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1. 发明公开

EP2485993A4 ENHANCED FERTILIZER PRODUCTS WITH POLYMER ADJUVANTS 有权转让
标题翻译： VERSTÄRKTEDÜNGEMITTELMIT POLYMERHILFSSTOFFEN
公开(公告)号：EP2485993A4
公开(公告)日：2016-05-18
申请号：EP10822428
申请日：2010-09-24
申请人： SPECIALTY FERTILIZER PRO LLC
发明人： SANDERS JOHN LARRY
IPC分类号： C05G3/00 , C05D1/00 , C05D3/02 , C08F222/02
CPC分类号： C08F22/04 , C05D1/00 , C05D3/02 , C08F22/06 , C05D5/00 , C05D9/02 , C05G3/0029
摘要： Improved fertilizer mineral compositions are provided by coating a mineral, such as gypsum, a member of the Kieserite Group, potassium magnesium sulfate, elemental sulfur, and mixtures thereof, with low pH maleic-itaconic copolymers. The preferred copolymers are aqueous dispersions of acid or partial salt maleic-itaconic copolymers, and are applied by spraying or other means onto the surface of the mineral and allowed to dry. The copolymer coatings increase the solubility of sulfate and calcium or magnesium ions from the fertilizer minerals, allowing accelerated plant availability and uptake of such nutrients.
摘要翻译：通过用低pH马来酸酐共聚物涂覆矿物，例如石膏，Kieserite组的成员，硫酸钾钾，元素硫及其混合物来提供改进的肥料矿物组合物。优选的共聚物是酸或部分马来酸酐共聚物的水分散体，并通过喷雾或其它方式施用到矿物表面并使其干燥。共聚物涂层增加了硫酸盐和钙或镁离子从肥料矿物中的溶解度，从而加速了植物的利用和摄取这些营养物质。

2. 发明公开

EP0516987A1 Polymere auf der Basis von Bicyclo[2.2.1] hept-5-en-2,3-dicarbonsäure-anhydriden 失效
标题翻译： Polymere au Basis von Bicyclo [2.2.1]庚-5-烯-2,3-二碳二烯酸酐。
公开(公告)号：EP0516987A1
公开(公告)日：1992-12-09
申请号：EP92107608.9
申请日：1992-05-06
申请人： BASF Aktiengesellschaft
发明人： Besecke, Siegmund, Dr. , Guentherberg, Norbert, Dr.
IPC分类号： C08F22/04
CPC分类号： C08F22/04
摘要： Homopolymere bzw. statistische Copolymere aus

a) 5 bis 100 Gew.-% eines Bicyclo[2.2.1-]hept-5-en-2,3-dicarbonsäureanhydrides der allgemeinen Formel I (Monomere I)
in der die Variablen folgende Bedeutung haben:

R C₁-C₁₀-Alkyl oder C₁-C₁₀-Alkoxy, wobei der Alkyl- oder Alkoxyrest jeweils durch einen oder mehrere Sauerstoffatome unterbrochen sein kann, C₅-C₇-Cycloalkyl, einen ein- oder zweikernigen Aryl- oder Aryloxyrest, wobei der Aryl- oder Aryloxyrest jeweils seinerseits mit C₁-C₁₀-Alkylresten substituiert sein kann, C₁-C₁₀-Alkylaryl-, Cyano, Chlor, Brom, C₁-C₁₀-Alkoxy, oder Reste der Formeln

-CO-O-R¹

-O-CO-R¹

-CO-N(R¹)R²,

wobei
R¹ Wasserstoff, C₁-C₁₀-Alkyl, C₅-C₇-Cycloalkyl, einen ein- oder zweikernigen Arylrest, der seinerseits mit C₁-C₁₀-Alkylresten substituiert sein kann, C₁-C₁₀-Alkylaryl und
R² einen der Reste R¹ bezeichnen,
n 0 bis 4, wobei die Reste R gleich oder verschieden voneinander sein können,
Z Sauerstoff oder Schwefel
und
b) 0 bis 95 Gew.-% weiterer, mit den Monomeren I copolymerisierbarer Monomerer (Monomere II).
摘要翻译：均聚物或无规共聚物，其包含a）5至100重量％的式I（单体I）的双环[2.2.1]庚-5-烯-2,3-二羧酸酐，其中变量具有具有以下含义：R是C 1 -C 10 - 烷基或C 1 -C 10 - 烷氧基，其中每个烷基或烷氧基可被一个或多个氧原子间隔，C 5 -C 7 - 环烷基，单环或双环芳基或芳氧基，其中氰基，氯，溴，C 1 -C 10 - 烷氧基或式-CO-OR 1基团可以被C 1 -C 10 - 烷基取代，或者是C 1 -C 10烷基芳基，氰基，氯，溴，，-O-CO-R 1或-CO-N（R 1）R 2，其中R 1是氢，C 1 -C 10 - 烷基，C 5 -C 7 - 环烷基，单环或双环芳基，其本身可以被C 1 -C 10 - 烷基或C 1 -C 10 - 烷基芳基取代，并且R 2是基团R 1之一，n为0至4，其中基团R可以与彼此不同，Z为氧或硫，b）0〜95重量％的其它单体（单体II）为 h可与单体I共聚。

3. 发明公开

EP2500932A4 ADHESIVE COMPOSITION 有权转让
标题翻译：粘合剂组合物
公开(公告)号：EP2500932A4
公开(公告)日：2015-10-28
申请号：EP10828148
申请日：2010-09-09
申请人： DEXERIALS CORP
发明人： NAMIKI HIDETSUGU , KANISAWA SHIYUKI , KATAYANAGI GENKI
IPC分类号： H01L21/60 , C08G59/20 , C08G59/42 , C09J11/06 , C09J133/00 , C09J163/00 , H01L33/48
CPC分类号： C08G59/24 , C08F265/04 , C08F283/10 , C08G59/4215 , C08L33/068 , C08L33/10 , C08L2666/04 , C09J151/06 , C09J151/08 , C09J163/00 , H01L24/29 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , C08F2220/1808 , C08F2220/1825 , C08F2220/325 , C08F2220/1858 , C08F220/06 , C08F220/14 , C08F220/20 , C08F22/04 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.

4. 发明公开

EP1816147A1 IONOMER, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE 审中-公开
标题翻译： IONOMER，HERSTELLUNGSVERFAHRENDAFÜRUNDFORMKÖRPER
公开(公告)号：EP1816147A1
公开(公告)日：2007-08-08
申请号：EP05809455.8
申请日：2005-11-21
申请人： JSR Corporation
发明人： KANAE, Kentarou c/o JSR CORPORATION , TANAKA, Minoru c/o JSR CORPORATION
IPC分类号： C08F8/44
CPC分类号： C08F8/44 , C08F22/04
摘要： An ionomer obtained by reacting metal compound particles having an average particle diameter of 0.1 µm or less, with a polymer having a structural unit derived from an unsaturated dicarboxylic acid anhydride. There are provided an ionomer which has the same flexibility and moldability as conventional olefin-based thermoplastic elastomers have, is good at mechanical properties, oil resistance and abrasion resistance, and is superior particularly in tensile strength at break and scratch resistance; a process for production thereof; and a molded article thereof.
摘要翻译：通过使平均粒径为0.1μm以下的金属化合物粒子与具有来源于不饱和二羧酸酐的结构单元的聚合物反应而得到的离聚物。提供了具有与常规烯烃类热塑性弹性体相同的柔性和成型性的离聚物，具有良好的机械性能，耐油性和耐磨性，特别是在断裂拉伸强度和耐擦伤性方面优异; 其生产方法; 及其成型品。

5. 发明授权

EP0152371B1 Polymere aus Allyl- oder Methallyl-substituierten bicyclischen ungesättigten Dicarbonsäureanhydriden 有权
标题翻译：全部或甲基取代的双环非饱和二羧酸的聚合物
公开(公告)号：EP0152371B1
公开(公告)日：1989-04-26
申请号：EP85810023.3
申请日：1985-01-25
申请人： CIBA-GEIGY AG
发明人： Renner, Alfred, Dr. , Haug, Theobald, Dr. , Schreiber, Bruno, Dr.
IPC分类号： C08F22/04 , C07C61/35 , C08G59/42
CPC分类号： C08F22/04 , C08L63/00 , C08L2666/04

6. 发明授权

EP2485993B1 ENHANCED FERTILIZER PRODUCTS WITH POLYMER ADJUVANTS 有权转让
公开(公告)号：EP2485993B1
公开(公告)日：2018-10-31
申请号：EP10822428.8
申请日：2010-09-24
申请人： Specialty Fertilizer Products, LLC
发明人： SANDERS, John, Larry
IPC分类号： C05G3/00 , C05D1/00 , C05D3/02 , C08F222/02
CPC分类号： C05D3/02 , C05D1/00 , C08F22/04 , C08F22/06 , Y10S71/903 , C05D5/00 , C05D9/02 , C05G3/0029
摘要： Improved fertilizer mineral compositions are provided by coating a mineral, such as gypsum, a member of the Kieserite Group, potassium magnesium sulfate, elemental sulfur, and mixtures thereof, with low pH maleic-itaconic copolymers. The preferred copolymers are aqueous dispersions of acid or partial salt maleic-itaconic copolymers, and are applied by spraying or other means onto the surface of the mineral and allowed to dry. The copolymer coatings increase the solubility of sulfate and calcium or magnesium ions from the fertilizer minerals, allowing accelerated plant availability and uptake of such nutrients.

7. 发明公开

EP0866078A3 Process for preparing anhydride polymers 失效
标题翻译：制备酐聚合物的方法
公开(公告)号：EP0866078A3
公开(公告)日：1998-12-16
申请号：EP98301904.3
申请日：1998-03-13
申请人： ROHM AND HAAS COMPANY
发明人： Shah, Shailesh Shantilal , Weinstein, Barry
IPC分类号： C08F22/04
CPC分类号： C08F22/04
摘要： A process for preparing anhydride polymers in aromatic hydrocarbon solvents using a dialkyl peroxide/amine compound initiator system is disclosed. The amine compound allows more efficient use of free-radical initiators while achieving high monomer conversion polymerizations compared to conventional initiator systems, particularly in the preparation of maleic anhydride polymers.
摘要翻译：公开了一种使用二烷基过氧化物/胺化合物引发剂体系在芳香烃溶剂中制备酸酐聚合物的方法。与常规引发剂体系相比，胺化合物允许更有效地使用自由基引发剂，同时实现高单体转化聚合，特别是在制备马来酸酐聚合物时。

8. 发明公开

EP0152371A3 Polymers of allyl or methallyl substituted bicyclic unsaturated dicarboxylic anhydrides 有权
标题翻译：全甲基或甲基取代双环非饱和二羧酸的聚合物
公开(公告)号：EP0152371A3
公开(公告)日：1986-10-22
申请号：EP85810023
申请日：1985-01-25
申请人： CIBA-GEIGY AG
发明人： Renner, Alfred, Dr. , Haug, Theobald, Dr. , Schreiber, Bruno, Dr.
IPC分类号： C08F22/04 , C07C61/35 , C08G59/42
CPC分类号： C08F22/04 , C08L63/00 , C08L2666/04

9. 发明授权

EP2500932B1 ADHESIVE COMPOSITION 有权转让
公开(公告)号：EP2500932B1
公开(公告)日：2016-11-09
申请号：EP10828148.6
申请日：2010-09-09
申请人： Dexerials Corporation
发明人： NAMIKI Hidetsugu , KANISAWA Shiyuki , KATAYANAGI Genki
IPC分类号： C08F265/04 , C09J151/06 , C09J151/08 , C08L33/06 , H01L23/00 , C08G59/42 , C08F283/10 , C09J163/00 , C08G59/24
CPC分类号： C08G59/24 , C08F265/04 , C08F283/10 , C08G59/4215 , C08L33/068 , C08L33/10 , C08L2666/04 , C09J151/06 , C09J151/08 , C09J163/00 , H01L24/29 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , C08F2220/1808 , C08F2220/1825 , C08F2220/325 , C08F2220/1858 , C08F220/06 , C08F220/14 , C08F220/20 , C08F22/04 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.

10. 发明公开

EP2500932A1 ADHESIVE COMPOSITION 有权转让
标题翻译： HAFTZUSAMMENSETZUNG
公开(公告)号：EP2500932A1
公开(公告)日：2012-09-19
申请号：EP10828148.6
申请日：2010-09-09
申请人： Sony Chemical & Information Device Corporation
发明人： NAMIKI Hidetsugu , KANISAWA Shiyuki , KATAYANAGI Genki
IPC分类号： H01L21/60 , C08G59/20 , C08G59/42 , C09J11/06 , C09J133/00 , C09J163/00 , H01L33/48
CPC分类号： C08G59/24 , C08F265/04 , C08F283/10 , C08G59/4215 , C08L33/068 , C08L33/10 , C08L2666/04 , C09J151/06 , C09J151/08 , C09J163/00 , H01L24/29 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , C08F2220/1808 , C08F2220/1825 , C08F2220/325 , C08F2220/1858 , C08F220/06 , C08F220/14 , C08F220/20 , C08F22/04 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.
摘要翻译：用于将芯片部件倒装芯片安装在电路板上的粘合剂组合物含有脂环族环氧化合物，脂环族酸酐固化剂和丙烯酸树脂。相对于100质量份的脂环式环氧化合物，脂环酸酐固化剂的含量为80〜120质量份，相对于100质量份的丙烯酸树脂，丙烯酸树脂的量为5〜50质量份脂环族环氧化合物，脂环酸酐固化剂和丙烯酸树脂的总量。丙烯酸树脂是通过100质量份的（甲基）丙烯酸烷基酯和2〜100质量份的甲基丙烯酸缩水甘油酯共聚得到的树脂，其吸水率为1.2％以下。

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