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1. 发明授权

EP2851947B1 Thermally conductive sheet feeder and method for feeding thermally conductive sheet 有权
公开(公告)号：EP2851947B1
公开(公告)日：2018-06-06
申请号：EP13791319.0
申请日：2013-03-29
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： ISHIHARA, Yasuhisa , ENDO, Akihiro
IPC分类号： H01L23/36 , B65B15/04 , B65D73/02 , H05K13/02 , H01L23/373 , B25J11/00 , H01L23/367 , H05K13/00
CPC分类号： H01L23/3672 , B25J11/00 , B65B15/04 , B65D73/02 , H01L23/3737 , H01L2924/0002 , H05K13/0084 , H01L2924/00
摘要： Provided by the present invention are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet, which are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet using an emboss carrier tape, wherein the emboss carrier tape provided on its surface with a plurality of pockets, each having one thermally conductive sheet accommodated therein, and a cover film to protect surface of the emboss carrier tape are rolled up in a reel-like form.

2. 发明公开

EP3305049A2 SMART CONTAINERS AND/OR BOXES HANDLED BY, AND STORED IN, AUTOMATED SMD WAREHOUSE 审中-公开
标题翻译：自动贴片仓库处理和存储的智能容器和/或盒子
公开(公告)号：EP3305049A2
公开(公告)日：2018-04-11
申请号：EP16729206.9
申请日：2016-05-25
申请人： Mycronic AB
发明人： JACOBSSON, Nils
IPC分类号： H05K13/08 , B65G1/137 , G06Q10/08 , H05K13/02 , H05K13/00
CPC分类号： H05K13/021 , H05K13/0084 , H05K13/086
摘要： A container, or box, for use in a Surface Mount Technology (SMT) system includes an outer shell and at least one compartment. The outer shell has side walls and a base. The container is configured to store a plurality of SMT-job related objects in said at least one compartment where one of said SMT-job related objects is not a component tape reel, wherein said container has a logically and electronically unique identity in the SMT system represented by a barcode or RFID tag arranged on the container, said unique ID of the container being configured to be associated with each of the unique IDs of said plurality of SMT-job related objects stored in said at least one compartment.

3. 发明公开

EP2637491A4 POSITIONING AND STRUCTURE OF PART RECEPTACLE STICK FOR PART LOADING 审中-公开
标题翻译： POSITIONIUNG UND STRUKTUR EINES TEILEAUFNAHEMELEMENTS ZUM LADEN VON TEILEN
公开(公告)号：EP2637491A4
公开(公告)日：2017-06-14
申请号：EP11838018
申请日：2011-11-01
申请人： YAZAKI CORP
发明人： HORI SHIGEO
IPC分类号： H05K13/02 , B65G11/02 , B65G47/06 , H05K13/00
CPC分类号： H05K13/0434 , H05K13/0084
摘要： An object of the present invention is to supply components without positional deviation in a stable pose using a simple and common stick structure regardless of changes in sizes and/or shapes of the components. An elongated component loading stick (1, 1') is arranged with an incline toward a circumferential direction. Two inner walls (4a, 5a) of a bottom wall (4) and one sidewall (5) perpendicular to a lower end (4b) of the bottom wall (4) support and position each of two surfaces (2a, 2b) perpendicular to each other of a plurality of components (2), and the components (2) are supplied in a longitudinal direction of the stick. Various and/or shapes of the components (2 1 to 2 3 ) capable of being received in the stick are used as the components (2). The component (2) is a connector housing. When supplying the component (2) from a front end (3) of the component loading stick (1), the incline of the stick toward the circumferential direction is eliminated, and after the component is supplied, the stick is inclined toward the circumferential direction.
摘要翻译：本发明的一个目的是使用简单和普通的棒状结构以稳定的姿势供应没有位置偏差的部件，而不管部件的尺寸和/或形状如何变化。细长部件装载杆（1,1'）朝向圆周方向倾斜布置。垂直于底壁（4）的下端（4b）的底壁（4）和一个侧壁（5）的两个内壁（4a，5a）支撑和定位垂直于底壁多个部件（2）中的彼此以及部件（2）沿杆的纵向供应。作为部件（2），使用能够收纳在棒中的部件（2 1〜2 3）的各种形状和/或形状。部件（2）是连接器外壳。当从部件装载杆（1）的前端（3）供应部件（2）时，杆的朝向周向的倾斜被消除，并且在部件被供应之后，杆朝向周向方向倾斜。

4. 发明公开

EP2826350A2 METHOD AND DEVICE FOR AUTOMATIC STORAGE OF TAPE GUIDES 审中-实审
标题翻译：用于自动存储磁带引导的方法和装置
公开(公告)号：EP2826350A2
公开(公告)日：2015-01-21
申请号：EP13711859.2
申请日：2013-03-12
申请人： Mycronic AB
发明人： JACOBSSON, Nils
IPC分类号： H05K13/00 , H05K13/08
CPC分类号： H05K13/0084 , B65D19/00 , B65D85/62 , B65G1/06 , H05K13/08
摘要： A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.
摘要翻译：一种用于PCB的表面安装组装的系统和方法，使用自动拾取和放置机器，卷轴上的元件带被馈送到该机器中，使用元件磁带卷轴，每个磁带卷轴已经预先穿入其适当的磁带导向器并且被存储为一个自动化SMD存储塔中的卷轴/磁带导向组件，从中取出适当的包装以便连接到拾放机。

5. 发明公开

EP2826349A1 METHOD AND DEVICE FOR AUTOMATIC STORAGE OF ELECTRONIC COMPONENTS 有权转让
标题翻译：方法和设备电子元件自动存储
公开(公告)号：EP2826349A1
公开(公告)日：2015-01-21
申请号：EP13709417.3
申请日：2013-03-12
申请人： Mycronic AB
发明人： JACOBSSON, Nils , KARLSSON, Kristofer
IPC分类号： H05K13/00
CPC分类号： H05K13/0084 , B65D19/00 , B65D85/62 , B65G1/06 , H05K13/08 , H05K13/086 , H05K13/087
摘要： A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.

6. 发明公开

EP2825013A1 AUTOMATED TAPE SETTING APPARATUS 有权转让
标题翻译：自动化BANDEINSTELLUNGSVORRICHTUNG
公开(公告)号：EP2825013A1
公开(公告)日：2015-01-14
申请号：EP12870400.4
申请日：2012-03-06
申请人： Fuji Machine Mfg. Co., Ltd.
发明人： KANDA, Tomohisa , KURONO, Masaki , IDO, Takehiro , YOSHINO, Tomoharu
IPC分类号： H05K13/02
CPC分类号： H05K13/02 , B32B43/006 , B65H16/005 , B65H20/16 , B65H20/18 , B65H20/22 , B65H20/34 , B65H35/0013 , B65H35/0026 , B65H35/0073 , B65H37/005 , B65H37/007 , B65H37/06 , B65H41/00 , H01L21/673 , H05K13/0084 , H05K13/021 , H05K13/0417 , Y10T156/1994
摘要： A component package tape 2 is transported to a pitch feed mechanism section 93 by a tape transport device 30 and is held in a first tape holding section 95 by a tape holding releasing device 70. Furthermore, a top tape 22 adhered to a carrier tape 21 that is transported to the pitch feed mechanism section 93 is peeled from the carrier tape 21 by a top tape peeling section 95d while being clamped at a leading end section 22a, is transferred to a top tape delivery mechanism section 97, and is held in a second tape holding section 98 by the tape holding releasing device 70. Therefore, it is possible to automatically and reliably set the tapes 21 and 22 in the mechanism sections 93 and 97 respectively with a simple and low cost configuration. As a result, it is possible to significantly reduce the setting time, in comparison with a case of manual setting.
摘要翻译：部件包装带2由带传送装置30输送到节距进给机构部93，并通过带保持解除装置70保持在第一带保持部分95中。此外，粘附到载带21的顶部带22 传送到沥青供给机构部93的部件在被夹持在前端部22a的状态下通过顶带剥离部95d从载带21剥离，转移到顶部带递送机构部97，并且被保持在第二带保持部分98.因此，可以以简单且低成本的方式分别在机构部分93和97中自动可靠地设置带21和22。结果，与手动设置的情况相比，可以显着地减少设定时间。

7. 发明公开

EP2679403A1 Method and apparatus for processing housing 审中-公开
标题翻译： Verfahren und Vorrichtung zur Verarbeitung einesGehäuses
公开(公告)号：EP2679403A1
公开(公告)日：2014-01-01
申请号：EP13173213.3
申请日：2013-06-21
申请人： Samsung Electronics Co., Ltd
发明人： Chang, Min-Su , Han, Soon-Ho
IPC分类号： B44C5/04 , B29C37/00 , B29C45/00 , B44F9/10 , H04M1/00
CPC分类号： H05K13/0084 , B29C37/0032 , B29C37/0053 , B29C37/0067 , B29C45/14827 , B29C45/372 , B29C2037/0042 , B29L2031/3481 , B44C5/0453 , B44F9/10 , H04M1/0249 , H04M1/0283 , H05K5/0217 , H05K5/03
摘要： A method for processing a housing for devices such as electronic devices. A hairline (112) is formed on an inner surface of an inmold mold (105). In addition, a hairline (122) is formed on an inmold film (120). The inmold film is positioned inside the inmold mold and a housing representing the hairline of the inmold mold and the hairline of the inmold film together is formed using inmold injection molding.
摘要翻译：一种用于处理诸如电子设备的装置的壳体的方法。发丝（112）形成在模塑模具（105）的内表面上。此外，发型线（122）形成在成型膜（120）上。模塑薄膜位于模塑模具内部，并且使用模压注射成型形成表示模塑模具的发际线和模塑薄膜的发际线的壳体。

8. 发明授权

EP2026644B1 Trägerband zur Aufnahme elektronischer Bauteile 有权
标题翻译：载带，用于容纳电子元件
公开(公告)号：EP2026644B1
公开(公告)日：2010-11-03
申请号：EP08013591.6
申请日：2008-07-29
申请人： Amphenol-Tuchel Electronics GmbH
发明人： Kuntz, Julio , Brückmann, Eckhard
IPC分类号： H05K13/02
CPC分类号： H05K13/0084 , H05K13/0417

9. 发明公开

EP2183174A1 NON-NESTING COMPONENT CARRIER TAPE 有权
标题翻译：非粘合组分载体胶带
公开(公告)号：EP2183174A1
公开(公告)日：2010-05-12
申请号：EP08796772.5
申请日：2008-07-29
申请人： 3M Innovative Properties Company
发明人： WIHREN, Charlie V.
IPC分类号： B65D85/86 , B65D73/02 , H05K13/02
CPC分类号： H05K13/0084
摘要： A carrier tape for storing components and for preventing nesting of successive wraps of the carrier tape when round onto a roll. In particular, the carrier tape comprises a strip like portion defining a top surface of the tape, and wall portions defining a plurality of substantially similarly shaped pockets spaced along the carrier tape and opening through the top surface. The wall portions of the substantially similarly shaped pockets include a bottom wall portion, a first wall portion extending from the bottom wall portion to the top surface of the carrier tape, a first cross-beam wall portion extending from the bottom wall portion and located between adjacent pockets on the carrier tape, and a second cross-beam wall portion extending from the bottom wall portion and located between selected adjacent pockets on the carrier tape. One or more of the cross-beam wall portions have a notched opening formed at a selected location along a length of the first or second cross-beam wall portions.
摘要翻译：一种载带，用于存储部件并防止在圆形卷绕到卷上时载带的连续卷绕的嵌套。特别地，载带包括限定带的顶表面的带状部分，以及限定沿载带隔开并且穿过顶表面开口的多个基本类似形状的凹穴的壁部分。基本上类似形状的凹穴的壁部分包括底壁部分，从载体带的底壁部分延伸到顶表面的第一壁部分，从底壁部分延伸并位于第一横梁壁部分和第二横梁壁部分之间的第一横梁壁部分，载带上的相邻凹穴以及从底壁部分延伸并位于载带上的选定相邻凹穴之间的第二横梁壁部分。一个或多个横梁壁部分具有沿着第一或第二横梁壁部分的长度在选定位置形成的凹口。

10. 发明授权

EP1437300B1 SYSTEM FOR EMBOSSING CARRIER TAPE AND METHOD FOR PRODUCING CARRIER TAPE 有权
标题翻译：系统硬币支持带和制造方法的载波频段
公开(公告)号：EP1437300B1
公开(公告)日：2009-05-13
申请号：EP02801575.8
申请日：2002-10-15
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： OTSUKA, Hiroshi c/o SUMITOMO BAKELITE CO. LTD
IPC分类号： B65B15/04 , B65B47/02 , B29C51/42 , B29C51/18
CPC分类号： H05K13/0084 , B29C35/045 , B29C51/082 , B29C51/18 , B29C51/261 , B29C51/421 , B29C51/424 , B29C2035/0822 , B29K2105/256 , B65B47/02 , B65B47/08 , H01L21/67132 , H05K13/003
摘要： A carrier tape embossing system in which a long tape is heated at a heating section while being carried intermittently pitch by pitch and then embossed at a forming section, wherein a heat insulating section of about one pitch length is provided between the heating section and the forming section; and a method for producing a carrier tape using the system, wherein the long tape is heated at the heating section while being carried intermittently pitch by pitch, the heated tape is heat insulated at the heat insulating section, and then embossed at the forming section, a rib part becoming the joint of an embossed part being shortened by contriving the heating method of the tape.

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