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    • 3. 发明公开
    • BUS TYPE SWITCH SOCKET BRACKET
    • 总线型开关插座支架
    • EP3288125A1
    • 2018-02-28
    • EP16782462.2
    • 2016-01-28
    • Shenzhen Power2control Smart Tech Co., Ltd.
    • LI, Hui
    • H01R13/73H01R13/518
    • H01H9/02H01R13/518H01R13/73H01R25/161
    • A bus type switch socket bracket includes a bracket body (1). The bracket body (1) includes at least one control panel mounting hole (7). A bare metal contact pad (3) are arranged at the sides of the control panel mounting hole (7) and connected to a metal body (2) embedded in the bracket body (1). The bare metal contact pad (3) serves as a bus access port for providing low-voltage direct current power supply, communication and control lines of various control panels mounted on the bracket body (1). By means of providing a bracket body and a bus in the bracket body, the bus type switch socket bracket provides a hardware platform and a mounting space for application extension of an intelligent control device, and is simple in structure and convenient to use.
    • 总线型开关插座支架包括支架主体(1)。 支架体(1)包括至少一个控制面板安装孔(7)。 在控制面板安装孔(7)的侧面布置有裸露的金属接触垫(3),该裸露的金属接触垫(3)连接到嵌入到托架体(1)中的金属体(2)。 裸金属接触垫(3)用作总线接入端口,用于提供安装在支架体(1)上的各种控制面板的低压直流电源,通信和控制线。 总线式开关插座支架通过在支架体内设置支架体和总线,为智能控制装置的应用扩展提供了硬件平台和安装空间,结构简单,使用方便。
    • 8. 发明公开
    • INTERNAL STACK-UP STRUCTURE OF TOUCH PANEL AND METHOD FOR PRODUCING THE SAME
    • INTERNE STAPELUNGSSTRUKTUR EINESBERÜHRUNGBILDSCHIRMSUND HERSTELLUNGSVERFAHRENDAFÜR
    • EP2558904A4
    • 2017-01-11
    • EP10849711
    • 2010-08-04
    • TPK TOUCH SOLUTIONS (XIAMEN) INC
    • LEE YUHWENRUAN KEMING
    • G02F1/1333G06F3/041
    • H01H9/02G06F3/0412G06F2203/04103H01H11/00
    • The present invention relates to an internal stack-up structure of a touch panel including a touch sensing substrate having a joint area with an electronic assembly placed thereon; a cover substrate facing to and being spaced out from the touch sensing substrate and having a first border region with a first mask layer coated thereon, the first border region corresponding to the joint area; a reflection layer disposed on the first mask layer and corresponding to the electronic assembly; and a bonding layer formed at least between the electronic assembly and the reflection layer, the bonding layer being formed by liquid bonding materials which change from liquid state to solid state to improve the bonding strength between the cover substrate and the touch sensing substrate after being exposed to light reflected from the reflection layer.
    • 本发明涉及一种触摸面板的内部叠层结构,其包括具有与其上放置有电子组件的接合区域的触摸感测基板; 覆盖基板,其面向并与所述触摸感测基板间隔开并且具有其上涂覆有第一掩模层的第一边界区域,所述第一边界区域对应于所述接合区域; 反射层,设置在所述第一掩模层上并对应于所述电子组件; 以及至少形成在所述电子组件和所述反射层之间的接合层,所述接合层由液体接合材料形成,所述液体接合材料从液态变为固态,以改善所述覆盖基板和所述触摸感测基板的暴露后的接合强度 从反射层反射的光。