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    • 7. 发明专利
    • ROTATING AND SLANTING MECHANISM OF ELECTRONIC EQUIPMENT
    • JPH02248987A
    • 1990-10-04
    • JP6762189
    • 1989-03-22
    • HITACHI LTD
    • NAKAGAWA TAKESHIIWAI SUSUMUMIZUKAMI TAKAHARUFUKAZAWA YUTAKA
    • G06F1/16G06F1/18G09F9/00
    • PURPOSE:To uniformize operating forces for rotation and slanting and to reduce the size and improve the operability by providing the integrated mechanism which operates separately by a column and shafts for the rotation and slanting. CONSTITUTION:The hollow column 3 is provided on the top surface of a lower base 1, a rotation hole 29 wherein the hollow column 3 of the lower base 1 can be mounted and a couple of shafts 27 for slanting and moving a device main body 2 are provided in the center of a tilt base 7, and the device main body 2 is provided with a couple of lock parts 20 which engage the shafts 27 of the tilt base. Then, the device main body 2 is supported rotatably by the engagement between the hollow column 3 on the top surface of the lower part 1 and the rotation hole engagement part 29 of the tilt base 7 and the device main body 2 is supported in an inclinable state by the engagement be tween the couple of shafts 27 provided on the tilt base 7 and the engagement parts 20 provided to the device main body 2. Consequently, the device main body can be rotated and slanted with the uniform operating forces without being moved and the rotating and slanting mechanism can be reduced in size on the whole.
    • 8. 发明专利
    • SUBSTRATE PACKAGING STRUCTURE
    • JPH01170094A
    • 1989-07-05
    • JP32702287
    • 1987-12-25
    • HITACHI LTD
    • NAKAGAWA TAKESHIMIZUKAMI TAKAHARUIWAI SUSUMU
    • H05K7/20H05K7/14
    • PURPOSE:To enable the packaging of either a large circuit substrate or a small circuit substrate on the same slot by a method wherein a detachable substrate is provided. CONSTITUTION:A fastener 5 fixed to the through-hole of a fixed substrate 4 by soldering, a long hole 15 to which the protrusion of the fastener 5 is to be forcibly inserted, and a dislocation preventive stopper 6 are provided, a substrate guide 1 detachable from the fixed substrate 4 is provided, and a guide groove 14 for a small circuit substrate 13 to be mounted is provided to the substrate guide 1. And, the substrate guide 1 is mounted on the fixed substrate 4 of a case 7 being supported by the fastener 5 and the dislocation preventive stopper 6, and the edge of the small circuit substrate 13 to be mounted is fitted into the guide groove 14 of the substrate guide 1 to mount the small circuit substrate 13 on the fixed substrate 4. By these processes, either a large or a small circuit substrate can be packaged on the same slot, and a cooling is effectively performed without disturbing the flow of a cooling air.
    • 9. 发明专利
    • MANUFACTURE OF ELECTROCONDUCTIVE FIBER COMPOSITE RESIN
    • JPH01148515A
    • 1989-06-09
    • JP30560887
    • 1987-12-04
    • HITACHI LTD
    • GOTO MASAOWARATANI KENICHIIIDA MAKOTOOTA AKIICHIIWAI SUSUMU
    • B29B9/06B29B9/14B29B11/16H01B1/22
    • PURPOSE:To obtain an electroconductive fiber composite resin suitable for electromagnetic shielding of electronic equipment by a method wherein bundle conductors, each of which consists of fine strands and essential ingredient of which is iron-based metal fiber, are continuously fed by means of an extruder so as to be coveringly imbedded in thermoplastic resin matrix and the resultant composite resin is cut to proper lengths. CONSTITUTION:Electroconductive fibers are composed of at least two kinds of fibers selected from the group consisting of iron-based metal fibers having the cross-sectional diameter of 5-15mum, copper-based metal fibers having the diameter of 15-60mum, aluminum-based metal fibers having the diameter of 15-60mum and metal-clad fibers and the iron-based metal fiber is the essential ingredient of the electroconductive fibers. Further, through the three- dimensional intertwinement of the electroconductive fibers with one another or the presence of their contact points, electroconductive circuits having network structure are produced. Since the stress relaxation characteristics of resin must be higher than a certain level in order to maintain the contact pressure at the contact point, thermoplastic resin having a heat deformation temperature of 80-210 deg.C is used. Furthermore, a crosshead, on which dies 11-13 are mounted, is installed to a double screw extruder so as to continuously feed 2-5 bundles of electroconductive fibers 1, 2 or the like for covering with molten resin 30 in order to obtain a multi-core continuous body. Finally, after being cooled down, the continuous body is cut to proper lengths.
    • 10. 发明专利
    • Electronic device with low noise
    • 具有低噪声的电子设备
    • JPS60189522A
    • 1985-09-27
    • JP4402984
    • 1984-03-09
    • Hitachi Ltd
    • SHIMOIDE SHINICHIIWAI SUSUMU
    • G06F1/16G06F1/00
    • PURPOSE: To reduce the noise level of a cooling fan by providing in exposing a sound absorbing material along the ridgeline of a housing to a place near an opening at the upper part of the housing.
      CONSTITUTION: The sounds produced at an entrance of a fan are radiated into a cover 2 from an upper sucking opening part 6 of a housing 9 in the direction opposite to the air flowing direction. These sounds intend to go into the rear side by a diffraction phenomenon of a sound wave and are radiated to the outside through a cover opening part 10 after passing through a path between the cover 2 and the housing 9. Therefore it is needed to bond a sound absorbing material at a position having high energy density of sound in order to reduce the noise level without increasing the fluid resistance level. The sound absorbing material is bonded at a ridgeline part 8, i.e., a rack of a diffraction part of the sound wave as well as a ridgeline part 12 of the part 10 since these parts have the highest energy density. Thus the noise level can be extremely reduced.
      COPYRIGHT: (C)1985,JPO&Japio
    • 目的:通过提供将吸声材料沿着壳体的脊线曝光到壳体上部的开口附近的位置来降低冷却风扇的噪声水平。 构成:在风扇入口处产生的声音沿着与空气流动方向相反的方向从壳体9的上吸引开口部6辐射到盖2中。 这些声音将通过声波的衍射现象进入后侧,并且在穿过盖2和壳体9之间的路径之后通过盖开口部分10辐射到外部。因此,需要将 在具有高能量密度声音的位置处的吸音材料,以便在不增加流体阻力水平的情况下降低噪声水平。 由于这些部件具有最高的能量密度,吸音材料被接合在棱线部分8,即声波的衍射部分的齿条以及部分10的棱线部分12。 因此,噪音水平可以极大地降低。