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    • 10. 发明公开
    • High frequency circuit unit
    • Hochfrequenzschaltungseinheit
    • EP2076105A2
    • 2009-07-01
    • EP08020009.0
    • 2008-11-17
    • Alps Electric Co., Ltd.
    • Shiino, Hiroko
    • H05K3/34
    • H05K3/3447H05K3/3405H05K3/403H05K2201/10371H05K2201/10833
    • A high frequency circuit unit suitable for miniaturization is provided by surely soldering a single face of a fixing leg of a cover body to a land on a circuit substrate. In the high frequency circuit unit, an electronic component (2) mounted on a component mounting face (1a) of a circuit substrate (1) is covered by a cover body(3) consisting of a metal plate, a fixing leg (6) protruded from four courses of the cover body (3) is inserted into a through-hole (4) in the circuit substrate (1), and a copper foil land (5) provided in a periphery of the through-hole (4) and the fixing leg (6) are soldered on the component mounting face (1a). The fixing leg (6) is press-molded to have a watershoot shape such that one side of front-back both faces for the becomes a convex surface (6a) and the other side becomes a concave surface(6b), and the convex surface (6a) is provided to face an outer circumference side of the circuit substrate (1) within the through-hole (4), in order to solder the convex surface (6a) of the fixing leg (6) to the copper foil land (5).
    • 通过将盖体的固定腿的单面可靠地焊接到电路基板上的焊盘上来提供适于小型化的高频电路单元。 在高频电路单元中,安装在电路基板(1)的部件安装面(1a)上的电子部件(2)被由金属板,固定支脚(6)构成的盖体(3)覆盖, 从电路基板(1)的通孔(4)插入盖体(3)的四个电极突出的铜箔焊盘(5),设置在通孔(4)的周围的铜箔焊盘(5) 固定腿(6)焊接在部件安装面(1a)上。 固定腿(6)被压制成具有水獭形状,使得前后两面的一侧成为凸面(6a),另一侧成为凹面(6b),凸面 (6a)被设置为面对通孔(4)内的电路基板(1)的外周侧,以便将固定腿(6)的凸表面(6a)焊接到铜箔焊盘( 5)。