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1. 发明公开

EP2056446A4 DRIVE DEVICE, TRAVEL DEVICE, AND DRIVE DEVICE CONTROL METHOD 审中-公开
标题翻译：驱动装置，行走装置和驱动装置的控制方法
公开(公告)号：EP2056446A4
公开(公告)日：2011-10-05
申请号：EP07792686
申请日：2007-08-13
申请人： TOYOTA MOTOR CO LTD
发明人： KOSAKA YUSUKE
IPC分类号： H02P29/02 , B23K3/00 , B23K17/00 , B60L15/20 , G05B19/4062
CPC分类号： G05B19/4062 , B60L15/2036 , G05B2219/42289 , G05B2219/42295 , H02P29/032 , Y02T10/645 , Y02T10/72 , Y02T10/7275

2. 发明公开

EP2058080A4 NORMAL TEMPERATURE JOINING METHOD AND NORMAL TEMPERATURE JOINING DEVICE 审中-公开
标题翻译：常温接合方法，在常温添加设备
公开(公告)号：EP2058080A4
公开(公告)日：2009-11-04
申请号：EP07806868
申请日：2007-09-06
申请人： MITSUBISHI HEAVY IND LTD , NAT INST OF ADVANCED IND SCIEN
发明人： GOTO TAKAYUKI , UTSUMI JUN , IDE KENSUKE , TAKAGI HIDEKI , FUNAYAMA MASAHIRO
IPC分类号： B23K20/00 , B23K17/00 , B23K20/14 , B23K20/24 , B23K101/40 , C23C14/34 , H01L21/02
CPC分类号： H01L21/2007 , B23K20/02 , B23K20/16 , B23K20/24 , B23K2201/36 , C23C14/16 , C23C14/3464 , C23C14/46

3. 发明授权

EP0069189B1 Fluxless soldering process 失效
标题翻译：无焊接工艺
公开(公告)号：EP0069189B1
公开(公告)日：1985-08-21
申请号：EP82100714.3
申请日：1982-02-02
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , Harper, James McKell Edwin
IPC分类号： B23K17/00 , B23K1/20 , H01L21/60
CPC分类号： H01L24/81 , B23K1/005 , B23K1/206 , B23K17/00 , B23K2201/40 , C23G5/00 , H01L21/4864 , H01L2224/75 , H01L2224/75102 , H01L2224/7901 , H01L2224/81014 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H05K3/3489 , H01L2924/00
摘要： A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.

4. 发明公开

EP0069189A3 Fluxless soldering processes and apparatus for carrying out the process 失效
标题翻译：无铅焊接工艺及其工艺实施
公开(公告)号：EP0069189A3
公开(公告)日：1983-08-03
申请号：EP82100714
申请日：1982-02-02
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , Harper, James McKell Edwin
IPC分类号： B23K17/00 , B23K01/20 , H01L21/60
CPC分类号： H01L24/81 , B23K1/005 , B23K1/206 , B23K17/00 , B23K2201/40 , C23G5/00 , H01L21/4864 , H01L2224/75 , H01L2224/75102 , H01L2224/7901 , H01L2224/81014 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H05K3/3489 , H01L2924/00
摘要： A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensity and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation, In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.

5. 发明公开

EP3389907A1 METHOD OF CREATING METAL COMPONENTS USING THE DEPOSITION OF MATERIAL AND APPARATUS TO IMPLEMENT THIS METHOD 审中-公开
公开(公告)号：EP3389907A1
公开(公告)日：2018-10-24
申请号：EP16875026.3
申请日：2016-12-15
申请人： Czech Technical University in Prague, Faculty of Mechanical Engineering, Department Of Production Machines and Equipment , KOVOSVIT MAS, a.s.
发明人： SMOLIK, Jan , DIVIS, Ivan , FORNUSEK, Tomas , KOMAREK, Frantisek , MALY, Jan , HOSNEDL, Stanislav
IPC分类号： B23K9/04 , B23K5/18 , B23K10/02 , B23K13/00 , B23K17/00 , B33Y10/00 , B33Y30/00 , B33Y40/00
CPC分类号： B23K5/18 , B22F3/1055 , B22F2003/1059 , B22F2003/247 , B23K9/04 , B23K10/027 , B23K15/0086 , B23K26/34 , B23P15/00 , B23P23/04 , B33Y10/00 , Y02P10/295
摘要： The invention concerns a method of creating metal components using the deposition of material, where a weld deposit with the size of 2 to 200 mm3/s is created, and then cooled to a temperature of 20 to 90 °C and cleaned; after that the weld deposit is machined to the shape of the base with 1 to 3 defined contact surfaces for the next deposit and, after additional cleaning and drying, another weld deposit is created with the size of 2 to 200 mm3/s. It also concerns an apparatus for implementing this method, where at least three motion axes (10), (11) and (14), a head stock and a spindle (OP11 and OP12) with a tool (18) are integrated in one closed, ventilated area in the apparatus, and other technology units are connected to the body of the head stock, selected from the group of welding head (OP01), continuous cooling unit (OP02, OP03, OP04, OP05, OP06), weld deposit cleaning unit (OP09 and OP10), cleaning and drying unit (OP13 and OP14) and temperature control unit (OP89 and OP99), and the table (1) is equipped with internal cooling OP08.

6. 发明公开

EP2813304A2 Edge tool 有权转让
标题翻译：弯曲工具
公开(公告)号：EP2813304A2
公开(公告)日：2014-12-17
申请号：EP14167458.0
申请日：2014-05-08
申请人： JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED
发明人： Suzuki, Akiko , Sato, Akinobu
IPC分类号： B23B27/00 , B23C5/10 , B23D61/02 , B23K17/00 , B23B31/16
摘要： Both a rake face and a flank of an edge tool have a surface structure in which a network of recesses and protuberances surrounded by the recesses are formed, the surface structure having the characteristics described below:
(1) there is no solid-solid interface between the surface structure and the interior of the edge tool, (2) the surface structure has a value of a physical property that more easily permits the surface structure to be elastically or plastically deformed than a value of the physical property of the interior of the edge tool, and (3) the protuberances have such shapes that the protuberances are elastically or plastically deformed as the protuberances rub against a workpiece.

7. 发明公开

EP2056446A1 DRIVE DEVICE, TRAVEL DEVICE, AND DRIVE DEVICE CONTROL METHOD 审中-公开
标题翻译： FAHREINRICHTUNG，REISEEINRICHTUNG UND FAHREINRICHTUNGSSTEUERVERFAHREN
公开(公告)号：EP2056446A1
公开(公告)日：2009-05-06
申请号：EP07792686.3
申请日：2007-08-13
申请人： Toyota Jidosha Kabushiki Kaisha
发明人： KOSAKA, Yusuke
IPC分类号： H02P29/02 , B23K3/00 , B23K17/00 , B60L15/20 , G05B19/4062
CPC分类号： G05B19/4062 , B60L15/2036 , G05B2219/42289 , G05B2219/42295 , H02P29/032 , Y02T10/645 , Y02T10/72 , Y02T10/7275
摘要： The present invention may be applied to a drive device, a travel device, and a drive device control method which are suitable for use in a robot arm and a twin cycle, for example. By eliminating (reducing) the opportunity of the use exceeding a rated torque of a servo motor, it is possible to increase the machine reliability and set an appropriate safety factor so as to reduce device costs. The operation value during the actual machine operation obtained by {(effective torque) 2 -(rated torque) 2 }*(elapsed time from start) is compared with a value based on the rated torque, and the system driving is stopped and/or an alarm is started.
摘要翻译：例如，本发明可以应用于适用于机器人手臂和双周期的驱动装置，行驶装置和驱动装置控制方法。通过消除（减少）使用超过伺服电动机的额定转矩的机会，可以提高机器可靠性并设置适当的安全系数，以降低设备成本。通过{（有效转矩）2 - （额定转矩）2} *（起动时间）获得的实际机器运转中的运行值与基于额定转矩的值进行比较，系统运转停止和/或报警开始了

8. 发明授权

EP2248625B1 Room-temperature bonding method and room-temperature bonding apparatus 有权转让
标题翻译：常温接合方法及常温接合装置
公开(公告)号：EP2248625B1
公开(公告)日：2014-11-26
申请号：EP10172323.7
申请日：2007-09-06
申请人： Mitsubishi Heavy Industries, Ltd.
发明人： Goto, Takayuki , Utsumi, Jun , Ide, Kensuke , Takagi, Hideki , Funayama, Masahiro
IPC分类号： B23K20/00 , B23K20/14 , B23K20/24 , C23C14/34 , B23K101/40 , H01L21/02 , B23K17/00
CPC分类号： H01L21/2007 , B23K20/02 , B23K20/16 , B23K20/24 , B23K2201/36 , C23C14/16 , C23C14/3464 , C23C14/46

9. 发明公开

EP0509342A2 Verfahren zur Herstellung keilförmiger Strukturen 失效
标题翻译： Verfahren zur HerstellungkeilförmigerStrukturen。
公开(公告)号：EP0509342A2
公开(公告)日：1992-10-21
申请号：EP92105756.8
申请日：1992-04-03
申请人： ANT Nachrichtentechnik GmbH
发明人： Schwander, Thomas, Dipl.-Ing.
IPC分类号： B23K15/08 , B23K17/00 , B23K26/00 , G02B6/12
CPC分类号： G02B6/305 , C23F4/00 , G02B6/13 , G02B6/30 , G02B6/34 , G02B2006/12195
摘要： Es ist bekannt zur Erzeugung einer definierten Dicke bei einem Lichtwellenleiter-Taper eine Blende mit einer bestimmten ungleichförmigen Geschwindigkeit über das Substrat zu führen. Mit diesem Verfahren sind nur großflächige Taper und nur ein Taper je Substrat herstellbar. Es soll eine Möglichkeit angegeben werden, mit der auf einem Substrat mehrere Lichtwellenleiter-Taper hergestellt werden können.
Dazu wird ein Substrat in einem Bearbeitungsvorgang durch Bestrahlen entweder geätzt, abgetragen oder beschichtet und die Strahlungsdichte oder Einwirkzeit pro Fläche wird zwischen zwei Enden jeder herzustellenden Struktur geändert. Dies kann z.B. mit einer Blende (2), die mit einer konstanten Geschwindigkeit über ein Substrat (6) geführt wird, und einer ortsfesten Maske (4), die über dem Substrat angebracht wird und Öffnungen (5) aufweist, an den Stellen, an denen Lichtwellenleiter-Taper entstehen sollen, geschehen. Die Blende (2) wird derart über oder unter der Maske (4) bewegt, daß entgegengesetzte Enden des durch die Öffnungen (5) sichtbaren Substrates (6) einem Bearbeitungsvorgang unterschiedlich lange ausgesetzt sind. Der Bearbeitungsvorgang kann beispielsweise ein Trockenätzvorgang, aber auch ein Vorgang zum Aufbringen oder Aufdampfen einer Schicht auf das Substrat (6) sein. Es entstehen geätzte keilförmige Vertiefungen (7) oder aufgedampfte keilförmige Strukturen (8) die durch einen anschließenden Ätzvorgang unter Einsatz der Maske (4) ebenfalls zu geätzten keilförmigen Vertiefungen (7) werden.
摘要翻译：在光波导锥度中产生限定厚度的已知方法是以一定的不均匀速度将光阑通过衬底。只有大面积的锥度和每个基底只有一个锥度可以通过这个过程生产。本发明的目的是提供一种可以在一个基板上产生多个光波导锥形的方法。为此，在照射处理步骤中对衬底进行蚀刻，蚀刻或涂覆，并且每个单位面积的辐射密度或曝光时间在要生产的每个结构的两端之间改变。这可以例如通过在基板（6）上以恒定速度通过的隔膜（2）和安装在基板上方的固定掩模（4）来实现，该固定掩模（4）具有开口（5）要制造光波导锥形。隔膜（2）以掩模（4）上方或下方移动，使得通过开口（5）可见的基板（6）的相对端部经受不同长度的处理步骤。处理步骤可以是例如干蚀刻步骤，但也可以是设计成在衬底（6）上施加或气相沉积一层的步骤。这产生蚀刻的楔形凹槽（7）或气相沉积的楔形结构（8），其也因为使用掩模（4）的后续蚀刻步骤而成为蚀刻的楔形凹槽（7）。

10. 发明授权

EP0010610B1 Procédé pour lier des fils métalliques à des conducteurs de microcircuits 失效
标题翻译：将金属线连接到微导体导体的方法
公开(公告)号：EP0010610B1
公开(公告)日：1983-04-13
申请号：EP79103618.9
申请日：1979-09-24
申请人： International Business Machines Corporation
发明人： Tynan, Eugène, E. , Chaudhari, Praveen , Kiessling, John B. , Perlman, David, J. , Von Gutfeld, Robert, J.
IPC分类号： B23K26/00 , B23K17/00 , B23K15/00 , H01L21/60
CPC分类号： H01L24/85 , B23K26/22 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/4847 , H01L2224/48699 , H01L2224/85214 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01054 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H01L2924/00014 , H01L2924/00
摘要： 1. A method for bonding a metallic wire (13) to a microcircuit conductor (11), characterized in that it includes the steps of : a. applying said wire to the conductor, b. maintaining said wire in close contact with said conductor, c. applying a focussed energy beam (14) directed towards a point at least tangentially in contact with said wire, and forming a hole in said conductor, and d. applying additional energy to portions of said wire adjacent to said point for melting the wire metal so that the metal flows into said hole (15) to form an electrical contact between the wire and the conductor.
摘要翻译： 1.一种用于将金属线（13）接合到微电路导体（11）的方法，其特征在于包括以下步骤：a。将所述导线施加到导体上，b。保持所述导线与所述导体紧密接触，c。施加指向至少切向地与所述导线接触的点的聚焦能量束（14），并且在所述导体中形成孔，以及d。对所述金属丝的相邻部分施加额外的能量以熔化金属丝，使得金属流入所述孔（15）以在电线和导体之间形成电接触。

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