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    • 6. 发明公开
    • High speed card edge connectors
    • Hochfrequenzleiterplattenrandverbinder
    • EP1113530A2
    • 2001-07-04
    • EP00128102.1
    • 2000-12-21
    • BERG ELECTRONICS MANUFACTURING B.V.
    • Salamone, Joseph R.Letourneau, Guy L.
    • H01R12/18
    • H01R12/714H01R12/7017
    • A card edge connector includes an elongated longitudinally extending outer frame (36) defining a reception region (38) adapted to receive a plurality of chiclet modules (40, 40A) including contact members (34) and lying in parallel laterally extending planes which, as an assembly, are positioned to connectively engage with mating contacts (22). Each chiclet module (40, 40A) includes an insulative housing (54) having first and second spaced generally parallel elongated passages therein and a card receiving recess (60) for reception therein between the first and second passages (58, 58A) of a planar card (28, 28A) having opposed surfaces (30, 32) with conductive contact members (34) thereon. First and second contacts (62, 66) are received, respectively, in the first and second passages (58, 58A). Each has a first contact surface (64) positioned, respectively, for engagement with first and second of the mating contacts (22). The card receiving recesses (60) of the chiclet modules (40, 40A) as a group define a longitudinally extending card receiving slot (70). The contacts each include a second contact surface (68) projecting into the card receiving slot (70) for engagement, respectively, with second conductive contact members (34) on the planar card (28, 28A). A tubular ground shield (128) may be slidably received on the insulative housing (54) in proximate engagement with its outer peripheral surface (82). In this instance, the ground-shield includes a first integral ground contact (84) for engagement with a ground contact (86) of an external unit (26) associated with the mating contacts (22) engaged by the first contact surfaces (64) of the first and second contacts (62, 66) and a second integral ground contact (88) for engagement with a ground contact surface (90) on the planar card (28, 28A) inserted into the card receiving slot (70).
    • 卡边缘连接器包括细长的纵向延伸的外框架(36),其限定适于接收包括接触构件(34)并且位于平行的横向延伸平面中的多个小瓶模块(40,40A)的接收区域(38),其作为 定位成与配合触点(22)连接地接合。 每个小瓶模块(40,40A)包括绝缘壳体(54),其中具有第一和第二间隔开的大致平行的细长通道,以及用于在第一和第二通道(58,58A)之间接收的卡接收凹部(60) 卡(28,28A)具有在其上具有导电接触构件(34)的相对表面(30,32)。 分别在第一和第二通道(58,58A)中接收第一和第二触点(62,66)。 每个具有分别定位成用于与第一和第二配合触头(22)接合的第一接触表面(64)。 作为组的小块模块(40,40A)的卡接收凹部(60)限定纵向延伸的卡接收槽(70)。 触头各自包括突出到卡接收槽(70)中的第二接触表面(68),用于分别与平面卡(28,28A)上的第二导电接触构件(34)接合。 管状接地屏蔽(128)可以可滑动地容纳在绝缘外壳(54)上,与其外周表面(82)紧密接合。 在这种情况下,接地屏蔽包括用于与由与第一接触表面(64)接合的配合触头(22)相关联的外部单元(26)的接地触头(86)接合的第一整体接地触点(84) 的第一和第二触点(62,66)和第二整体接地触头(88),用于与插入卡接收槽(70)中的平面卡(28,28A)上的接地接触表面(90)接合。