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    • 5. 发明公开
    • High temperature resistance, radiation curable maskant for metal substrates
    • Hochtemperaturbeständigkeit,StrahlungshärtbareMaskierungszusammensetzungfürMetallsubstrate
    • EP2848656A1
    • 2015-03-18
    • EP14182406.0
    • 2014-08-27
    • DYMAX CORPORATION
    • Nebioglu, AhmetMorin, Michael A.Cayer, Christopher AlanRahim, Marufur
    • C09D5/20C09D169/00C09D175/04B05D7/14C08G64/00C08G18/00
    • C09D169/00C08G18/00C08G18/44C08G18/672C08G64/00C09D5/008C09D5/20C09D169/005C09D175/04C09D175/16C23C4/01C08G18/42
    • A method for shielding a metal substrate surface during the application of heat to the surroundings of the substrate which comprises. A liquid maskant composition is formed which comprises: a) at least one of a polycarbonate urethane diacrylate oligomer, a polycarbonate urethane dimethacrylate oligomer, a polycarbonate caprolactone urethane diacrylate oligomer, or a polycarbonate caprolactone urethane dimethacrylate oligomer; b) a reactive diluent capable of free radical polymerization; and c) a photoinitiator capable of generating free radicals when exposed to actinic radiation. The maskant composition is applied onto a surface of the substrate. The maskant composition is then exposed to sufficient actinic radiation to polymerize or crosslink the composition into a dried maskant. In use the dried maskant is heated on the substrate to a temperature of from 204.4°C (400°F) to 315.6°C (600°F) for from 20 minutes to 30 minutes, and then the maskant is removed.
    • 一种在向衬底周围施加热量时屏蔽金属衬底表面的方法,包括。 形成液体掩蔽剂组合物,其包括:a)聚碳酸酯聚氨酯二丙烯酸酯低聚物,聚碳酸酯聚氨酯二甲基丙烯酸酯低聚物,聚碳酸酯己内酯氨基甲酸酯二丙烯酸酯低聚物或聚碳酸酯己内酯氨基甲酸酯二甲基丙烯酸酯低聚物中的至少一种; b)能够进行自由基聚合的反应性稀释剂; 和c)当暴露于光化辐射时能够产生自由基的光引发剂。 将掩蔽剂组合物施加到基材的表面上。 然后将掩蔽剂组合物暴露于足够的光化辐射以将组合物聚合或交联成干燥的掩蔽剂。 在使用中,将干燥的掩蔽剂在基材上加热至204.4℃(400°F)至315.6℃(600°F)的温度20分钟至30分钟,然后除去掩蔽剂。