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    • 1. 发明公开
    • Telecommunication sandwich card arrangement with common optical module at the front side
    • Telekommunikations-Sandwichkartenanordnung mit gemeinsamem optischen Modul an der Vorderseite
    • EP2571284A1
    • 2013-03-20
    • EP11306151.9
    • 2011-09-15
    • Alcatel Lucent
    • Seitz, Reinhold
    • H04Q1/08G06F13/40G06F1/18
    • H04Q1/08G06F1/185
    • A telecommunication sandwich card arrangement provided with backplane connectors (BPC), a front or face plate (FP) and a several parallel printed circuit boards (PCB1-PCBn) connected to the backplane along first edges, e.g. rear side edges, of these boards. The sandwich card arrangement also comprises a common module (COM), preferably a common optical interface module, located between the face plate and the parallel boards. The common module is coupled to the boards along the front side edges via an interface interconnection board (ICB) thereof, the front side edges being opposite and parallel to the rear side edges. The printed circuit boards preferably have a U-shape for surrounding the common optical module and the interface interconnection board towards the boards, and for allowing access to the backplane as well as a strong fixation of the boards to the face plate.
    • 具有背板连接器(BPC),前面板或面板(FP)以及沿着第一边缘连接到背板的多个平行印刷电路板(PCB1-PCBn)的电信夹层卡装置,例如, 这些板的后侧边缘。 夹芯卡装置还包括位于面板和平行板之间的公共模块(COM),优选地是公共光接口模块。 公共模块经由其接口互连板(ICB)沿着前侧边缘耦合到板,前侧边缘与后侧边缘相对并平行。 印刷电路板优选地具有用于围绕公共光学模块和接口互连板朝向板的U形,并且用于允许接近背板以及将板牢固地固定到面板。