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    • 1. 发明授权
    • Large dimension, flexible piezoelectric ceramic tapes and methods to make same
    • Grosse灵活的Piezokeramikbänderund deren Herstellungsverfahren
    • EP1808896B1
    • 2017-04-12
    • EP07007909.0
    • 2004-02-25
    • Xerox Corporation
    • Xu, BaominBuhler, Steven A.Wong, William S.Weisberg, Michael C.Solberg, Scott E.Littau, Karl A.Elrod, Scott A.
    • H01L27/20H01L41/22B06B1/06G01L1/16G01N29/24H01L41/47
    • G01N29/245B06B1/0622G01L1/16G01N29/2475G01N2291/02827G01N2291/2694H01L27/20H01L41/313H01L41/314H01L41/47
    • A flexible detection/test tape includes a first flexible conductive layer, and a second flexible conductive layer positioned opposite the first conductive layer. A plurality of at least one of sensors, actuators or transducers are positioned between and are bonded to the first flexible conductive layer and the second flexible conductive layer. An insulative material is inserted around the plurality of at least one of the sensors, actuators or transducers. An electrical contact network connects to the first flexible conductive layer and the second flexible conductive layer, whereby power and control signals are provided to the flexible detection/test tape. In an alternative embodiment, a method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.
    • 灵活的检测/测试带包括第一柔性导电层和与第一导电层相对定位的第二柔性导电层。 多个传感器,致动器或换能器中的至少一个位于第一柔性导电层和第二柔性导电层之间并且被结合到第一柔性导电层和第二柔性导电层之间。 绝缘材料插入到多个传感器,致动器或换能器中的至少一个传感器周围。 电接触网络连接到第一柔性导电层和第二柔性导电层,由此将功率和控制信号提供给柔性检测/测试带。 在替代实施例中,用于产生检测/测试带的方法包括将材料沉积在至少一个第一基底的表面上以形成多个元件结构。 电极沉积在多个元件结构中的每一个的表面上,并且元件结构被结合到第二基板,其中第二基板是导电的或具有导电层,并且第二基板被承载在载体板上。 从元件结构中去除至少一个第一衬底,并且将第二侧电极沉积在多个元件结构中的每一个的第二表面上。 绝缘材料插入在元件结构周围以电隔离用于结合元件结构的两个基板。 然后将元件结构的第二面接合到另一个衬底,其中另一个衬底是导电的或具有导电层。 此后,移除承载第二基板的载板。