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1. 发明授权

EP2147942B1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION 有权
标题翻译：环氧树脂用于封装光学半导体元件的，硬化体THEREOF和环氧树脂的BASIS生产光学半导体部件
公开(公告)号：EP2147942B1
公开(公告)日：2016-07-06
申请号：EP08751859.3
申请日：2008-04-16
申请人： Nitto Denko Corporation
发明人： Noro, Hiroshi
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31 , H01L33/00 , C08G59/32 , C08G59/42 , C08G59/68 , H01L33/56
CPC分类号： H01L23/293 , C08G59/3245 , C08G59/4215 , C08G59/685 , H01L33/56 , H01L2924/0002 , H01L2924/00

2. 发明公开

EP3029106A1 THERMOSETTING LIGHT-REFLECTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING BOARD PRODUCED THEREWITH, METHOD FOR MANUFACTURE THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：热，光反射树脂组合物，其生产的板光半导体元件的方法其生产和光学半导体部件
公开(公告)号：EP3029106A1
公开(公告)日：2016-06-08
申请号：EP15198212.1
申请日：2008-09-25
申请人： Hitachi Chemical Co., Ltd.
发明人： KOTANI, Hayato , URASAKI, Naoyuki , MIZUTANI, Makoto
IPC分类号： C08L63/00 , C08G59/40 , C08L3/00 , C08L5/00 , C08L83/10 , H01L23/14 , H01L33/00
CPC分类号： C08G59/3245 , C08G77/445 , C08L63/00 , C08L83/10 , H01L33/483 , H01L33/60 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , Y10T428/1068 , C08L83/00 , H01L2924/00 , H01L2224/0401
摘要： There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. The thermosetting light-reflecting resin composition comprises an epoxy resin, a curing agent, a white pigment, an organosiloxane moiety-containing compound having a number average molecular weight of 2,000 to 20,000, and a release agent. After curing it has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and with the resin composition it is possible to perform transfer molding 100 times or more continuously.
摘要翻译：还有本发明提供一种热固性光反射用树脂组合物做了具有光半导体元件搭载基板，彩色所需的各种特性的高电平：例如光学性质和耐热变色性，成型时提供高脱模：如传递成型，并允许模制工艺，以连续进行。这样提供了用于高效率地制造可靠性高的光半导体元件搭载用基板及光半导体装置中的每个与所述树脂组合物生产，及其方法。具有2000的数均分子量为20000的热固性光反射用环氧树脂的树脂组合物包括，一种固化剂，一种白色颜料，有机硅氧烷的含有基团的化合物，和脱模剂。固化后它具有在400nm的光波长的80％或更多的漫反射率; 和用树脂组合物，能够进行转移模塑100次或更多次连续地进行。

3. 发明公开

EP2669332A2 Epoxy resin composition and light emitting apparatus 有权转让
标题翻译：环氧树脂组合物和发光装置
公开(公告)号：EP2669332A2
公开(公告)日：2013-12-04
申请号：EP13170121.1
申请日：2013-05-31
申请人： LG Innotek Co., Ltd.
发明人： Moon, Sung Bae , Jeong, Jae Hun , Yoon, Sang In
IPC分类号： C08L63/00 , C08L63/06 , C08G59/32 , C08G59/26 , H01L51/50 , H01L33/00
CPC分类号： H01L33/58 , C08G59/3218 , C08G59/3245 , C08G59/4215 , C08L63/06 , H01L33/56 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.

4. 发明公开

EP2602256A1 METHOD FOR PRODUCING EPOXY COMPOUND HAVING CYANURIC ACID SKELETON 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER EPOXIDVERBINDUNG MIT EINEMCYANSÄURESKELETT
公开(公告)号：EP2602256A1
公开(公告)日：2013-06-12
申请号：EP11814521.8
申请日：2011-07-27
申请人： Nissan Chemical Industries, Ltd.
发明人： TAKEYAMA, Toshiaki , ENDO, Yuki , YANAGISAWA, Sayoko
IPC分类号： C07D405/14 , C08G59/32
CPC分类号： C07D405/14 , C08G59/027 , C08G59/3245 , C08G73/0644
摘要： There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1):

(in Formula (1), n1, n2, and n3 are individually any one of integers of 2 to 6; n4, n5, and n6 are individually an integer of 2; n7, n8, and n9 arc individually an integer of 1; and R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are independently a hydrogen atom or a C 1-10 alkyl group), comprising: reacting cyanuric chloride with a C 4-8 alkenol and reacting the obtained compound having an unsaturated bond with a peroxide.
摘要翻译：提供了一种环氧化合物，其通过在其液态下保持有利的处理性能而被热固化而提供具有高透明度和高弯曲强度的固化产物的性质; 以及使用该环氧化合物制造组合物的方法。式（1）的环氧化合物的制造方法（式（1）中，n1，n2和n3分别是2〜6的整数中的任一个，n4，n5和n6分别为2的整数。 n7，n8和n9分别为1的整数; R 1，R 2，R 3，R 4，R 5和R 6独立地为氢原子或C 1-10烷基），其包括：氰尿酰氯与C 4-8链烯醇反应，并使所得到的具有不饱和键的化合物与过氧化物反应。

5. 发明公开

EP2527385A1 Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same 有权
标题翻译：环氧树脂加工设备Hallbeitervorrichtung und optische Halbleitervorrichtung damit
公开(公告)号：EP2527385A1
公开(公告)日：2012-11-28
申请号：EP12169010.1
申请日：2012-05-23
申请人： NITTO DENKO CORPORATION
发明人： Uchida, Takahiro , Noro, Hiroshi
IPC分类号： C08G59/00 , H01L23/29
CPC分类号： C08G59/4215 , C08G59/3245 , C08G59/688 , C08L63/00 , H01L23/296 , H01L2924/0002 , C08L83/04 , H01L2924/00
摘要： The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a curing accelerator; (D) a specific silicone resin; and (E) a specific alcohol compound.
摘要翻译：本发明涉及用于光学半导体器件的环氧树脂组合物，其包括以下成分（A）至（E）：（A）环氧树脂; （B）酸酐固化剂; （C）固化促进剂; （D）特定的有机硅树脂; 和（E）特定的醇化合物。

6. 发明授权

EP1914811B1 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, MOLDED BODY AND SEALING MEMBER 有权
标题翻译：发光装置，从而产生，成型密封部件的方法
公开(公告)号：EP1914811B1
公开(公告)日：2012-06-27
申请号：EP06781880.7
申请日：2006-07-28
申请人： Nichia Corporation
发明人： KURAMOTO, Masafumi , MIKI, Tomohide , TSUKIOKA, Tomoya , KISHIMOTO, Tomohisa
IPC分类号： C08G59/42 , C08G59/32 , H01L33/56 , H01L33/60 , H01L23/28 , H01L23/29 , H01L23/31
CPC分类号： H01L33/36 , C08G59/3245 , C08K3/013 , C08K5/005 , H01L33/32 , H01L33/56 , H01L33/60 , H01L2224/0603 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

7. 发明公开

EP2323178A3 Light-emitting device, method for manufacturing same, molded body and sealing member 有权
标题翻译：的发光装置，方法及其制备，成型和密封构件
公开(公告)号：EP2323178A3
公开(公告)日：2012-01-04
申请号：EP11155918.3
申请日：2006-07-28
申请人： Nichia Corporation
发明人： Kuramoto, Masafumi , Miki, Tomohide , Tsukioka, Tomoya , Kishimoto, Tomohisa
IPC分类号： H01L33/00 , C08G59/42 , H01L23/28 , H01L23/29 , H01L23/31
CPC分类号： H01L33/36 , C08G59/3245 , C08K3/013 , C08K5/005 , H01L33/32 , H01L33/56 , H01L33/60 , H01L2224/0603 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

8. 发明授权

EP2196501B1 Thermosetting epoxy resin composition and semiconductor device 有权
标题翻译：热固性环氧树脂组合物和半导体器件
公开(公告)号：EP2196501B1
公开(公告)日：2011-05-04
申请号：EP09252742.3
申请日：2009-12-07
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Taguchi, Yusuke , Tomiyoshi, Kazutoshi , Tada, Tomoyoshi
IPC分类号： C08L63/00 , H01L23/29
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

9. 发明公开

EP2186844A1 Heat-curable resin composition 有权
标题翻译： WärmehärtbareHarzzusammensetzung
公开(公告)号：EP2186844A1
公开(公告)日：2010-05-19
申请号：EP09252607.8
申请日：2009-11-13
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Shin-Etsu Chemical Co.,Ltd. , Kashiwagi, Tsutomu , Silicone Denshi Zairyo G.K. , Taguchi, Yusuke , Silicone Denshi Zairyo G.K.
IPC分类号： C08G59/30 , C08G59/32 , C08G59/42
CPC分类号： C08G59/306 , C08G59/3245 , C08G59/42
摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B) / carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2" (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
摘要翻译：产生具有优异的耐热性和耐光性的固化产物的热固性树脂组合物和使用该组合物成型的预成型包装。热固性树脂组合物含有下述成分（A）〜（E）：（A）分子内含有至少一个环氧基的异氰脲酸衍生物100质量份，（B）有机硅树脂在每个分子内含有至少一个环氧基，其量为10至1,000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分（C）成分中的（B）/羧基当量]在0.6〜2.2“（D）固化促进剂的范围内，相对于组合物100质量份，为0.05〜5质量份组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

10. 发明授权

EP1778762B1 PROTON CONDUCTING COPOLYMERS 有权
标题翻译：质子传导共聚物
公开(公告)号：EP1778762B1
公开(公告)日：2007-12-19
申请号：EP05772523.6
申请日：2005-08-09
申请人： Stichting Energieonderzoek Centrum Nederland
发明人： IONESCU, Lucia, Daniela , WAKKER, Andre
IPC分类号： C08G65/44 , C08L71/12
CPC分类号： C08G59/3245 , C08G65/44 , C08G65/485
摘要： The present invention relates to proton conducting copolymers, preferably proton conducting block copolymers, according to formula (I) wherein the copolymer comprises 2,5- and/or 2,6-di(p-Rl-aryl)phenol moieties and 2,5-and/or 2,6-di-R2-phenol moieties; R1 is hydrogen or a C1 - C10 alkyl group; R2 is a C1-C10 alkyl group; and R3 is chloro, bromo or a heterocyclic group selected from 1-pyrazolyl, 1-benzopyrazolyl, 1-imidazolyl, 1-benzoimidazolyl, 2,3-triazol-l-yl, 2,4-triazol-l-yl, 1,6-dihydropyridazin-l-yl, 1,2-dihydropyrimidin-l-yl, 1,2-dihydro-l,3-benzodiazin-l-yl, 1,2-dihydropyrazin-l-yl, 1,2-dihydro-l,4-benzodiazin-l-yl, 1,2-dihydro-1,3,5-triazin-l-yl and 3,4-dihydro-1,2,4-triazinyl, provided that within the copolymer at least one R3 is a heterocyclic group; p is in the range of 100 to 100.000; and q is in the range of 100 to 100.000. The proton conducting copolymers are very suitable as membranes for fuel cells.

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