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1. 发明授权

EP3902284B1 HEADSET INCLUDING IN-EAR MICROPHONE 有权
公开(公告)号：EP3902284B1
公开(公告)日：2024-05-01
申请号：EP20744845.7
申请日：2020-01-17
IPC分类号： H04R1/28 , H04R1/10 , H05K1/18 , H04R1/04 , H04R17/02 , H04R19/00 , H04R19/04 , H05K1/14
CPC分类号： H04R1/1075 , H04R1/1016 , H04R1/04 , H04R1/1083 , H04R1/2811 , H04R19/005 , H04R19/04 , H04R17/02 , H04R2201/00320130101 , H04R2201/10720130101 , H04R2400/1120130101 , H04R2460/1120130101 , H05K1/147 , H05K1/181 , H05K2201/1008320130101 , H05K2201/0907220130101 , Y02P70/50

2. 发明授权

EP3646617B1 SCHALLWANDLERANORDNUNG MIT EINER MEMS-EINHEIT 有权
公开(公告)号：EP3646617B1
公开(公告)日：2024-04-17
申请号：EP18729967.2
申请日：2018-06-08
IPC分类号： H04R17/02 , H04R17/00 , H04R1/04 , H04R31/00
CPC分类号： H04R1/04 , H04R17/00 , H04R17/02 , H04R31/006 , H04R2201/00320130101

3. 发明公开

EP4322547A1 EARPHONE AND EARPHONE ASSEMBLY 审中-公开
公开(公告)号：EP4322547A1
公开(公告)日：2024-02-14
申请号：EP22209257.9
申请日：2022-11-24
申请人： Beijing Xiaomi Mobile Software Co., Ltd.
发明人： MA, Dong , WANG, Mengyang
IPC分类号： H04R1/10 , H04R1/02 , H04R1/04 , H04R1/08 , H04R1/44
摘要： The present invention provides an earphone and an earphone assembly. The earphone includes a housing, a bracket inside the housing, and a sound unit inside the housing. The housing has a first hole and a second hole. The bracket has a channel. The channel includes a slot section and a hole section. The section includes an opening, a first port and a second port. An inner wall of the housing blocks the opening, the first port is in connection with the first hole, and the second port is in connection with the second hole. The hole section has a first end in connection with the slot section and a second end in connection with the sound unit. The bracket is between the housing and the sound unit.

4. 发明授权

EP3834255B1 CONNECTION ASSEMBLY FOR AUDIO EQUIPMENT 审中-实审
公开(公告)号：EP3834255B1
公开(公告)日：2024-01-03
申请号：EP19752388.9
申请日：2019-07-30
发明人： HARWOOD, Walter Timothy , KANG, Weiqiang , WANG, Feng , GUO, Shun
IPC分类号： H01R13/622 , H01R13/639 , H01R31/06 , H04R1/04 , H01R13/627

5. 发明公开

EP4285603A1 SOUND AND VIBRATION SENSOR 审中-公开
公开(公告)号：EP4285603A1
公开(公告)日：2023-12-06
申请号：EP22704745.3
申请日：2022-01-25
申请人： Sonion Nederland B.V.
发明人： POST, Peter, Christiaan
IPC分类号： H04R1/04 , H04R19/04 , B81B7/02 , G01H1/00 , G01H5/00 , G01P15/125

6. 发明公开

EP4263420A1 REDUCED LIGHT REFLECTION PACKAGE 审中-公开
公开(公告)号：EP4263420A1
公开(公告)日：2023-10-25
申请号：EP21851894.2
申请日：2021-12-16
申请人： InvenSense, Inc.
发明人： BRIOSCHI, Roberto , HAYATA, Kazunori , YEH, JR-Cheng , SOLANKI, Dinesh Kumar
IPC分类号： B81B7/00 , H04R1/04

7. 发明授权

EP3963899B1 VORRICHTUNG UND SYSTEM ZUR MESSUNG VON LAUTSTÄRKEN VON GERÄUSCHEN EINES STRASSENFAHRZEUGES IM STRASSENVERKEHR 有权
公开(公告)号：EP3963899B1
公开(公告)日：2023-03-29
申请号：EP20720375.3
申请日：2020-04-08
发明人： STROBEL, Markus
IPC分类号： H04R1/04 , H04R1/08 , H04R1/34 , G08G1/017

8. 发明公开

EP3941089A1 MICROPHONE AND SPEAKER ALL-IN-ONE MACHINE 审中-公开
公开(公告)号：EP3941089A1
公开(公告)日：2022-01-19
申请号：EP20185925.3
申请日：2020-07-15
申请人： Beijing Zhigu Rui Tuo Tech Co., Ltd.
发明人： CHEN, Hua
IPC分类号： H04R1/28 , H04R1/34 , H04R1/40 , H04R1/08 , H04R1/04
摘要： The utility model provides a microphone and speaker all-in-one machine, including a microphone assembly, a speaker assembly and a handle assembly; the microphone assembly, the speaker assembly and the handle assembly are stacked in sequence along the same axis; the speaker assembly includes at least two horns, a speaker stand and a speaker shell, wherein the at least two horns are disposed symmetrically on the speaker stand, and the speaker stand is fixed in the speaker shell; sounding surfaces of the horns are disposed at a preset angle with respect to a central axis of the speaker stand, and the sounding surfaces face away from the microphone assembly. For the microphone and speaker all-in-one machine of the utility model, the output volume is increased by providing at least two horns in the speaker assembly, and the horns are disposed symmetrically, which can cancel out the relatively-propagated sound waves, so as to weaken the howling problem caused by the interference of the sound wave of a single horn to the cartridge; the direction in which the horns are disposed prevents the sound output by the horns from forming a positive feedback to the microphone assembly, which further helps prevent howling.

9. 发明公开

EP3834255A1 CONNECTION ASSEMBLY FOR AUDIO EQUIPMENT 审中-实审
公开(公告)号：EP3834255A1
公开(公告)日：2021-06-16
申请号：EP19752388.9
申请日：2019-07-30
申请人： Shure Acquisition Holdings, Inc.
发明人： HARWOOD, Walter Timothy , KANG, Weiqiang , WANG, Feng , GUO, Shun
IPC分类号： H01R13/622 , H01R13/639 , H01R31/06 , H04R1/04 , H01R13/627

10. 发明公开

EP3813383A1 METHOD FOR MOUNTING ELECTROACOUSTIC COMPONENT ON PCB AND ELECTROACOUSTIC COMPONENT STRUCTURE 审中-公开
公开(公告)号：EP3813383A1
公开(公告)日：2021-04-28
申请号：EP20202864.3
申请日：2020-10-20
申请人： Ariose Electronics Co., Ltd.
发明人： BERGGREN, Magnus , NORDLANDER, Anders , LU, Yaotsun
IPC分类号： H04R1/04 , H04R31/00 , H05K3/32 , H01R12/57 , H05K3/34 , H01R12/70 , H01R13/24 , H05K3/30 , H01R13/627 , H04R1/02 , H04R1/06
摘要： This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven (50). The method comprises a step of separating and constructing a housing (10) of the electroacoustic component. The housing (10) comprises a shell seat (11) and a base seat (12), the shell seat (11) is provided with a plurality of sound producing components (20), and the base seat (12) is provided with at least two conducting terminals (30) for adhering the base seat (12) to the PCB (40). The conducting terminals (30) on the base seat (12) and the at least two contacts on the PCB (40) are adhered to each other and electrically connected in the reflow oven (50), and then the shell seat (11) and the base seat (12) are combined to make the shell seat (11) and the base seat (12) with the PCB (40) combined outside the reflow oven (50) into a single body to form an electroacoustic component that is mounted on the PCB (40).

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