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1. 发明专利

JP2012146730A Lead wire for solar cell and solar cell using the same 审中-公开
标题翻译：用于太阳能电池和太阳能电池的引线使用它
公开(公告)号：JP2012146730A
公开(公告)日：2012-08-02
申请号：JP2011001956
申请日：2011-01-07
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： NISHI HAJIME , SATO TAKUMI , TAKAHASHI TAKESHI , KURODA HIROMITSU , KIMOTO KUNIAKI , SAWAHATA KATSUNORI , HIGASHITANI IKU , TOGO YASUKI , AKUTSU HIROYUKI
IPC分类号： H01L31/042
CPC分类号： Y02E10/546
摘要： PROBLEM TO BE SOLVED: To provide a lead wire for a solar cell having excellent flex fatigue characteristics in which the solar cell (e.g. a silicon cell) is less susceptible to warpage or damage when bonding the lead wire even if the solar cell is made thin.SOLUTION: In the lead wire for a solar cell where the surface of a conductor is coated partially or entirely with plating, crystal grain size of the conductor is set in the range of 6-20 μm, 0.2% proof stress in tensile test is set to 90 MPA or lower, and the thickness of an oxide film on the surface of the conductor is set to 2 nm or thinner.
摘要翻译：要解决的问题：为了提供具有优异的挠曲疲劳特性的太阳能电池的引线，其中太阳能电池（例如硅电池）在接合引线时不太易于翘曲或损坏，即使太阳能电池变薄
解决方案：在导电体的表面部分或全部用镀层涂覆的太阳能电池的引线上，导体的晶粒尺寸设定在6-20μm的范围内，0.2％的拉伸应力测试设置为90MPA或更低，并且导体表面上的氧化膜的厚度设定为2nm或更薄。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011210868A Composite flat wire for connecting solar cell and method for manufacturing the same 审中-公开
标题翻译：用于连接太阳能电池的复合平面线及其制造方法
公开(公告)号：JP2011210868A
公开(公告)日：2011-10-20
申请号：JP2010075770
申请日：2010-03-29
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： TSUJI TAKAYUKI , KURODA HIROMITSU , TAKAHASHI TAKESHI , AKUTSU HIROYUKI , KIMOTO KUNIAKI
IPC分类号： H01L31/042 , C22C38/00 , C22C38/08 , H01B5/02 , H01B13/00
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a composite flat wire for connecting a solar cell and a method for manufacturing the same, which have low thermal expansion of the composite flat wire, and reduce the rigidity to enhance handling properties without increasing a ratio of a low thermal expansive core conductor to a cross-sectional area of the composite flat wire.SOLUTION: In the composite flat wires for connecting the solar cell 1 and 2, coating conductors 4 and 6 of copper or a copper alloy are formed on both faces or in the circumference of low thermal expansive core conductors 3 and 7 in which the coefficient of thermal expansion is equal to or less than 10×10/°C. The composite flat wire for connecting the solar cell has a mean value of the Vickers hardness of the coating conductors 4 and 6, equal to or less than 55 Hv.
摘要翻译：要解决的问题：为了提供一种用于连接太阳能电池的复合扁线及其制造方法，其具有低复合扁线的热膨胀，并且降低刚性以增加处理性能而不增加低的比率热膨胀芯导体连接到复合扁平线的横截面面积。解决方案：在用于连接太阳能电池1和2的复合扁平电线中，铜或铜合金的涂层导体4和6形成在两面或低热膨胀芯体导体3和7的周长，其中热膨胀系数等于或小于10×10 /℃。用于连接太阳能电池的复合扁平线具有等于或小于55Hv的涂层导体4和6的维氏硬度的平均值。

3. 发明专利

JP2010141050A Lead wire for solar cell and method of manufacturing the same 审中-公开
标题翻译：太阳能电池用引线及其制造方法
公开(公告)号：JP2010141050A
公开(公告)日：2010-06-24
申请号：JP2008314823
申请日：2008-12-10
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： NISHI HAJIME , TAKAHASHI TAKESHI , KURODA HIROMITSU , OKIKAWA HIROSHI , AKUTSU HIROYUKI , SAWAHATA KATSUNORI , BANDO CHU , HIGASHITANI IKU
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a lead wire for a solar cell hard to generate the warp or damage of a silicon cell during joining the lead wire to the cell even when the solar cell is made into a thin board, and excellent in a bending fatigue property. SOLUTION: The lead wire 13 for a solar cell, that is a conductor formed in a rectangular shape, or the conductor of the surface of which is partially or entirely coated with a solder-plated film, has a 0.2% strength value of 30-90 MPa in a peel test of the conductor. The grain diameter of the conductor is 6-20 μm. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使当太阳能电池制成薄板时，为了提供一种用于太阳能电池的引线，难以在将引线接合到电池的过程中产生硅电池的翘曲或损坏，并且具有优异的具有弯曲疲劳性能。解决方案：作为形成为矩形形状的导体或其表面的导体部分或全部涂覆有焊料镀膜的太阳能电池用引线13具有0.2％的强度值在导体的剥离试验中为30-90MPa。导体的晶粒直径为6-20μm。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2011091168A Solar cell lead wire and method of manufacturing the same, and solar cell using the same 有权
标题翻译：太阳能电池引线及其制造方法及使用其的太阳能电池
公开(公告)号：JP2011091168A
公开(公告)日：2011-05-06
申请号：JP2009242775
申请日：2009-10-21
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： HIGASHITANI IKU , KIMOTO KUNIAKI , AKUTSU HIROYUKI , ITO YUKIO , NISHI HAJIME , TAKAHASHI TAKESHI , KURODA HIROMITSU , OKIKAWA HIROSHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell lead wire with high cell cracking suppression effect and bonding reliability and a method of manufacturing the same, and a solar cell using the same. SOLUTION: The solar cell lead wire has a molten solder plating layer 13 formed on a surface of a belt-like conductive material 12 formed in a flat shape, wherein the belt-like conductive material 12 has a 0.2% proof stress value of ≤90 MPa by a tensile test, and the molten solder plating layer 13 is formed flatly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高电池破裂抑制效果和接合可靠性的太阳能电池引线及其制造方法，以及使用该太阳能电池引线的太阳能电池。
解决方案：太阳能电池引线具有形成在平坦形状的带状导电材料12的表面上的熔融焊料镀层13，其中带状导电材料12具有0.2％的屈服应力值的拉伸试验为≤90MPa，熔融焊料镀层13平坦地形成。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010199228A Wiring component for solar cell and method of manufacturing the same, and solar cell module 审中-公开
标题翻译：用于太阳能电池的配线组件及其制造方法和太阳能电池模块
公开(公告)号：JP2010199228A
公开(公告)日：2010-09-09
申请号：JP2009041058
申请日：2009-02-24
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： TAKAHASHI TAKESHI , NISHI HAJIME , NEMOTO SHINJI , SAWAHATA KATSUNORI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and high-reliability wiring component for a solar cell and a method of manufacturing the same, and a solar cell module. SOLUTION: The wiring component 1 for a solar cell has an insulating substrate 12 and a plurality of conductors 11 provided on the insulating substrate 12. Each outer peripheral surface of the plurality of conductors 11 is applied with plating. Each conductor 11 is partially cut. The wiring component for a solar cell also has each conductive plate 13 that electrically connects between the plurality of conductors 11. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于太阳能电池的便宜且高可靠性的布线部件及其制造方法以及太阳能电池模块。解决方案：用于太阳能电池的配线部件1具有绝缘基板12和设置在绝缘基板12上的多个导体11.多根导体11的每个外周表面都镀有电镀。每个导体11被部分切割。用于太阳能电池的布线组件也具有电连接在多个导体11之间的每个导电板13.版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010283138A Solar cell lead wire and method of manufacturing the same, and solar cell using the same 审中-公开
标题翻译：太阳能电池引线及其制造方法及使用其的太阳能电池
公开(公告)号：JP2010283138A
公开(公告)日：2010-12-16
申请号：JP2009135131
申请日：2009-06-04
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： SATO TAKUMI , NISHI HAJIME , TAKAHASHI TAKESHI , KURODA HIROMITSU , OKIKAWA HIROSHI , SHIRATO MASAO , BANDO CHU
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell lead wire which has high cell crack suppression effect and bonding reliability and suppresses a decrease in conversion efficiency and a method of manufacturing the same, and a solar cell using the same. SOLUTION: In a solar cell lead wire 10 (or 20) having fused solder plating layers 13a, 13b formed by supplying fused solder to a surface of a belt-like conductive material, a belt-like conductive material 12 (or 21) having corner parts beveled in a cross sectional shape is formed, fused solder is supplied to upper and lower surfaces of the belt-like conductive material 12 (or 21), and the upper and lower fused solder plating layers 13a, 13b (or 22a, 22b) are formed flatly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有高的电池裂纹抑制效果和接合可靠性并抑制转换效率降低的太阳能电池引线及其制造方法，以及使用该太阳能电池引线的太阳能电池。解决方案：在通过将熔融焊料供应到带状导电材料的表面而形成的具有熔融焊料镀层13a，13b的太阳能电池引线10（或20）中，形成带状导电材料12（或21 ）形成具有以横截面形状倒角的角部，将熔融焊料供给到带状导电材料12（或21）的上表面和下表面，并且上，下熔融焊料镀层13a，13b（或22a），22b）平坦地形成。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011119538A Lead wire for solar cell, method of manufacturing the same, and solar cell using the same 有权
标题翻译：用于太阳能电池的引线，其制造方法和使用其的太阳能电池
公开(公告)号：JP2011119538A
公开(公告)日：2011-06-16
申请号：JP2009276742
申请日：2009-12-04
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , Hitachi Magnet Wire Corp , 日立マグネットワイヤ株式会社 , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： NISHI HAJIME , SATO TAKUMI , TAKAHASHI TAKESHI , KURODA HIROMITSU , SAWAHATA KATSUNORI , TAKANO YUJI , AKUTSU HIROYUKI , HIGASHITANI IKU
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a lead wire for a solar cell which is low-cost, superior in design property, and superior in bondability to a cell. SOLUTION: The lead wire 1 for the solar cell which has a plating layer 4 formed on a surface of a belt-like conductive material 2 includes a coating layer 5 containing a self-fusing material outside the plating layer 4. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种低成本，优良的设计性能和与电池的可接合性优异的太阳能电池用引线。解决方案：具有形成在带状导电材料2的表面上的镀层4的太阳能电池用引线1包括在镀层4的外部含有自熔合材料的涂层5.
版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010205792A Solar cell lead, method of manufacturing same, and solar cell using same 审中-公开
标题翻译：太阳能电池引线，其制造方法和使用其的太阳能电池
公开(公告)号：JP2010205792A
公开(公告)日：2010-09-16
申请号：JP2009047033
申请日：2009-02-27
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： NISHI HAJIME , TAKAHASHI TAKESHI , KURODA HIROMITSU , OKIKAWA HIROSHI , KIMOTO KUNIAKI , AKUTSU HIROYUKI , ITO YUKIO , HIGASHITANI IKU
IPC分类号： H01L31/04
CPC分类号： H01L31/0508 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solar cell lead high in cell cracking suppressing effect and reliability in joining, a method of manufacturing same and a solar cell using the same. SOLUTION: In the solar cell lead in which solder plating is coated on the surface of a belt-shaped conductive material 12, the coated solder plating has a rugged part on its surface and a 0.2% proof stress value measured in a tensile test is not more than 90 MPa. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高的电池破裂抑制效果和接合可靠性的太阳能电池引线，其制造方法和使用该太阳能电池的太阳能电池。
解决方案：在带状导电材料12的表面上涂覆有焊料电镀的太阳能电池引线中，涂覆的焊料镀层在其表面上具有粗糙部分，并且在拉伸下测量的0.2％屈服应力值试验不超过90MPa。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2013033912A Light emitting element mounting substrate and led package 审中-公开
标题翻译：发光元件安装基板和LED封装
公开(公告)号：JP2013033912A
公开(公告)日：2013-02-14
申请号：JP2012064703
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , NEMOTO MASANORI , TANOI MINORU , TAKAHASHI TAKESHI
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L2224/16245 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide: a light emitting element mounting substrate which allows for flip chip mounting using a single-sided wiring board, and has excellent heat dissipation and light reflectivity, and facilitates dividing an LED package into individual pieces; and the LED package using the light emitting element mounting substrate.SOLUTION: A light emitting element mounting substrate 2 includes: a pair of wiring patterns 22A and 22B, each of which has a mounting region 30 configured to mount an LED chip 3 thereon, and is formed on a surface 20a of a resin film 20; a pair of filling parts 23A and 23B contacted with the pair of wiring patterns 22A and 22B, respectively; and an insulating layer 24 having light reflectivity which is formed on the surface 10a of the resin film 20 so as to cover the pair of wiring patterns 22A and 22B. The pair of filling parts 23A and 23B respectively have protruding parts 230 and 231 that protrude outward from the pair of wiring patterns 22A and 22B. The insulating layer 24 includes an opening 24a for passing bumps 32a and 32b electrically connected to the LED chip 3, in a region corresponding to the mounting region 30.
摘要翻译：要解决的问题：提供：一种发光元件安装基板，其允许使用单面布线板的倒装芯片安装，并且具有优异的散热和光反射率，并且有助于将LED封装分成单独的片; 以及使用发光元件安装基板的LED封装。解决方案：发光元件安装基板2包括：一对布线图案22A和22B，每个布线图案22A和22B具有安装区域30，其安装在其上的LED芯片3，并且形成在树脂的表面20a上电影20; 分别与一对布线图案22A和22B接触的一对填充部分23A和23B; 以及形成在树脂膜20的表面10a上以覆盖一对布线图案22A和22B的具有光反射率的绝缘层24。一对填充部分23A和23B分别具有从一对布线图案22A和22B向外突出的突出部分230和231。绝缘层24包括用于使电极连接到LED芯片3的凸起32a和32b在对应于安装区域30的区域中的开口24a。（C）2013，JPO和INPIT

10. 发明专利

JP2013033910A Substrate for mounting light emitting element, led package, and manufacturing method of led package 审中-公开
标题翻译： LED发光元件安装基板，LED封装及其制造方法
公开(公告)号：JP2013033910A
公开(公告)日：2013-02-14
申请号：JP2012064701
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , NEMOTO MASANORI , KITAMURA TETSURO , TAKAHASHI TAKESHI
IPC分类号： H01L33/62 , H01L23/02 , H01L23/12
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board, achieves good heat radiation, and easily makes LED packages into an individual piece, and to provide the LED package using the substrate for mounting the light emitting element and a manufacturing method of the LED package.SOLUTION: A substrate for mounting a light emitting element 2 includes: a pair of wiring patterns 22A, 22B formed on a surface 20a of a resin film 20 so as to have a mounting region 30 where an LED chip 3 is mounted and be arranged in a predetermined direction; and a pair of filling parts 23A, 23B which respectively contact with the pair of wiring patterns 22A, 22B. The pair of filling parts 23A, 23B has protruding parts 230, 231 which protrude outward from the pair of wiring patterns 22A, 22B when viewed from the surface 20a side of the resin film 20.
摘要翻译：要解决的问题：为了提供一种用于安装使用单面布线板进行倒装芯片安装的发光元件的基板，实现良好的散热，并且容易使LED封装成单件，并且提供LED 封装使用用于安装发光元件的基板和LED封装的制造方法。解决方案：用于安装发光元件2的基板包括：形成在树脂膜20的表面20a上的一对布线图案22A，22B，以便具有安装LED芯片3的安装区域30;以及沿预定方向布置; 以及分别与一对布线图案22A，22B接触的一对填充部23A，23B。一对填充部23A，23B具有从树脂膜20的表面20a侧观察时从一对配线图案22A，22B向外突出的突出部230,231。（C）2013，JPO＆INPIT

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