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1. 发明专利

JP2013206965A Printed circuit board manufacturing method 审中-公开
标题翻译：印刷电路板制造方法
公开(公告)号：JP2013206965A
公开(公告)日：2013-10-07
申请号：JP2012071795
申请日：2012-03-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKAHASHI TETSUYA , MORIYA YASUO , NAKAMURA KIMIYASU
IPC分类号： H01L21/60 , H05K3/32 , H05K3/34
CPC分类号： H05K3/305 , H01L21/563 , H01L21/566 , H01L23/562 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75304 , H01L2224/75317 , H01L2224/7532 , H01L2224/75745 , H01L2224/75983 , H01L2224/81191 , H01L2224/83192 , H01L2224/9211 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method which can achieve uniformity of a load when a semiconductor chip is pressed to a substrate for mounting the semiconductor chip on the substrate.SOLUTION: A printed circuit board manufacturing method comprises: forming on a support face 14S of a mounting stage 14, a concave cavity 36 which curves from a flat plane 34 on an outer edge; and forming in the cavity 36, a slanted plane 36S slanting toward a center. When a semiconductor chip 24 is pressed to a package substrate 16, the package substrate 16 bends along the cavity 36 to uniform a distance D1 between the semiconductor chip 24 and the package substrate 16.
摘要翻译：要解决的问题：提供一种印刷电路板的制造方法，其可以在将半导体芯片按压到用于将半导体芯片安装在基板上的基板上时实现负载的均匀性。解决方案：印刷电路板的制造方法包括：安装台14的支撑面14S，从外边缘上的平面34弯曲的凹腔36; 并且在空腔36中形成朝向中心倾斜的倾斜平面36S。当将半导体芯片24按压到封装基板16时，封装基板16沿着空腔36弯曲以使半导体芯片24与封装基板16之间的距离D1均匀化。

2. 发明专利

JP2013039950A Packaging box 审中-公开
标题翻译：包装盒
公开(公告)号：JP2013039950A
公开(公告)日：2013-02-28
申请号：JP2011178637
申请日：2011-08-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKAHASHI TETSUYA
IPC分类号： B65D81/02 , B65D5/50
CPC分类号： B65D5/5028
摘要： PROBLEM TO BE SOLVED: To adjust the looseness of a film for retaining an article on an article mounting plane part in a packaging box.SOLUTION: The packaging box includes an exterior part 20 and a packaging component 10 that is set in the exterior part 20. The packaging component 10 includes the article mounting plane part 11 on which the article 100 is mounted, and a pair of downward-bent parts 16 that are bent downward from the front end and the rear end of the article mounting plane part 11 with respect to the side on which the article is mounted. The film F for covering and holding the article 100 is adhered to the pair of downward-bent parts. The pair of downward-bent parts 16 include an outward-bent part 16g that is disposed outside the downward-bent parts 16, and that is bent with respect to the downward-bent parts 16.
摘要翻译：要解决的问题：调节用于将物品保持在包装盒中的物品安装平面部分上的胶片的松动度。解决方案：包装盒包括外部部件20和设置在外部部件20中的包装部件10.包装部件10包括物品安装平面部分11，物品100安装在该物品安装平面部分11上，一对向下弯曲部16，其相对于安装物品的一侧从物品安装平面部11的前端和后端向下弯曲。用于覆盖和保持物品100的膜F被粘附到一对向下弯曲部分。一对向下弯曲部16包括设置在向下弯曲部16的外侧并相对于向下弯曲部16弯曲的向外弯曲部16g。（C）2013， JPO和INPIT

3. 发明专利

JP2012079876A Method of manufacturing electronic device, and electronic device 审中-公开
标题翻译：制造电子器件的方法和电子器件
公开(公告)号：JP2012079876A
公开(公告)日：2012-04-19
申请号：JP2010222928
申请日：2010-09-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKEUCHI SHUICHI , KOYAE KENJI , SATO YOSHIYUKI , ISHIKAWA NAOKI , MIYAKOSHI TAKESHI , TAKAHASHI TETSUYA
IPC分类号： H01L21/60 , H01L21/56 , H01L23/12
CPC分类号： H01L23/49894 , H01L21/4846 , H01L21/563 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , Y10T29/4913 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a structure that increases the reliability of an electronic component by reducing voids present in a gap between the electronic component and a circuit board.SOLUTION: A method of manufacturing an electronic device comprises the steps of: supplying a first resin material in a film thinner than the space of a gap between a circuit board 10 and the electronic component onto electrode portions of the circuit board 10 or terminal portions of the electronic component; after the supply of the first resin material, melting a solder material 30 disposed on the electrode portions of the circuit board 10 or the terminal portions of the electronic component at a first temperature while keeping the terminal portions of the electronic component in contact with the electrode portions of the circuit board 10 to thus connect the terminal portions of the electronic component to the electrode portions of the circuit board 10; after the connection of the terminal portions of the electronic component to the electrode portions of the circuit board 10, filling the gap between the circuit board 10 and the electronic component with a second resin material; and heating the second resin material at a second temperature lower than the first temperature.
摘要翻译：要解决的问题：提供通过减少电子部件和电路板之间的间隙中存在的空隙来提高电子部件的可靠性的结构。解决方案：一种制造电子器件的方法包括以下步骤：将电路板10和电子部件之间的间隙的空间比第一树脂材料提供给电路板10的电极部分或电子部件的端子部分; 在供给第一树脂材料之后，在保持电子部件的端子部分与电极接触的同时，在第一温度下熔化设置在电路板10的电极部分或电子部件的端子部分上的焊料材料30 电路板10的一部分，从而将电子部件的端子部分连接到电路板10的电极部分; 在将电子部件的端子部分连接到电路板10的电极部分之后，用第二树脂材料填充电路板10和电子部件之间的间隙; 以及在低于第一温度的第二温度下加热第二树脂材料。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011243683A Electronic component mounting method, electronic component manufacturing method and electronic component, and electronic component manufacturing apparatus 审中-公开
标题翻译：电子元件安装方法，电子元件制造方法和电子元器件及电子元器件制造设备
公开(公告)号：JP2011243683A
公开(公告)日：2011-12-01
申请号：JP2010113115
申请日：2010-05-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKEUCHI SHUICHI , KOBAE KENJI , TAKAHASHI TETSUYA
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/562 , H01L2224/16225 , H05K3/3436 , Y10T29/4913 , Y10T29/53174
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting method which allows electrodes of electronic components to be joined firmly to the electrodes of a printed circuit board even when any electronic component is warped when heated, an electronic component manufacturing method and electronic components, and an electronic component manufacturing apparatus.SOLUTION: An electronic component 1 includes a substrate body 2 which has arranged thereon in lattice form a plurality of electrodes 3a-3e comprising the electronic component 1. Of the plural electrodes 3a-3e, the electrodes 3a and 3e having a designated height are disposed at an outer position of the substrate body 2 which warps greater than the other position, and the electrodes 3b, 3c, and 3d, with their solder balls flattened to a lower height than that of the electrodes 3a and 3e at the outer position by a pressure applied from a pressurizing head 4, are disposed in a central position which warps less than the outer position.
摘要翻译：要解决的问题：为了提供即使当加热时任何电子部件翘曲时，电子部件的电极也可以牢固地连接到印刷电路板的电极的电子部件安装方法，电子部件制造方法和电子部件和电子部件制造装置。解决方案：电子部件1包括以格子形式构成包括电子部件1的多个电极3a-3e的基板主体2.在多个电极3a-3e中，具有指定的电极3a，3e 高度设置在基板主体2的大于另一个位置的外部位置处，并且电极3b，3c和3d被布置成比在外部的电极3a和3e的焊球低的高度通过从加压头4施加的压力的位置设置在扭曲小于外部位置的中心位置。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2010237877A Rfid tag, and method for manufacturing the same 审中-公开
标题翻译： RFID标签及其制造方法
公开(公告)号：JP2010237877A
公开(公告)日：2010-10-21
申请号：JP2009083758
申请日：2009-03-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKEUCHI SHUICHI , KOYAE KENJI , MATSUMURA TAKAYOSHI , TAKAHASHI TETSUYA
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： G06K19/07749 , G06K19/07728
摘要： PROBLEM TO BE SOLVED: To provide an RFID (Radio Frequency Identification) tag which can reduce cost by eliminating a reinforcing plate, and to provide a method for manufacturing the RFID tag. SOLUTION: The RFID 1 includes: an IC chip 38 forming the RFID tag 1; an inlet 33 having an antenna substrate 35 formed to be curved to the opposite side of the face to which the IC chip 38 is bonded; and a joyning layer 33b in which a conductive filler 8 is incorporated, and the IC chip 38 is mutually joined with the inlet 33. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种RFID（射频识别）标签，其可以通过消除加强板来降低成本，并提供制造RFID标签的方法。解决方案：RFID 1包括：形成RFID标签1的IC芯片38; 入口33，其具有形成为与IC芯片38接合的面的相对侧弯曲的天线基板35; 以及其中结合有导电填料8的欢快层33b，并且IC芯片38与入口33相互连接。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2009123281A Head control method, control device and storage device 有权
标题翻译：头控制方法，控制装置和存储装置
公开(公告)号：JP2009123281A
公开(公告)日：2009-06-04
申请号：JP2007295864
申请日：2007-11-14
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKAHASHI TETSUYA
IPC分类号： G11B21/21
CPC分类号： G11B5/3136 , G11B5/6005
摘要： PROBLEM TO BE SOLVED: To keep a head element at a target flying height by accurately controlling, for respective heads, an energization amount applied to a heater element even under any temperature environment.
SOLUTION: A reference resistance value is stored in a reference resistance value table 701, an energization resistance correlation value is stored in an energization resistance correlation value table 702, a resistance value measuring part 804 measures a resistance value of a storage element 122 in idle during normal operation, an energization amount calculating part 805 uses the energization resistance correlation value to calculate an energization amount at which a measured resistance value becomes the same value as the reference resistance value. When write processing and read processing are performed, a heater control part 801 adds the calculated energization amount to a heater element 121.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了将头元件保持在目标飞行高度，即使在任何温度环境下，对于各个头也准确地控制施加到加热元件的通电量。解决方案：参考电阻值存储在参考电阻值表701中，通电电阻相关值存储在通电电阻相关值表702中，电阻值测量部804测量存储元件122的电阻值在正常运行中，通电量计算部805使用通电电阻相关值来计算测量电阻值与参考电阻值相同的通电量。当执行写入处理和读取处理时，加热器控制部分801将计算的通电量与加热器元件121相加。版权所有：（C）2009，JPO＆INPIT

7. 发明专利

JPH06152161A CABLE HOLDER 失效
公开(公告)号：JPH06152161A
公开(公告)日：1994-05-31
申请号：JP29477792
申请日：1992-11-04
申请人： FUJITSU LTD
发明人： SATO TAKASHI , HONGO TOMOYUKI , TAKAHASHI TETSUYA , TAKAHASHI TSUTOMU
IPC分类号： H05K7/00
摘要： PURPOSE:To insert and pull a cable without exerting an excessive force on the cable and to simply ground the cable via a holder main body when the cable is a shielded cable. CONSTITUTION:The title holder is constituted of a holder main body 1a which is formed by bending a springy metal thin sheet or a conductive synthetic resin material and into, through and by which a cable is inserted into, passed and held at its inside space, of a mounting means 1a-1 which is provided at one part of the holder main body and of opening and shutting means 1c which use both end opening parts of a bend as a cable insertion and pull port 1b and which open and shut the cable insertion and pull port.

8. 发明专利

JPH05191069A INTER-SHELF CONNECTION STRUCTURE 失效
公开(公告)号：JPH05191069A
公开(公告)日：1993-07-30
申请号：JP347492
申请日：1992-01-13
申请人： FUJITSU LTD
发明人： SAWANO SATARO , TAKAHASHI TETSUYA
IPC分类号： H05K7/14 , H05K7/18
摘要： PURPOSE:To obtain an inter-shelf connection structure which enables adjacent shelves to be easily, surely, and profitably connected together in place of using cable connectors. CONSTITUTION:A shelf 2 where circuit packages 9 are mounted in a array and connected by plug-in to a back board printed board 1 located at the rear side and a rack case 3 where the shelves 2 are vertically mounted at a regular interval space between them are provided, a contact plate 6 composed of spring contacts 5 whose protrudent ends are connected and fixed to the back board printed board 1 and other ends are exposed as contacts 51 and an insulator 4 where the contacts 5 are arranged at a regular pitch is provided to the rear upper and the rear lower edge of the shelf 2 at a prescribed point respectively. Furthermore, a connection printed board 8, where contacts 71 coming into contact with the contacts 51 of the shelves 2 adjacently mounted in the case 3 and contact patterns 7 which connect the correspondent upper and lower contacts 71 together are arranged in an array, is fixed to the rack case 3 corresponding to the mounting of the shelves 2, and the contacts 51 are made to abut against the connection patterns 7 to connect the adjacent shelves 2 together when the shelves 2 are mounted.

9. 发明专利

JPH05102680A LOCKING STRUCTURE FOR ELECTRONIC UNIT 失效
公开(公告)号：JPH05102680A
公开(公告)日：1993-04-23
申请号：JP25953291
申请日：1991-10-08
申请人： FUJITSU LTD
发明人： SAWANO SATARO , AMAGASA SHIGERU , TAKAHASHI TETSUYA
IPC分类号： H05K7/14
摘要： PURPOSE:To provide a locking structure of an electronic unit in which a reduction in an electronic apparatus is proceeded in the apparatus in which box-shaped electronic units are aligned on a shelf to be inserted. CONSTITUTION:An electronic apparatus has slide rails 20 slidably mounted on lower stationary rails 11 arranged on a shelf 1, and a plurality of electronic units 5 to be mounted in parallel in the shelf 1. The apparatus further has a flexibly stretchable bottom plate 30 in which the rail bottom of the rail 20 is extended to this side and which has a knob 31 at its end, a right-angled triangular protrusion 32 as seen from a side and protruding upward at the rear of the knob 31 to be engaged with the front end face of the unit 5 and inclined at a front surface downward at the front side, and a pawl member 33 so protruding rearward to the lower part of the protrusion 32 as to be engaged with a collar 9 of a front lower frame member 2A of the shelf 1.

10. 发明专利

JPH01213970A FEEDER CABLE TERMINAL MOUNTING CONSTRUCTION 失效
公开(公告)号：JPH01213970A
公开(公告)日：1989-08-28
申请号：JP3848588
申请日：1988-02-23
申请人： FUJITSU LTD
发明人： TAKAHASHI TETSUYA , KIKUCHI TERUO , SAKAI SHIGERU , TANIGUCHI SHIYOUJIROU , SHINOHARA KENJI
IPC分类号： G02B6/24 , G02B6/00 , G02B6/46 , H01R4/02
摘要： PURPOSE:To enhance the soldering strength of a feeder cable terminal for a Cu pipe of a marine cable by forming slits for introducing molten solder to the cylindrical part of the feeder cable terminal, and by increasing the area where solders are attached. CONSTITUTION:A feeder cable terminal 20 has a cylindrical part 21 at its tip, and the tip of a Cu pipe 3 exposed at the tip of a resin sheath 2 of a marine cable 1 is inserted in this cylindrical part of feeder cable terminal 20 to be soldered fast. To increase the soldering area between the periphery of the Cu pipe 3 and the cylindrical part 21, it is provided with slits 22 extending in the longitudinal direction from its tip. This enhances the soldering strength of the feeder cable terminal 20 to the Cu pipe 3 of the marine cable 1.

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