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    • 7. 发明公开
    • ANISOTROPIC CONDUCTIVE JOINT PACKAGE
    • ANISOTROPELEITFÄHIGEVERBINDUNGSKAPSELUNG
    • EP2221926A1
    • 2010-08-25
    • EP08859705.9
    • 2008-12-01
    • FUJIFILM Corporation
    • HATANAKA, YusukeHOTTA, YoshinoriTOMITA, Tadabumi
    • H01R11/01H01B5/16H01L23/14H01R43/00
    • H01L23/5389H01L23/49827H01L2924/0002H01R12/714Y10T29/49126Y10T29/4921Y10T428/24074Y10T428/24083Y10T428/24091Y10T428/24174Y10T428/24917Y10T428/249953Y10T428/249956H01L2924/00
    • An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mm 2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.
    • 一种各向异性导电接合封装,其中各向异性导电膜与至少一种选自金(Au),银(Ag),铜(Cu),铝(Al),镁(Mg) ,镍(Ni),掺有铟(ITO),钼(Mo),铁(Fe),钯(Pd),铍(Be)和铼(Re)的氧化锡。 封装的特征在于:各向异性导电膜具有绝缘基底和由导电构件组成的导电路径,彼此绝缘并且在绝缘基底的厚度方向上延伸穿过绝缘基底,导电的一端 路径从绝缘基底的一侧露出,另一端从另一侧露出,导电路径的密度为3,000,000个/ mm 2以上,绝缘基底是由阳极氧化膜构成的结构体 具有微孔的铝基板,并且每个微孔沿着深度不具有分支结构。 该封装可以用作半导体器件等的电子部件的各向异性导电部件或用于检查的连接器,即使通过显着地提高导电路径的安装密度,结构具有高得多的集成度。