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1. 发明授权

EP1039004B1 A NOZZLE CHIP FOR SPINNING A HIGHLY FLAT GLASS FIBER AND AN APPARATUS ACCOMMODATING THE SAME 有权
标题翻译：喷嘴尖端用于纺制玻璃纤维利用大部分扁平横截面和本DEVICE HAVING喷嘴尖端
公开(公告)号：EP1039004B1
公开(公告)日：2007-04-11
申请号：EP98956011.5
申请日：1998-12-01
申请人： NITTO BOSEKI CO., LTD.
发明人： KONNO, Michio , MIURA, Yasushi , SAITO, Shoichi , KASAI, Shin
IPC分类号： D04H1/42 , D01D5/253 , C03B37/075 , C03B37/08 , C03B37/083
CPC分类号： H05K1/0366 , C03B37/083 , D04H1/4218 , D04H1/4226 , D04H1/4382 , D04H1/4391 , D04H3/00 , H05K2201/0293 , H05K2201/0296 , Y02P40/57
摘要： A nonwoven fabric constituted of high-flatness glass fibers whose cross sections have aspect ratios of 2.0 to 10 and rates of filling of 85 % or above, preferably 90 % or above. Such glass fibers have nearly rectangular cross sections and therefore can be arranged in an extremely dense state to give a nonwoven fabric which is extremely thin and has a high bulk density. The fabric can give laminates which are enhanced in the glass fiber content and improved in the surface smoothness, thus being suitably usable as the reinforcement for printed wiring boards. The glass fibers can be produced by the use of, e.g., a nozzle equipped with a tip which has a flat orifice and whose major-axis wall is partially cut out on one side.

2. 发明公开

EP1780323A2 Glass fiber nonwoven fabric and printed wiring board 有权
标题翻译： Glasfaservlies und Leiterplatte
公开(公告)号：EP1780323A2
公开(公告)日：2007-05-02
申请号：EP07001390.9
申请日：1998-12-01
申请人： NITTO BOSEKI CO., LTD.
发明人： Konno, Michio , Saito, Shoichi , Miura, Yasushi , Kasai, Shin
IPC分类号： D04H13/00 , D04H1/42
CPC分类号： H05K1/0366 , C03B37/083 , D04H1/4218 , D04H1/4226 , D04H1/4382 , D04H1/4391 , D04H3/00 , H05K2201/0293 , H05K2201/0296 , Y02P40/57
摘要： A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.
摘要翻译：非织造布由高度扁平的玻璃纤维构成，玻璃纤维是截面为平坦的平坦度为2.0至10的玻璃纤维，并且具有包装率至少为85％，优选至少90％。在该无纺布中，玻璃纤维部的形状接近矩形，玻璃纤维可以非常密集地配置，形成体积密度高的薄型无纺布，作为层叠材料使用时，玻璃纤维可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。此外，上述扁平玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴芯的长轴壁的一侧部分凹口的形状的喷嘴来制造。

3. 发明公开

EP0199328A3 Fabric for printed circuit substrate and printed circuit substrate 失效
标题翻译：印刷电路基板和印刷电路基板的织物
公开(公告)号：EP0199328A3
公开(公告)日：1987-08-05
申请号：EP86105496
申请日：1986-04-21
申请人： ASAHI GLASS COMPANY LTD.
发明人： Ohta, Hironori , Mukaiyama, Takashi
IPC分类号： H05K01/03
CPC分类号： C03B37/011 , C03B37/075 , H05K1/0366 , H05K2201/029 , H05K2201/0293 , H05K2201/0296 , Y10T428/2973 , Y10T428/298 , Y10T442/3008 , Y10T442/3114 , Y10T442/601 , Y10T442/611
摘要： A fabric for a printed circuit substrate composed essentially of inorganic fibers having a non-circular cross section

4. 发明授权

EP1103168B1 HIGH DENSITY PRINTED CIRCUIT SUBSTRATE AND METHOD OF FABRICATION 有权
标题翻译： PCB基板高密度和制造方法
公开(公告)号：EP1103168B1
公开(公告)日：2006-09-13
申请号：EP99935896.3
申请日：1999-07-22
申请人： Isola Laminate Systems Corporation
发明人： POMMER, Richard, J. , GOTRO, Jeffrey, T. , ANDROFF, Nancy, M., W. , HEIN, Marc, D. , ZARECKI, Corey, J.
IPC分类号： H05K1/03
CPC分类号： H05K3/022 , H01L23/5383 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H05K1/0366 , H05K3/388 , H05K2201/029 , H05K2201/0296 , Y10S428/901 , Y10T428/24917 , H01L2224/0401
摘要： The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

5. 发明公开

EP1103168A2 HIGH DENSITY PRINTED CIRCUIT SUBSTRATE AND METHOD OF FABRICATION 有权
标题翻译： PCB基板高密度和制造方法
公开(公告)号：EP1103168A2
公开(公告)日：2001-05-30
申请号：EP99935896.3
申请日：1999-07-22
申请人： Isola Laminate Systems Corporation
发明人： POMMER, Richard, J. , GOTRO, Jeffrey, T. , ANDROFF, Nancy, M., W. , HEIN, Marc, D. , ZARECKI, Corey, J.
IPC分类号： H05K1/03
CPC分类号： H05K3/022 , H01L23/5383 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H05K1/0366 , H05K3/388 , H05K2201/029 , H05K2201/0296 , Y10S428/901 , Y10T428/24917 , H01L2224/0401
摘要： The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

6. 发明授权

EP0146108B1 Substrate material for printed circuits 失效
标题翻译：印刷电路基材
公开(公告)号：EP0146108B1
公开(公告)日：1989-02-01
申请号：EP84115162.4
申请日：1984-12-11
申请人： International Business Machines Corporation
发明人： Bhatt, Anilkumar Chinuprasad , Cibulsky, Michael Joseph , Doran, Donald Edward , Hugaboom, Lawrence James , Knight, James Wallace
IPC分类号： H05K1/03 , D03D15/00
CPC分类号： D03D1/0082 , D03D1/00 , D03D15/00 , D03D15/0011 , D03D15/0083 , D10B2505/02 , H05K1/0366 , H05K2201/029 , H05K2201/0296 , Y10S428/901 , Y10T428/2973 , Y10T442/2008 , Y10T442/2951 , Y10T442/3114

7. 发明公开

EP1478796A1 FABRIC WOVEN WITH FLAT GLASS FIBERS AND PRODUCTION METHOD 有权
标题翻译：与扁平的玻璃纤维和方法FABRIC
公开(公告)号：EP1478796A1
公开(公告)日：2004-11-24
申请号：EP03704867.5
申请日：2003-02-27
申请人： GIVIDI ITALIA S.p.A.
发明人： KOBUE, Kazushi , SAKAI, Tomofumi , SUZUKI, Yoshiharu , SCARI', Diego
IPC分类号： D03D15/00
CPC分类号： D03D15/0011 , H05K1/0366 , H05K2201/029 , H05K2201/0296
摘要： Method of production of glass fabric that does not exhibit surface hairiness, that is sufficiently close-woven, with which printed circuits with a high degree of rigidity can be realized, as well as supply of a glass fabric, prepreg and printed circuits. Glass fabric (40) woven from warp yarn (20) and weft yarn (30) containing multiple glass filaments; in relation to the warp yarn (20) and the weft yarn (30), at least one of the two has not undergone twisting and the profile of its glass filament has been flattened. Since between warp yarn (20) and weft yarn (30), at least one of the two has not undergone twisting, it is possible to limit the surface hairiness and at the same time to obtain that the fibers are separated and uniformly distributed during the weaving operation also without performing a specific treatment of uniform fibers redistribution. Moreover, since between warp yarn (20) and weft yarn (30), the filament F of at least one of the two has a flattened profile, the spacing between the filaments F is closer, the degree of distribution of the fibers of the glass fabric is higher and the rigidity of the printed circuit laminate is greater.

8. 发明公开

EP1039004A1 NONWOVEN FABRIC MADE OF GLASS FIBER AND PRINTED WIRING BOARDS 有权
标题翻译：喷嘴尖端用于纺制玻璃纤维利用大部分扁平横截面和本DEVICE HAVING喷嘴尖端
公开(公告)号：EP1039004A1
公开(公告)日：2000-09-27
申请号：EP98956011.5
申请日：1998-12-01
申请人： NITTO BOSEKI CO., LTD.
发明人： KONNO, Michio , MIURA, Yasushi , SAITO, Shoichi , KASAI, Shin
IPC分类号： D04H1/42 , D01D5/253 , C03B37/075 , C03B37/08
CPC分类号： H05K1/0366 , C03B37/083 , D04H1/4218 , D04H1/4226 , D04H1/4382 , D04H1/4391 , D04H3/00 , H05K2201/0293 , H05K2201/0296 , Y02P40/57
摘要： A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.
摘要翻译：的非织造织物被构造一个非常扁平的玻璃纤维的所有这是一种玻璃纤维，其截面是平的，并且具有2.0至10，其中A扁平比的已检查的部分做敛集率至少为85％，优选至少90％的，在该非织造织物，玻璃纤维部分具有接近矩形的形状，并且因此，玻璃纤维可以被非常密集地布置，以形成具有高堆积密度的薄的无纺织物，并且当它被用作层压材料，玻璃纤维含量可以增加和表面光滑度可以同时得到提升，可适当地使用作为强化材料的印刷电路板。更完了，上述扁平玻璃纤维可通过使用来生产，例如，具有形状搜索的喷嘴那样具有平坦喷嘴孔的喷嘴片的长轴壁中的一个侧面部分地切口。

9. 发明授权

EP0199328B1 Fabric for printed circuit substrate and printed circuit substrate 失效
标题翻译：印刷电路基板和印刷电路基板的织物
公开(公告)号：EP0199328B1
公开(公告)日：1992-08-12
申请号：EP86105496.3
申请日：1986-04-21
申请人： ASAHI GLASS COMPANY LTD.
发明人： Ohta, Hironori , Mukaiyama, Takashi
IPC分类号： H05K1/03
CPC分类号： C03B37/011 , C03B37/075 , H05K1/0366 , H05K2201/029 , H05K2201/0293 , H05K2201/0296 , Y10T428/2973 , Y10T428/298 , Y10T442/3008 , Y10T442/3114 , Y10T442/601 , Y10T442/611

10. 发明授权

EP1780323B1 Glass fiber nonwoven fabric and printed wiring board 有权
标题翻译：无纺玻璃和PCB
公开(公告)号：EP1780323B1
公开(公告)日：2010-02-10
申请号：EP07001390.9
申请日：1998-12-01
申请人： NITTO BOSEKI CO., LTD.
发明人： Konno, Michio , Saito, Shoichi , Miura, Yasushi c/o NITTO BOSEKI CO., LTD. , Kasai, Shin
IPC分类号： D04H1/42 , D01D5/253 , C03B37/075 , D04H13/00
CPC分类号： H05K1/0366 , C03B37/083 , D04H1/4218 , D04H1/4226 , D04H1/4382 , D04H1/4391 , D04H3/00 , H05K2201/0293 , H05K2201/0296 , Y02P40/57

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