 电阻器通过板2中的第一芯片3a,3b的电极31上的焊料70b安装在相对侧。 第二芯片4的一个电极41连接到第一芯片3a的电极31,另一侧的电极41连接到第一芯片3b的电极31。 芯片在多个步骤上积累,因此可以将芯片高密度地安装在基板中,并且电路板1小型化。 版权所有(C)2005,JPO&NCIPI
    • 2. 发明专利
    • Viscous fluid coater
    • VISCOUS流体涂层
    • JP2004344773A
    • 2004-12-09
    • JP2003144654
    • 2003-05-22
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • INABA YUZURUMAKINO YOICHIMORITA KEITAYAGI SHUZOONISHI HIROAKIYAMAUCHI MASARU
    • B05C5/00B05C11/00
    • PROBLEM TO BE SOLVED: To provide a coater for coating a work with viscous fluid, which hardly causes the dripping off of the viscous fluid and which realizes high speed and stable coating of the viscous fluid at a low cost by shortening a transfer time.
      SOLUTION: This coater has a coating head 3 for coating the work 2 with the viscous liquid A, an XY positioning mechanism 4 for positioning in the horizontal direction of the coating head 3 relative to the work 2, and a height direction positioning mechanism 5 for positioning in the height direction of the the coating head 3 relative to the work 2. In the process for coating the work 2 with the viscous liquid A after positioning the coating head A and the work at a prescribed distance, the coating is performed by finely vibrating the coating head 3 by using the height direction positioning mechanism 5 or the XY positioning mechanism 4.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种用粘合流体涂覆工件的涂布机,这几乎不会导致粘性流体滴落,并且通过缩短转印速度实现了低成本的粘性流体的高速和稳定的涂布 时间。 解决方案:该涂布机具有用于用粘性液体A涂覆工件2的涂覆头3,用于相对于工件2在涂覆头3的水平方向上定位的XY定位机构4,以及高度方向定位 机构5用于在涂覆头3相对于工件2的高度方向上定位。在将涂覆头A和工件定位在规定距离之后,用粘性液体A涂覆工件2的过程中,涂层是 通过使用高度方向定位机构5或XY定位机构4对涂布头3进行微调而进行。(C)2005,JPO&NCIPI
    • 4. 发明专利
    • REFLOW PREHEATING DRYING METHOD AND ITS DEVICE
    • JP2004255426A
    • 2004-09-16
    • JP2003049767
    • 2003-02-26
    • MATSUSHITA ELECTRIC IND CO LTD
    • TANIGUCHI MASAHIRONAGAI KOICHIONISHI HIROAKI
    • B23K31/02B23K1/008B23K3/04B23K101/42H05K3/34
    • PROBLEM TO BE SOLVED: To provide a reflow preheating drying method which can execute the reflow preheating drying in a short period of time while effectively preventing the occurrence of the droop of cream solder, and its device. SOLUTION: The reflow preheating drying method has: a first preheating process, in which heating to a printed circuit board 1 is executed at a preheating temperature increase speed higher than the maximum value in the droop allowable temperature increase speed range SE being the range of the preheating temperature increase speed capable of suppressing a droop amount of the cream solder 23 and which continues the heating to the temperature ST to generate the droop of the cream solder 23; a second preheating process, in which the printed circuit board 1 after the first preheating process is heated at the preheating temperature increase speed within the droop allowable temperature increase speed range SE and which continues the heating to the temperature ET to stop the progress of the droop of the cream solder 23; and a third preheating process, in which the printed circuit board 1 after the second preheating process is heated at the preheating temperature increase speed higher than the maximum value in the droop allowable temperature increase speed range SE and which continues the heating until it reaches the target temperature. COPYRIGHT: (C)2004,JPO&NCIPI
    • 8. 发明专利
    • SCREEN PRINTING DEVICE
    • JP2000309082A
    • 2000-11-07
    • JP11975999
    • 1999-04-27
    • MATSUSHITA ELECTRIC IND CO LTD
    • IIZUKA AKIRAMURAKAMI TOSHIYUKIONISHI HIROAKI
    • B41F15/08B41F15/42H05K3/34
    • PROBLEM TO BE SOLVED: To provide a screen printing device in which after-treatment work such as cleaning of a creamy printing agent adhering and remaining on a screen mask and the side of a squeezee is reduced and also visibility of the rolling state of the creamy printing agent can be secured. SOLUTION: The screen printing device is equipped with a first scraping plate 6a and a second scraping plate 6b which are supported vertically movably to a printing head 1. The first scraping plate 6a is brought into contact with a screen mask 3 only at a time when the printing head 1 is right moved. A creamy printing agent 4b on the screen mask 3, which is bulged from both ends of a second squeezee 2b at time of printing of the last time, is scraped in the central part of the squeezee. The second scraping plate 6b is brought into contact with the screen mask 3 only at a time when the printing head 1 is left moved. The creamy printing agent 4a on the screen mask 3, which is bulged form both ends of a first queegee 2a at the time previous time, is scraped in the central part of the squeezee.