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1. 发明专利

JP2012190252A Circuit information management device, method therefor and program 有权
标题翻译：电路信息管理设备，其方法和程序
公开(公告)号：JP2012190252A
公开(公告)日：2012-10-04
申请号：JP2011053115
申请日：2011-03-10
申请人： Fukuoka Univ , Keirex Technology Inc , Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , ケイレックス・テクノロジー株式会社 , 学校法人福岡大学 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , KAWASE EIJI , HORIUCHI HITOSHI
IPC分类号： G06F17/50
摘要： PROBLEM TO BE SOLVED: To provide a circuit information management device, etc. for displaying an amount of heat in a form of shadow in accordance with the path length of a wiring path and designing a via layout for optimizing a heat radiation effect.SOLUTION: A circuit information management device comprises: a circuit information storage part 21 for storing information on a circuit including a via and a chip for which a base area and height are set virtually; a layout part 22 for laying out circuit elements; a radiator light source layout part 24 for, when the via and the chip are connected through wiring, laying out a virtual point light source at a corresponding level above the via to the path length of a wiring path connecting to the chip; a heating element light source layout part 27 for laying out a virtual point light source at a corresponding level above the chip to power consumption; a shadow generation part 25 for using light emitted from each point light source to form shadows for an amount of heat radiated by the via and an amount of heat produced by the chip; a layout change part 29 for changing both or either one of the via and chip layouts so that, in a shadow area of the via and a shadow area of the chip, a difference between their overlapping area and the shadow area of the chip is minimized; and a display control part 26 for displaying formed shadows.
摘要翻译：要解决的问题：提供一种电路信息管理装置等，用于根据布线路径的路径长度显示阴影形式的热量并设计用于优化散热效果的通孔布局。电路信息管理装置包括：电路信息存储部分21，用于存储关于电路的信息，该电路包括基本区域和高度被虚拟地设置的通孔和芯片; 用于布置电路元件的布局部分22; 散热器光源布置部分24，用于当通孔和芯片通过布线连接时，将布置在通孔上方的相应电平处的虚拟点光源布置到连接到芯片的布线路径的路径长度; 用于将虚拟点光源布置在芯片上方的相应电平处的功率消耗的加热元件光源布置部分27; 用于使用从每个点光源发射的光形成由通路辐射的热量的阴影和由芯片产生的热量的阴影产生部分25; 布局改变部分29，用于改变通孔和芯片布局中的任何一个或任何一个，使得在通孔的阴影区域和芯片的阴影区域中，它们的重叠区域和芯片的阴影区域之间的差异被最小化 ; 以及用于显示形成的阴影的显示控制部26。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011002259A Method for measuring stress, sensor for measuring stress and device for evaluating residual stress 有权
标题翻译：测量应力的方法，用于测量应力的传感器和用于评估残余应力的装置
公开(公告)号：JP2011002259A
公开(公告)日：2011-01-06
申请号：JP2009143537
申请日：2009-06-16
申请人： Consortium For Advanced Semiconductor Materials & Related Technologies , Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Walts:Kk , 学校法人福岡大学 , 株式会社ウォルツ , 次世代半導体材料技術研究組合 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , KAWAJIRI TAKESHI , HORIUCHI HITOSHI , MORISHITA JUN , TAKIMOTO YOSHIO
IPC分类号： G01L1/00
摘要： PROBLEM TO BE SOLVED: To provide a method for measuring stress which measures the stress given to a substrate and a measuring object to which the substrate is fixed, based on a change in the resistance of a via chain, utilizing that a reversible resistance change is found out when the stress is given to the substrate provided with the via chain.SOLUTION: The prescribed substrate 10, on which the via chain 15 and pads 17 and 18 connected thereto are provided is fixed to the measuring object and electrical resistance between the pads, is measured; thereby the change in the resistance of the via chain 15 corresponding to the amplitude of the stress given to the measuring object is made detectable from outside in the condition that this stress is given also to the substrate 10, simultaneously. By understanding beforehand the relation between the change in the stress and the change in the resistance of the via chain 15, the stress value can be acquired from the resistance value of the via chain 15. The stress given to the measuring object can be measured with good sensitivity, on the basis of the property that the resistance changes greatly, compared with the case of a piezo resistance effect, with respect to the same stress.
摘要翻译：要解决的问题：为了提供一种测量应力的方法，其基于通孔链的电阻的变化来测量施加到基板和固定基板的测量对象的应力，利用可逆电阻变化为当给予设置有通孔链的基板时发现应力。解决方案：设置有通孔链15和连接到其上的焊盘17和18的规定基板10固定到测量对象，并且焊盘之间的电阻，被测量从而在向该基板10同时施加该应力的条件下，可以从外部检测对应于施加到测量对象的应力的振幅的通孔链15的电阻的变化。通过预先理解应力变化与通孔链15的电阻变化之间的关系，可以从通孔链15的电阻值获得应力值。给予测量对象的应力可以用在良好的灵敏度的基础上，电阻变化很大，与压电电阻效应相比，相同的应力。

3. 发明专利

JP2010056429A Mounting evaluation structure and mounting evaluation method 有权
标题翻译：安装评估结构和安装评估方法
公开(公告)号：JP2010056429A
公开(公告)日：2010-03-11
申请号：JP2008221949
申请日：2008-08-29
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Walts:Kk , 学校法人福岡大学 , 株式会社ウォルツ , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , MORISHITA JUN , HORIUCHI HITOSHI
IPC分类号： H01L21/60
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting evaluation structure and a mounting evaluation method, which three-dimensionally evaluate a mounting state of a chip on a substrate without depending on viewing.
SOLUTION: A plurality of capacitance parts 30 including a plurality of first electrode patterns 30a arranged on a mounting face 10a of a mounting evaluation substrate 10 and a plurality of second electrode patterns 30b which confront with the first electrode patterns 30a and are installed on a lower face 20a of a mounting evaluation chip 20 are formed in the mounting evaluation structure. Capacitances in a plurality of the capacitance parts 30 are compared. The mounting state of the mounting evaluation chip 20 on the mounting evaluation substrate 10 is evaluated based on a comparison result.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装评估结构和安装评估方法，其三维地评估芯片在基板上的安装状态，而不依赖于观看。解决方案：包括布置在安装评估基板10的安装面10a上的多个第一电极图案30a和与第一电极图案30a相对的多个第二电极图案30b的多个电容部件30 在安装评估结构中形成安装评估芯片20的下表面20a。比较多个电容部30中的电容。基于比较结果来评价安装评估用芯片20在安装评价基板10上的安装状态。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2012103068A Mems measurement method 有权
标题翻译： MEMS测量方法
公开(公告)号：JP2012103068A
公开(公告)日：2012-05-31
申请号：JP2010250871
申请日：2010-11-09
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Optical Comb Inc , Yuji Kikaku Ltd , ユージ企画有限会社 , 学校法人福岡大学 , 株式会社光コム , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , YOSHIDA KEISUKE , SUEYOSHI HARUKI , IMAI KAZUHIRO , YASUKOCHI YUJI
IPC分类号： G01H9/00 , B81C99/00
摘要： PROBLEM TO BE SOLVED: To provide a MEMS measurement method for similarly measuring oscillation states at a predetermined point of time at many measuring points of MEMS by simultaneously irradiating many parts of the oscillated MEMS with a laser beam and for exactly grasping the oscillation states of respective parts of the MEMS by excluding an influence of an excitation part side to the MEMS.SOLUTION: Only an oscillation component of a movable part 81 is taken out from a result of synthesis of unnecessary oscillation components of an excitation part, correct oscillation characteristics of the movable part 81 are acquired, and features of oscillation to appear based on the structure of a MEMS 80 are certainly grasped by simultaneously irradiating the movable part 81 and a fixed part 82 of the MEMS 80 under oscillation with many laser beams with mutually different frequencies, detecting reflected beams from the respective irradiation positions of the MEMS 80 by an optical detection part as interference beams, calculating oscillation states of the MEMS 80 at the respective irradiation positions from information which can be taken out from a detection signal, and further calculating a difference of an oscillation state at the movable part 81 to an oscillation state of the fixed part.
摘要翻译：要解决的问题：为了提供MEMS测量方法，用于通过用激光束同时照射振荡的MEMS的许多部分并且精确地掌握振荡来在MEMS的许多测量点处类似地测量在预定时间点的振荡状态通过排除激励部分侧对MEMS的影响，MEMS的各部分的状态。解决方案：从合成激励部分的不必要的振荡分量的结果中，仅可以取出可动部81的振动分量，获得可动部81的正确的振动特性，基于通过同时以相互不同的频率的许多激光束同时照射MEMS 80的可动部分81和固定部分82来确定MEMS 80的结构，该激光束具有来自MEMS 80的各个照射位置的反射光束，光检测部分作为干涉光束，从可从检测信号中取出的信息计算各个照射位置处的MEMS 80的振荡状态，并且还计算可动部81的振荡状态的差与振动状态固定部分。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011128711A Circuit information management device, method thereof, and program 有权
标题翻译：电路信息管理设备，其方法和程序
公开(公告)号：JP2011128711A
公开(公告)日：2011-06-30
申请号：JP2009284310
申请日：2009-12-15
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Keirex Technology Inc , ケイレックス・テクノロジー株式会社 , 学校法人福岡大学 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , KAWASE EIJI , HORIUCHI HITOSHI , SAI KUMO
IPC分类号： G06F17/50
摘要： PROBLEM TO BE SOLVED: To provide a wiring information management device or the like, for storing relevant information among components in a wiring pattern as shading information generated among components, and for displaying the wiring pattern with accuracy and with configurations, which it is easily viewable by a designer, by devising the display configurations of the shading information.
SOLUTION: A circuit information management device includes: a circuit information storage part 22 for storing the information of each of elements configuring a circuit; a light source information setting part 23 for setting a virtual light source at an arbitrary position in a space; a shading state detection part 24 for detecting an inter-element shading state generated with the rays of light from the set light source about a plurality of arbitrary elements; a relevant information calculation part 25 for calculating relevant information among a plurality of arbitrary elements; a shading information storage part 26 for storing information related with the shading information and the relevant information as the shading information among the plurality of elements; and a display control part 27 for controlling the display of the information stored by the circuit information storage part 22 and the shading information storage part 26.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供布线信息管理装置等，用于在布线图案中的各组件之间存储相关信息，作为在各部件之间生成的阴影信息，并且用于以精确和配置显示布线图案，其中通过设计阴影信息的显示配置，设计者很容易看到。电路信息管理装置包括：电路信息存储部22，用于存储构成电路的各元件的信息; 用于将虚拟光源设置在空间中的任意位置的光源信息设定部23; 阴影状态检测部分24，用于检测由围绕多个任意元素的来自设置光源的光线产生的元素间着色状态; 相关信息计算部25，用于计算多个任意要素之间的相关信息; 遮蔽信息存储部分26，用于在多个元素中存储与遮蔽信息和相关信息相关的信息作为阴影信息; 以及显示控制部27，用于控制由电路信息存储部22和遮蔽信息存储部26存储的信息的显示。权利要求：（C）2011，JPO＆INPIT

6. 发明专利

JP2011059011A Mems measuring device 有权
标题翻译： MEMS测量装置
公开(公告)号：JP2011059011A
公开(公告)日：2011-03-24
申请号：JP2009210754
申请日：2009-09-11
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Optical Comb Inc , Yuji Kikaku Ltd , ユージ企画有限会社 , 学校法人福岡大学 , 株式会社光コム , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , YOSHIDA KEISUKE , SUEYOSHI HARUKI , IMAI KAZUHIRO , YASUKOCHI YUJI
IPC分类号： G01H9/00
摘要： PROBLEM TO BE SOLVED: To provide an MEMS measuring device that measures vibration conditions in the same way at the specified timing at a number of MEMS measuring points and surely find out features of a vibration in each part of the MEMS by applying laser beams to a number of points of the vibrated MEMS at the same time.
SOLUTION: A number of laser beams with different frequencies are applied to a number of points of vibrating MEMS 80 at the same time, and reflection beams from each of irradiated points of the MEMS 80 are detected as an interference beam by an optical detection unit 50. Information picked up from the obtained detection signal is used to find out vibration conditions at each of applied positions of the MEMS 80, and therefore vibration conditions can be detected at the plurality of points of the MEMS at the same timing. A variance of vibration at each unit of the MEMS 80 at the specified timing is measured, and features of vibration that appears depending on the structure of the MEMS 80 can surely be understood.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种MEMS测量装置，其在多个MEMS测量点的指定时刻以相同的方式测量振动条件，并且通过应用激光器确定地找出MEMS各部分中的振动的特征光束同时振动的MEMS的多个点。解决方案：将许多具有不同频率的激光束同时施加到多个振动MEMS 80的点，并且来自MEMS 80的每个照射点的反射光束通过光学器件被检测为干涉光束从所获得的检测信号中拾取的信息用于在MEMS 80的每个施加位置找出振动条件，因此可以在相同的定时在MEMS的多个点处检测振动条件。测量在指定时刻的MEMS 80的每个单元处的振动的变化，并且可以肯定地理解根据MEMS 80的结构出现的振动特征。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010056428A Check pattern and packaging evaluation device 有权
标题翻译：检查图案和包装评估设备
公开(公告)号：JP2010056428A
公开(公告)日：2010-03-11
申请号：JP2008221948
申请日：2008-08-29
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Walts:Kk , 学校法人福岡大学 , 株式会社ウォルツ , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , MORISHITA JUN , HORIUCHI HITOSHI
IPC分类号： H01L21/66 , H01L21/822 , H01L27/04
摘要： PROBLEM TO BE SOLVED: To provide a check pattern and packaging evaluation device, for performing the loading evaluation of a semiconductor chip, by easily and surely detecting a damage generated on the outside of a guard ring.
SOLUTION: In a detection part 20, a plurality of electric circuits 2 are connected in parallel, or arranged in parallel with a predetermined interval, from a scribing area 6 for dicing to the outside area of the guard ring 4, toward the inner side of the semiconductor chip 5a. An output terminal 3 is connected to the detection part 20, and arranged on the outside of the guard ring 4. The condition of the damage generated on the outside area of the guard ring 4 is analyzed, based on a deviation amount of impedance owing to a break in the electric circuits 2.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种检查图案和包装评估装置，用于通过容易且可靠地检测在护环外部产生的损伤来执行半导体芯片的负载评估。解决方案：在检测部分20中，多个电路2从用于切割的划线区域6到保护环4的外部区域并行连接或以预定间隔平行地布置，朝向半导体芯片5a的内侧。输出端子3连接到检测部分20，并且布置在保护环4的外侧。基于由于防护环4的阻抗的偏差量而分析在保护环4的外部区域上产生的损坏的状况电路中断2.版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2012043651A Three-dimensional image measuring device and three-dimensional image measuring method 有权
标题翻译：三维图像测量装置和三维图像测量方法
公开(公告)号：JP2012043651A
公开(公告)日：2012-03-01
申请号：JP2010184024
申请日：2010-08-19
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , 学校法人福岡大学 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , SUEYOSHI HARUKI
IPC分类号： H01J37/28 , G01B15/08 , G01N23/225
摘要： PROBLEM TO BE SOLVED: To provide a three-dimensional image measuring device capable of specifying flow portions and failure portions of a semiconductor device and a device system using a three-dimensional current image.SOLUTION: A three-dimensional image measuring device 100 comprises a scanning circuit 24 for outputting scanning signals to a scanning mirror 23, an optical axial direction moving mechanism 26 for changing a relative distance between a specimen 200 and a second objective lens 25 in an optical axial direction by moving the second objective lens 25 along the optical axis, an optical axial direction movement control circuit 27 for outputting control signals to the optical axial direction moving mechanism 26, a conductive probe 31 for outputting induced current flowing through the specimen 200, and an operation part 43 for constructing a two-dimensional current image of the specimen 200 based on the scanning signals from the scanning circuit 24 and a current value from the conductive probe 31, and constructing a three-dimensional image to which each of the two-dimension current images is overlaid at each relative distance changed by the optical axial direction moving mechanism 26.
摘要翻译：要解决的问题：提供一种能够指定半导体器件的流动部分和故障部分以及使用三维当前图像的器件系统的三维图像测量装置。解决方案：三维图像测量装置100包括用于将扫描信号输出到扫描镜23的扫描电路24，用于改变样本200和第二物镜25之间的相对距离的光轴方向移动机构26 沿着光轴移动第二物镜25的光轴方向的光轴方向移动控制电路27，用于向光轴方向移动机构26输出控制信号的光轴方向移动控制电路27，用于输出流过试样的感应电流的导电探针31 200，以及用于根据来自扫描电路24的扫描信号和来自导电探针31的电流值构成样本200的二维电流图像的操作部43，并构成三维图像，在由光轴向移动机构26改变的每个相对距离处重叠两维电流图像 PYRIGHT：（C）2012，JPO＆INPIT

9. 发明专利

JP2012009613A Wiring board formation method, and wiring board 有权
标题翻译：接线板形成方法和接线板
公开(公告)号：JP2012009613A
公开(公告)日：2012-01-12
申请号：JP2010144057
申请日：2010-06-24
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Nippon Steel Chem Co Ltd , 学校法人福岡大学 , 新日鐵化学株式会社 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , FUJISHIRO KOICHI , ITAHARA SHUNEI , SAITO TORU , HAYASHI SHIGEHIRO
IPC分类号： H01L23/12 , H01L23/14 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a wiring board formation method and the like capable of significantly reducing labor and cost for manufacturing a wiring board, by forming a decoupling capacitor at the same time a wiring pattern is formed.SOLUTION: The wiring board formation method includes steps of: forming cylindrical via insulation parts 3a and 3b and via conduction parts 4a and 4b on a silicon substrate 2; forming an induction part 5a by extending an insulation material which is laminated on a peripheral region of the via conduction part 4a to be connected to a tubular end part of the via insulation part 3a across the entire circumference; forming an insulation part 5b by extending the insulation material laminated in the peripheral region of the via conduction part 4b so that a portion does not come in contact with the tubular end part of the via insulation part 3b; and forming wiring parts 6a and 6b which are connected to the via conduction parts 4a and 4b while being laminated on surfaces of the induction part 5a and the insulation part 5b. The wiring part 6a is connected to a power source, the wiring part 6b is connected to the ground, and then the wiring part 6a and the silicon substrate 2 sandwich the induction part 5a to form a capacitor.
摘要翻译：解决问题的方案为了提供能够显着降低制造布线板的人力和成本的布线基板的形成方法等，通过在形成布线图案的同时形成去耦电容器。线路板形成方法包括以下步骤：在硅衬底2上形成圆柱形通孔绝缘部分3a和3b以及通过导电部分4a和4b; 通过延伸绝缘材料形成感应部分5a，所述绝缘材料层压在通孔导电部分4a的周边区域上，以连接到通孔绝缘部分3a的整个圆周上的管状端部; 通过使层叠在通路导通部4b的周边区域的绝缘材料延伸而形成绝缘部5b，使得部分不与通孔绝缘部3b的管状端部接触; 以及在层压在感应部5a和绝缘部5b的表面上的同时形成与通孔导通部4a，4b连接的配线部6a，6b。布线部分6a连接到电源，布线部分6b连接到地，然后布线部分6a和硅基片2夹着感应部分5a形成电容器。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2010066995A Display control device, display control method and display control program 有权
标题翻译：显示控制装置，显示控制方法和显示控制程序
公开(公告)号：JP2010066995A
公开(公告)日：2010-03-25
申请号：JP2008232554
申请日：2008-09-10
申请人： Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko Zaidan , Fukuoka Univ , Keirex Technology Inc , ケイレックス・テクノロジー株式会社 , 学校法人福岡大学 , 財団法人福岡県産業・科学技術振興財団
发明人： TOMOKAGE HAJIME , KAWASE EIJI , YAMADA TAKESHI
IPC分类号： G06F17/50 , G06F3/048 , G06T13/20
摘要： PROBLEM TO BE SOLVED: To provide a display control device or the like which simultaneously displays relationship between physical properties of a display object and changes thereof, and displays various expressions while reducing the amount of data.
SOLUTION: External force information 204 about a force applied from the outside to the display object having a plurality of physical properties is added to the basic information of the display object (3D circuit data 201, 3D shape data 202) to create state change information. Based on the state change information, information about two or more physical properties of the display object are extracted. For each of the information extracted, difference data 203 between the basic information and the state change information with the external force information 204 added thereto is extracted. Based on the basic information and the difference data 203, the information about the two or more physical properties extracted are associated with each other to display a change in the display object.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供同时显示显示对象的物理特性与其变化之间的关系的显示控制装置等，并且在减少数据量的同时显示各种表达。解决方案：关于从外部施加到具有多个物理特性的显示对象的力的外力信息204被添加到显示对象（3D电路数据201，3D形状数据202）的基本信息以创建状态更改信息。基于状态变化信息，提取关于显示对象的两个以上的物理属性的信息。对于所提取的每个信息，提取基本信息和状态改变信息之间的差分数据203与外加力信息204相加。基于基本信息和差异数据203，关于提取的两个或多个物理属性的信息彼此相关联，以显示显示对象的变化。版权所有（C）2010，JPO＆INPIT

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