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1. 发明公开

EP4351130A3 LIGHT EMITTING DEVICE 审中-实审
公开(公告)号：EP4351130A3
公开(公告)日：2024-06-26
申请号：EP24158520.7
申请日：2019-09-05
申请人： Nichia Corporation
发明人： MIURA, Soichiro , KANAZAWA, Tatsuya
IPC分类号： H01S5/02255 , H01S5/02326 , H04N9/31 , H01S5/02216 , H01S5/02253 , H01S5/02257 , H01S5/40
CPC分类号： H01S5/02216 , H01S5/4093 , H01S5/4031 , H04N9/3161 , H01S5/02257 , H01S5/02326 , H01S5/02253 , H01S5/02255
摘要： A light emitting device includes a base having a bottom part, a first semiconductor laser element disposed on the bottom part of the base, and a first light reflecting member disposed on the bottom part of the base. The first light reflecting member has a light reflecting surface configured to reflect light emitted from the first semiconductor laser element. The light reflecting surface of the first light reflecting member is a curved surface configured such that, with respect to the major portion of the light emitted from the first semiconductor laser element, the beam divergence angle of the light reflected by the light reflecting surface is greater than zero and smaller than the beam divergence angle of the light irradiating the light reflecting surface.

2. 发明公开

EP4387015A1 OPTICAL SYSTEM AND LASER DEVICE, COLLIMATOR LENS 无效
公开(公告)号：EP4387015A1
公开(公告)日：2024-06-19
申请号：EP22855710.4
申请日：2022-03-18
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： IIYAMA, Tomoko , ICHIHASHI, Kouki
IPC分类号： H01S5/02253 , H01S5/02255 , H01S5/14 , G02B3/00
CPC分类号： H01S5/14 , H01S5/02255 , G02B3/00 , H01S5/02253
摘要： An optical system (4) includes: a first collimator lens (41) disposed facing the light source array, configured to collimate each light beam in at least a vertical direction (Y), intersecting an arrangement direction (X) of light sources and an optical axis direction (Z) of each light beam, among the vertical direction and the arrangement direction; an optical element (42) disposed on an emission side of each light beam in the first collimator lens; and a second collimator lens (45) disposed on an emission side of each light beam in the optical element, configured to collimate each light beam at least in the arrangement direction. The first collimator lens (43) includes lens portions arranged in the arrangement direction, the lens portions corresponding to the light sources in the light source array. The lens portions are configured rotationally asymmetrically to have positive power in the vertical direction and have positive power in the arrangement direction.

3. 发明授权

EP4012853B1 SEMICONDUCTOR PACKAGE, ASSEMBLY, AND APPARATUS 有权
公开(公告)号：EP4012853B1
公开(公告)日：2023-07-26
申请号：EP20212917.7
申请日：2020-12-09
发明人： Luque, Jordi
IPC分类号： H01S5/02212 , H01S5/02253 , H01S5/02255 , H01S5/40 , H01S5/00

4. 发明公开

EP3875850A3 LIGHT-EMITTING DEVICE 审中-实审
公开(公告)号：EP3875850A3
公开(公告)日：2021-10-06
申请号：EP20217720.0
申请日：2016-05-19
申请人： Nichia Corporation
发明人： Kiyota, Seiji , Kozuru, Kazuma , Okahisa, Eiichiro
IPC分类号： F21V5/00 , F21V5/04 , G02B3/00 , G02B19/00 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/40
摘要： A light-emitting device includes a substrate (10), a lens array (20) having a plurality of lens sections (22) in a matrix pattern, and a plurality of semiconductor laser elements (30) disposed on the substrate (10). The substrate (10) includes a base (12) and a side wall (14) that protrudes from the base (12). A recess (10a) is formed by the base (12) and the side wall (14). The base (12) has a protrusion (12a) formed inside of the recess (10a). The plurality of semiconductor laser elements (30) is disposed, in a matrix pattern in correspondence with the plurality of respective lens sections (22), on the protrusion (12a) of the base (12). Each of the semiconductor laser elements (30) emits a respective laser beam in such a manner that the laser beam is incident to a light incident surface (LA) of the corresponding lens section (22).

5. 发明公开

EP4455743A1 MICROLENS ARRAY, LIGHT-EMITTING DEVICE, AND SENSOR MODULE 失效
公开(公告)号：EP4455743A1
公开(公告)日：2024-10-30
申请号：EP22911289.1
申请日：2022-12-21
申请人： Kyocera Corporation
发明人： YAMASAKI Sho , HONDA Megumi
IPC分类号： G02B3/00 , G02B5/02 , H01L31/0232 , H01L31/12 , H01S5/02253
CPC分类号： H01L31/0232 , G02B3/00 , H01S5/02253 , H01L31/12 , G02B5/02
摘要： A microlens array includes: multiple first lenses having vertex heights higher than or equal to a first vertex height; and a second lens having a vertex height lower than the first vertex height. The microlens array includes: a first region in which a vertex distance between two first lenses, of the multiple first lenses, aligned in a first direction is smaller than a threshold in plan view; and a second region in which a vertex distance between two first lenses, of the multiple first lenses, aligned in the first direction is larger than the threshold in plan view, and the second lens is located between the two first lenses in the second region.

7. 发明授权

EP3096170B1 LIGHT EMITTING DEVICE 有权
公开(公告)号：EP3096170B1
公开(公告)日：2021-06-23
申请号：EP16170351.7
申请日：2016-05-19
发明人： Kiyota, Seiji , Kozuru, Kazuma , Okahisa, Eiichiro
IPC分类号： F21V5/00 , F21V5/04 , G02B3/00 , G02B19/00 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/40 , H01S5/02345

8. 发明授权

EP3673544B1 VCSEL ARRAY WITH COMMON WAFER LEVEL INTEGRATED OPTICAL DEVICE 有权
公开(公告)号：EP3673544B1
公开(公告)日：2021-10-20
申请号：EP18755488.6
申请日：2018-08-23
发明人： GRONENBORN, Stephan , BLOEMEN, Pascal, Jean, Henri
IPC分类号： H01S5/022 , H01S5/02 , H01S5/00 , H01S5/183 , G02B27/09 , H01S5/026 , H01S5/42 , G02B3/00 , G02B3/08 , G02B19/00 , H01S5/02253

9. 发明授权

EP3676920B1 LASER ARRANGEMENT COMPRISING A VCSEL ARRAY 有权
公开(公告)号：EP3676920B1
公开(公告)日：2021-09-29
申请号：EP18758900.7
申请日：2018-08-30
发明人： GRONENBORN, Stephan , MOENCH, Holger, Joachim
IPC分类号： H01S5/42 , H01S5/02253 , H01S5/02255 , H01S5/02 , H01S5/183

10. 发明公开

EP4439881A1 LASER PACKAGING DEVICE 审中-实审
公开(公告)号：EP4439881A1
公开(公告)日：2024-10-02
申请号：EP22897491.1
申请日：2022-10-24
申请人： Shenzhen Lighting Institute
发明人： TANG, Huai , GUO, Yanyu
IPC分类号： H01S5/024 , H01S5/02335 , H01S5/02253
CPC分类号： H01S5/02345 , H01S5/0232 , H01S5/02335 , H01S5/02253 , H01S5/024
摘要： A laser packaging device (1), comprising a base (10), a laser light source assembly (30), a lead wire (50), and a light window (60). The base (10) comprises a light source mounting portion (11) and a support portion (13); the light source mounting portion (11) and the support portion (13) are integrally arranged, and the light source mounting portion cooperates with the support portion (13) to form an accommodating cavity (15); the support portion (13) comprises a top surface (132) and a bottom surface (134); the laser light source assembly (30) is accommodated in the accommodating cavity (15) and is provided at the light source mounting portion (11); the laser light source assembly (30) is configured to emit laser; the lead wire (50) passes through the support portion (13); the lead wire (50) comprises a first end (52) and a second end (54) opposite to each other; the first end (52) is provided in the accommodating cavity (15) and is configured to be electrically connected with the laser light source assembly (30); the second end (54) is provided on the bottom surface (134); the light window (60) covers the top surface (132) to seal the accommodating cavity (15); and the laser is emitted through the light window (60). The light source mounting portion (11) and the support portion (13) are integrally arranged, thereby simplifying the manufacturing process of the base (10). In addition, the first end (52) of the lead wire (50) is provided in the accommodating cavity (15), and the second end (54) is provided on the bottom surface (134) of the support portion (13), thereby facilitating a decrease in the size of the base (10) and achievement of miniaturization of the laser packing device (1).

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