专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP4393645A1 GRINDING DISK AND SUBSTRATE CLEANING DEVICE 审中-实审
公开(公告)号：EP4393645A1
公开(公告)日：2024-07-03
申请号：EP21916650.1
申请日：2021-09-14
申请人： Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
发明人： MA, Zehao , SHEN, Haiyang
IPC分类号： B24B37/11 , B24B37/12 , B24B37/14 , B24B27/033
CPC分类号： Y02P70/10 , B24B27/0092 , B24B37/14 , B24B27/033 , B24B37/22
摘要： The present application provides a grinding disc and a substrate cleaning device. The grinding disc includes a thickness self-adaptive layer and a base layer and a grinding plate fixed on two opposite surfaces of the thickness self-adaptive layer respectively. The base layer is connected to the grinding head. The grinding plate contacts a product to grind and clean the product. The thickness self-adaptive layer can deform based on a pressure applied by the grinding disc to the product to be cleaned such that the grinding disc completely contacts a surface of the product to be cleaned to make a cleaning area of the grinding disc achieve 100%, which can improve a cleaning rate of the product.

2. 发明公开

EP1020254A4 POLISHING METHOD AND POLISHING DEVICE 有权
标题翻译：抛光方法和装置
公开(公告)号：EP1020254A4
公开(公告)日：2001-10-17
申请号：EP99933146
申请日：1999-07-29
申请人： SHINETSU HANDOTAI KK
发明人： OKAMURA KOUICHI , SUZUKI FUMIO , MASUMURA HISASHI
IPC分类号： B24B37/04 , B24B37/12 , B24B37/16 , B24B41/047 , B24D9/08 , H01L21/304
CPC分类号： B24B37/11 , B24B41/047 , B24D9/08
摘要： A polishing method and a polishing device that are designed such that the in-plane pressing force between a work and an abrasive cloth is substantially uniform to improve the quality of the work. A surface plate (2) is supported on the grooved surface of a surface plate support (3a) having grooves (9a) extending straight. Work (W) is pressed against an abrasive cloth (8) stuck to the surface plate (2) while having abrasive material being fed thereto, the work (W) and surface plate (2) being rotated to thereby effect polishing.

3. 发明授权

EP3479958B1 SUBSTRATE POLISHING DEVICE AND POLISHING METHOD 有权转让
公开(公告)号：EP3479958B1
公开(公告)日：2023-01-04
申请号：EP18204957.7
申请日：2018-11-07
发明人： NAKANISHI, Masayuki , KODERA, Kenji
IPC分类号： B24B37/10 , B24B37/04 , B24B37/005 , B24B27/00 , B24B41/06 , B24B41/047 , B24B37/30 , B24B37/12

4. 发明公开

EP1497076A4 METHOD AND APPARATUS FOR HEATING POLISHING PAD 审中-公开
标题翻译：方法和装置用于加热的波兰光盘
公开(公告)号：EP1497076A4
公开(公告)日：2008-07-16
申请号：EP03716874
申请日：2003-03-28
申请人： LAM RES CORP
发明人： PHAM XUYEN , NGUYEN TUAN , ZHOU REN , WEI DAVID , JIANG LINDA , RAMANUJAM KATGENHALLI Y , SIMON JOSEPH P , LUONG TONY , SRIVATSAN SRIDHARAN , JIN ANJUN JERRY
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00 , B24B1/00 , B24B21/00 , B24B21/02 , B24B29/00 , B24B55/02
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt (102), a carrier (108) capable of applying a substrate (104) over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen (110) having a plurality of zones. The temperature controlling system further includes a temperature sensor (160) configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller (150) for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

5. 发明公开

EP1238755A4 TABLE OF WAFER POLISHER, METHOD OF POLISHING WAFER, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER 有权
标题翻译：晶片抛光机床工作台，晶片的研磨方法及半导体环过程
公开(公告)号：EP1238755A4
公开(公告)日：2007-02-07
申请号：EP00937244
申请日：2000-06-15
申请人： IBIDEN CO LTD
发明人： OKUDA YUJI , JIMBO NAOYUKI , MAJIMA KAZUTAKA , TSUJI MASAHIRO , TAKAGI HIDEKI , ISHIKAWA SHIGEHARU , YASUDA HIROYUKI
IPC分类号： B24B1/00 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047 , B24B49/14 , B24B37/00 , B24B37/04
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polisher is capable of resisting heat, thermal shocks and abrasion and suited to larger semiconductor wafers of high quality. A table (2) includes a plurality of laminates (11) consisting of silicide-base ceramic or carbide-base ceramic. The laminates (11) are united using a bonding layer (14). Fluid channels (12) are provided in the interface between the laminates (11).

6. 发明公开

EP3974108A1 DOPPEL- ODER EINSEITEN-BEARBEITUNGSMASCHINE 有权
公开(公告)号：EP3974108A1
公开(公告)日：2022-03-30
申请号：EP21192580.5
申请日：2021-08-23
申请人： Lapmaster Wolters GmbH
发明人： Boller, Hans-Peter , Neuber, Ingo
IPC分类号： B24B37/12 , B24B49/08 , B24B49/14
摘要： Die Erfindung betrifft eine Doppel- oder Einseiten-Bearbeitungsmaschine mit einer vorzugsweise ringförmigen ersten Arbeitsscheibe, die an einer ersten Trägerscheibe befestigt ist, und mit einem Gegenlagerelement, wobei die erste Arbeitsscheibe und das Gegenlagerelement über mindestens eine Antriebswelle relativ zueinander drehend antreibbar sind, wobei zwischen der ersten Arbeitsscheibe und dem Gegenlagerelement ein Arbeitsspalt zum beid- oder einseitigen Bearbeiten flacher Werkstücke gebildet ist, wobei zwischen der ersten Trägerscheibe und der ersten Arbeitsscheibe ein Druckvolumen angeordnet ist, das mit einer Druckfluidversorgung verbunden ist, die derart ansteuerbar ist, dass in dem Druckvolumen ein Druck aufgebaut wird, der eine vorgegebene Verformung der ersten Arbeitsscheibe erzeugt, und wobei Temperierkanäle zum Temperieren der ersten Arbeitsscheibe vorgesehen sind, die mit einer Temperierfluidversorgung verbunden sind, wobei die Temperierkanäle innerhalb der ersten Arbeitsscheibe angeordnet sind, so dass die Temperierkanäle näher an dem Arbeitsspalt angeordnet sind als das Druckvolumen, und wobei die Temperierkanäle nicht in Verbindung mit dem Druckvolumen stehen.

7. 发明公开

EP1814149A4 METHOD FOR ABRASING GaN SUBSTRATE 有权
标题翻译：方法刮出来GaN衬底
公开(公告)号：EP1814149A4
公开(公告)日：2009-04-29
申请号：EP05822594
申请日：2005-12-28
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： MATSUMOTO NAOKI
IPC分类号： H01L21/304 , B24B37/04 , B24B37/12
CPC分类号： H01L21/02024 , B24B7/228 , C30B29/406 , C30B33/00
摘要： A method for abrasing a GaN substrate which comprises a step (a first abrasion step) of abrasing the GaN substrate using a surface plate (101) and an abrasive fluid (27) containing an abrasive material (23) and a lubricating agent (25), while supplying the abrasive fluid (27) onto the surface plate (101), and a step (a second abrasion step)of abrasing the GaN substrate using a surface plate (101) having an abrasive material (29) implanted therein, while supplying a lubricating agent (31) onto the surface plate (101) having an abrasive material (29) implanted therein.

8. 发明公开

EP1048409A4 PLANETARY GEAR SYSTEM PARALLEL PLANER 有权
标题翻译：星系双面研磨机
公开(公告)号：EP1048409A4
公开(公告)日：2005-11-23
申请号：EP99933239
申请日：1999-08-03
申请人： HAMAI SANGYO
发明人： SUZUKI JUNPEI , KUNII YUTAKA
IPC分类号： B24B37/07 , B24B37/08 , B24B37/12 , B24B47/26 , B24B37/04
CPC分类号： B24B37/08 , B24B37/11 , B24B47/26
摘要： A planetary gear system parallel planer, wherein rotation stop pins (18) are installed projectedly at a position near the upper peripheral surface of an upper surface plate (9), stoppers (19) supported on brackets (21) mounted on a planer main body side are brought into contact with the side surfaces of the rotation stop pins (18) so as to stop the rotation of the upper surface plate (9), a plurality of pulleys (12 and 14) are disposed on a ring (13) and a suspending plate (15) mounted on the upper surface plate (9), and an endless wire rope (17) is installed tensely between the pulleys (12 and 14) so that the wire rope supports the vertical load of the upper surface plate (9), whereby the follow-up capability of the upper surface plate (9) to a work (5) is increased.

9. 发明公开

EP1197293A4 POLISHING DEVICE AND METHOD 有权
标题翻译：抛光方法和装置
公开(公告)号：EP1197293A4
公开(公告)日：2004-12-15
申请号：EP01902662
申请日：2001-01-29
申请人： SHINETSU HANDOTAI KK
发明人： KIUCHI ETSUO , HAYASHI TOSHIYUKI
IPC分类号： B24B37/015 , B24B37/04 , B24B37/12 , B24B37/14 , B24B37/30 , B24B41/04 , B24B41/06 , B24B49/14 , B24B55/02 , B24B57/02 , B24B37/00
CPC分类号： B24B55/02 , B24B37/015 , B24B37/042 , B24B37/12 , B24B37/14 , B24B37/30 , B24B41/042 , B24B41/06 , B24B49/14 , B24B57/02
摘要： A polishing device and a polishing method, wherein high-efficiency high-accuracy mirror finishing of work (including wafers) is made possible; a novel work holding plate for effectively holding work; and a work bonding method capable of highly accurately bonding work to such work holding plate. The polishing device comprises a polishing surface plate (29) and a work holding plate (38), so that work held by the work holding plate (38) is polished while applying a flow of polishing agent solution (41) onto the work, wherein the amount of deformation of the polishing surface plate (29) as measured normally of the surface of the surface plate and/or the amount of deformation of the work holding plate (38) as measured normally of the work holding surface of the work holding plate (38) is controlled during polishing to be not more than 100 νm by finding ingenious ways including integration of the polishing surface plate (29) and improvement of the flow channel for cooling water.

10. 发明公开

EP0316451A4 Device for abrasive machining 失效
标题翻译：磨床加工设备
公开(公告)号：EP0316451A4
公开(公告)日：1991-06-26
申请号：EP88903468
申请日：1988-03-03
申请人： GRUZINSKY POLITEKHNICHESKY INSTITUT IMENI V.I. LENINA
发明人： LOLADZE, TEIMURAZ NIKOLAEVICH , BATIASHVILI, BORIS IOSIFOVICH , BUTSKHRIKIDZE, DAVID SEMENOVICH , MAMULASHVILI, GENNADY LEVANOVICH
IPC分类号： B24B41/047 , B23Q1/26 , B23Q1/54 , B24B7/00 , B24B7/04 , B24B9/16 , B24B37/12 , B24B41/00 , B24B7/16 , B24B37/04
CPC分类号： B24B37/12 , B23Q1/265 , B23Q1/5456 , B24B9/16 , B24B41/002
摘要： A device for abrasive machining comprises an annular support (1) and a chuck (5) kinematically connected to a drive and mounted on a thrust bearing (2) rotatably in a radial bearing (8). The chuck (5) is provided with a coaxial bushing (7) mounted in a radial bearing (8), whereas the chuck (5) and the annular support (1) are elastically interconnected by means of an axle (9) passing through the bushing (7) and spring-loaded in the direction of tightening of the thrust bearing (2). The chuck (5) is connected to the axle (9) rotatively in relation to it by means of a thrust bearing (12) and is provided, on its external cylindrical surface, with a driven element (16) of the drive, whereas the plane (17) passing through the middle of the width of the driven element (16) of the drive is located in a plane (18) passing essentially through the middle of the width of the radial bearing (8).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式