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    • 4. 发明公开
    • A GaP red light emitting element substrate and methods of manufacturing it
    • 间隙发射红光的半导体器件和工艺及其制备衬底。
    • EP0620601A3
    • 1995-04-19
    • EP94105477.7
    • 1994-04-08
    • SHIN-ETSU HANDOTAI COMPANY LIMITED
    • Yanagisawa, Munehisa c/o Isobe KojoTamura, Yuuki, c/o Isobe KojoArisaka, Susumu, c/o Isobe KojoMatsumoto, Hidetoshi, c/o Isobe Kojo
    • H01L33/00C30B19/00
    • H01L33/30C30B19/00C30B29/44H01L21/02392H01L21/02461H01L21/02543H01L21/02576H01L21/02579H01L21/02581H01L21/02625H01L21/02628H01L33/0062H01L33/305
    • A GaP red light emitting element substrate with a large amount of oxygen doped in the p-type GaP layer, and with very few Ga₂O₃ precipitates developed on and/or in the p-type GaP layer, and methods of manufacturing said substrate. After the n-type GaP layer 2 is grown on the n-type GaP single crystal substrate 1, the p-type GaP layer 3 doped with Zn and O, is formed by means of the liquid phase epitaxial growth method. The p-type GaP layer 3 is grown by using a Ga solution with a high concentration of oxygen, and said Ga solution is removed from the substrate 1 to complete the growth when the temperature is lowered to a prescribed temperature of 980°C or higher. When the temperature has reached the prescribed temperature of 980°C or higher during the growth using the Ga solution with a high concentration of oxygen, it is also possible to treat said Ga solution to decrease the concentration of the contained oxygen and then continue the growth. It is also possible to conduct the growth using the Ga solution with a high concentration of oxygen until the temperature reaches the prescribed temperature of 980°C or higher, and then, after switching the growth solution to a Ga solution with a low concentration of oxygen, continue the growth.
    • 提供一种大量的氧的在p型GaP层被掺杂在GaP红色发光元件衬底,并且该很少Ga2O3沉淀开发上和/或在p型GaP层,和制造的方法的所述底物。 n型后GaP层2上生长的n型GaP单结晶基板1,当n型GaP层2由液体相的指构成具有掺杂Zn和O,在所述p型GaP层3 外延生长方法,在p型GaP层3通过使用与氧的浓度高的镓溶液中生长,并且所述镓溶液从基板1移除。当温度降低至980规定的温度,以完成生长 ℃或更高。 当温度已经达到980℃或更高的生长使用与氧的高浓度中的Ga溶液中所规定的温度,因此可以治疗所述镓溶液以降低包含的氧的浓度,然后继续生长 , 因此,可以使用具有氧的高浓度中的Ga溶液中,直至温度达到980℃或更高的规定温度,接着,用氧的浓度低切换生长溶液以Ga的溶液后进行的生长 ,继续生长。