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1. 发明公开

EP2921461A4 LASER FUSION-CUTTING METHOD FOR PLATE GLASS 有权
标题翻译：激光聚变切割方法 - 玻璃
公开(公告)号：EP2921461A4
公开(公告)日：2016-10-05
申请号：EP13854446
申请日：2013-10-11
申请人： NIPPON ELECTRIC GLASS CO
发明人： INAYAMA NAOTOSHI
IPC分类号： C03B33/08 , B23K26/00 , B23K26/14 , B23K26/38 , B23K26/40 , B23K103/00 , C03B33/02
CPC分类号： C03B33/082 , B23K26/00 , B23K26/14 , B23K26/1438 , B23K26/38 , B23K26/40 , B23K2203/50 , C03B33/02 , C03B33/08
摘要： Provided is a laser fusing method for a glass sheet, including: cutting the glass sheet (G) by irradiating the glass sheet (G) with a laser (L) from a front surface (S) side thereof along a preset cutting line (X) extending in a surface direction of the glass sheet (G); and jetting a shaping gas (A3) so as to form a flow along at least one of the front surface (S) and a back surface (B) of the glass sheet (G), the shaping gas (A3) passing through an irradiation portion (C) of the laser (L).

2. 发明公开

EP2990389A1 CUTTING METHOD FOR GLASS SHEET 有权
标题翻译： VERFAHREN ZUM SCHNEIDEN VON GLASSCHEIBEN
公开(公告)号：EP2990389A1
公开(公告)日：2016-03-02
申请号：EP15173829.1
申请日：2012-09-14
申请人： NIPPON ELECTRIC GLASS CO., LTD
发明人： FUJII, Takahide , UCHIDA, Setsuo , INAYAMA, Naotoshi , NODA, Takayuki , ITOH, Sho , ETA, Michiharu
IPC分类号： C03B33/08 , B23K26/00 , B23K26/04 , B23K26/38 , B23K26/14 , B23K26/142
CPC分类号： C03B33/082 , B23K26/142 , B23K26/1438 , B23K26/38 , B23K26/402 , B23K2103/50 , B23K2103/54 , C03B33/0222 , Y02P40/57 , Y10T428/24777
摘要： A laser fusing method for a glass sheet, comprising jetting an assist gas to an irradiation portion which is irradiated with a laser beam while radiating the laser beam from a front surface side of a glass sheet to generate a molten glass portion so that a recessed portion is formed in the molten glass portion and the recessed portion is propagated to a back surface of the glass sheet, thereby cutting and dividing the glass sheet,
wherein the jetting of the assist gas comprises:
jetting the assist gas in a direction inclined with respect to the front surface of the glass sheet so that a part of the molten glass portion of the glass sheet is thickened toward a side to which the assist gas is jetted and another part of the molten glass portion of the glass sheet is blown off toward the side to which the assist gas is jetted, to thereby form the recessed portion and an inclined wall portion, the inclined wall portion being inclined oppositely to an inclination of a jetting direction of the assist gas and formed of the thickened part of the molten glass portion in the recessed portion; and
subsequently guiding the assist gas to the back surface side of the glass sheet along the inclined wall portion so that a wall portion facing the inclined wall portion in the recessed portion is formed as a cut surface having a convex curved-surface shape.
摘要翻译：一种玻璃板的激光熔合方法，其特征在于，包括向从照射激光的照射部喷射辅助气体，同时从玻璃板的表面侧照射激光，生成熔融玻璃部，使得凹部形成在熔融玻璃部分中，并且凹部传播到玻璃板的后表面，从而切割和分割玻璃板，其中辅助气体的喷射包括：沿相对于玻璃板的前表面使得玻璃板的熔融玻璃部分的一部分朝向辅助气体喷射的一侧变厚，另一部分玻璃板的熔融玻璃部分朝向侧面吹出辅助气体被喷射到其上，从而形成凹部和倾斜壁部，该倾斜壁部相对于喷射方向的倾斜相反地倾斜 e辅助气体并由凹部中的熔融玻璃部分的加厚部分形成; 并且随后沿着倾斜壁部将辅助气体引导到玻璃板的背面侧，使得在凹部中面向倾斜壁部的壁部形成为具有凸曲面形状的切割面。

3. 发明授权

EP2228165B1 Method of cutting a substrate with forming along a line of overlapping modified spot inside the substrate 有权
标题翻译：一种用于通过沿着线重叠的形成切割基板的方法在所述衬底改性点
公开(公告)号：EP2228165B1
公开(公告)日：2015-01-07
申请号：EP10164391.4
申请日：2001-09-13
申请人： HAMAMATSU PHOTONICS K. K.
发明人： Fukuyo, Fumitsugu , Fukumitsu, Kenshi , Uchiyama, Naoki , Wakuda, Toshimitsu
IPC分类号： B23K26/073 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , B23K26/40 , B23K26/08 , B23K26/04
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341

4. 发明授权

EP2251135B1 A method of cutting an object along two different directions further using an elastic sheet for dividing the object 有权
标题翻译：通过使用柔性膜切割在两个不同方向的对象，用于分离所述对象的方法
公开(公告)号：EP2251135B1
公开(公告)日：2014-12-31
申请号：EP10171522.5
申请日：2001-09-13
申请人： HAMAMATSU PHOTONICS K. K.
发明人： Fukuyo, Fumitsugu , Fukumitsu, Kenshi , Uchiyama, Naoki , Wakuda, Toshimitsu
IPC分类号： B23K26/073 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , B23K26/40 , B23K26/08 , B23K26/04 , H01L21/782 , H01L21/82
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341

5. 发明公开

EP2724993A2 Methods for laser scribing and separating glass substrates 有权
标题翻译：激光划线和分离玻璃基板的方法
公开(公告)号：EP2724993A2
公开(公告)日：2014-04-30
申请号：EP14152259.9
申请日：2010-11-24
申请人： Corning Incorporated
发明人： Li, Xinghua
IPC分类号： C03B33/033 , C03B33/09 , C03B33/085 , B23K26/073
CPC分类号： C03B33/091 , B23K26/0736 , C03B33/033 , C03B33/082 , Y02P40/57
摘要： Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.
摘要翻译：提供了在具有压缩表面层和内部张力层的强化玻璃基板中形成划痕孔的方法。在一个实施例中，形成第一缺陷和第二缺陷以部分暴露内张力层。通过以第一划刻速度在激光玻璃基板的表面上平移激光束和冷却射流，可以在第一划线方向上产生第一划刻口。通过将激光束和冷却射流以大于第一刻划速度的第二刻划速度平移到强化玻璃基板的表面上，可以在第二刻划方向上产生与第一刻划排气口相交的第二划刻排气口。缺陷可能垂直于划线方向。在另一个实施例中，可以在产生第二刻划凹痕之前在交叉位置处熔合第一划刻凹痕。

6. 发明公开

EP2507182A2 METHODS FOR LASER SCRIBING AND SEPARATING GLASS SUBSTRATES 有权
标题翻译：方法切割和共享GLASUBSTRATEN BY激光器件
公开(公告)号：EP2507182A2
公开(公告)日：2012-10-10
申请号：EP10784931.7
申请日：2010-11-24
申请人： Corning Incorporated
发明人： LI, Xinghua
IPC分类号： C03B33/033
CPC分类号： C03B33/091 , B23K26/0736 , C03B33/033 , C03B33/082 , Y02P40/57
摘要： Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.

7. 发明公开

EP2505297A1 Method of processing a substrate having two superposed layers using laser focused inside the substrate for welding the layers 有权转让
标题翻译：一种用于在基板的内部通过的聚焦激光束处理包含层的基材的层的焊接方法
公开(公告)号：EP2505297A1
公开(公告)日：2012-10-03
申请号：EP12171477.8
申请日：2010-02-22
申请人： Corelase OY
发明人： Kangastupa, Jarno , Amberla, Tiina
IPC分类号： B23K26/36 , B23K26/40 , B23K26/06 , B28D5/00 , C03C23/00 , B23K26/00 , B23K26/24 , B23K26/32 , C03B23/24 , C03B33/08 , C03B33/02
CPC分类号： C03C23/0025 , B23K26/0624 , B23K26/244 , B23K26/32 , B23K2201/40 , B23K2203/50 , B28D5/0011 , C03B33/0222 , C03B33/082 , Y02P40/57
摘要： The invention relates to a method of processing substrates (28), such as glass and semiconductor wafers. The method comprises directing to the substrate (28) from a laser source (20) a plurality of sequential focused laser pulses (24) having a predetermined duration, pulsing frequency and focal spot diameter, the pulses being capable of locally melting the substrate (28), and moving the laser source (20) and the substrate (28) with respect to each other at a predetermined moving velocity so that a structurally modified zone (26) is formed to the substrate. The pulse duration is in the range of 20 - 100 ps, pulsing frequency at least 1 MHz and moving velocity adjusted such that the distance between successive pulses is less than 1/5 of the diameter of the focal spot. The invention is utilized for welding of material layers (28A,28B).
摘要翻译：本发明涉及一种处理基片（28）的方法：诸如玻璃和半导体晶片。该方法包括引导来自激光源（20）顺序聚焦的激光脉冲的多个（24）在基板（28）具有预定的持续时间，脉冲频率和焦点直径，脉冲能够局部地熔化所述基板（28 ），并以预定的移动速度所以没一个结构改性区（26）形成为在基板相对于激光源（20）和基片（28）移动到海誓山盟。脉冲持续时间是在20至100皮秒的范围内，脉冲频率至少为1兆赫和移动速度调整检查那样的连续脉冲之间的距离小于1/5焦斑的直径。该发明用于材料层（28A，28B）的焊接。

8. 发明公开

EP2359976A1 Method of processing an object with formation of three modified regions as starting point for cutting the object 有权
标题翻译：一种用于通过产生三个改性品种为切入点的属性的切削加工物体的方法
公开(公告)号：EP2359976A1
公开(公告)日：2011-08-24
申请号：EP10182664.2
申请日：2001-09-13
申请人： HAMAMATSU PHOTONICS K. K.
发明人： Fukuyo, Fumitsugu , Fukumitsu, Kenshi , Uchiyama, Naoki , Wakuda, Toshimitsu
IPC分类号： B23K26/00 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , B23K26/40 , B23K26/06 , B23K26/08 , B23K26/04 , B23K26/073
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam processing method capable of cutting a work (1) without producing a fusing and a cracking out of a predetermined cutting line (5) on the surface (3) of the work (1), wherein a pulse laser beam (L) is radiated on the predetermined cut line (5) on the surface (3) of the work (1) with a condensed point (P) aligned to the inside of the work (1), and a modified area is formed inside the work (1) along the predetermined determined cut line (5) by moving the condensed point (P) along the predetermined cut line (5), whereby the work (1) can be cut with a rather small force by cracking the work (1) along the predetermined cut line (5) starting from the modified area.
摘要翻译：能够切割的工件（1），而不会产生定影和表面（3）的工作的（1），worin脉冲激光束（L）上的裂化出预定的切割线（5）的的激光加工方法被照射的表面上的切割预定线（5）（3）的工作（1）用对准工作（1）的内部的冷凝点（P），并且经修改的区域的工作内部形成（ 1）沿着预定的确定性开采切割线（5）通过沿着切割预定线（5），由此所述工作（1）可具有相当小的力通过裂化的工作切割移动的冷凝点（P）（1）沿预定切割线（5）从所述经修改的区域开始。

9. 发明公开

EP2216276A3 Vorrichtung zur Bearbeitung und zur Positionierung eines Werkstücks sowie Verfahren zum Gebrauch einer solchen Vorrichtung 审中-公开
标题翻译：一种用于处理和定位工件和使用这种装置的方法设备
公开(公告)号：EP2216276A3
公开(公告)日：2011-06-29
申请号：EP10005381.8
申请日：2005-05-27
申请人： Oerlikon Solar IP AG, Trübbach
发明人： Grundmüller, Richard , Meier, Johannes , Büchel, Arthur
IPC分类号： B65G49/06 , C03B33/03 , C03B33/08 , C03B33/037 , C03B33/09 , G01P13/00 , C03B33/02
CPC分类号： B65G49/061 , B23K26/10 , B23K26/14 , B23K26/40 , B23K26/702 , B23K2203/52 , B28D5/0082 , B65G49/065 , B65G2249/04 , B65G2249/045 , C03B33/03 , C03B33/037 , C03B33/082 , C03B33/093 , Y10T83/0341 , Y10T83/2185 , Y10T83/2194 , Y10T83/476 , Y10T83/533 , Y10T225/12 , Y10T225/325 , Y10T225/371
摘要： Die vorliegende Erfindung betrifft eine Vorrichtung zum Behandeln eines Werkstücks, insbesondere eines im wesentlichen flachen Substrats, mit einem Tisch (2) zum Tragen des Werkstücks (5), wobei eine Strömungserzeugungseinrichtung (6, 11) in einem Bereich zwischen dem Werkstück (5) und der Oberseite des Tisches (2) eine Gasströmung (22) erzeugt, auf der das Werkstück (5) bei der Behandlung gelagert ist. Das Werkstück (5) ist mittels einer Vorschubeinrichtung in einer Längsrichtung bewegbar. Die Vorrichtung umfasst auf Bewegungsvorrichtungen montierte Lasereinheiten (3, 9) zur Bearbeitung des Werkstücks (5), insbesondere zum Abtragen von Material an Oberflächen desselben. Ein Detektor für am Werkstück (5) angebrachte Markierungen wird als Messvorrichtung zur Positionskontrolle eingesetzt.

10. 发明公开

EP2324948A1 Method of processing an object with formation of three modified regions as starting point for cutting the object 有权
标题翻译：一种用于通过产生三个改性品种为切入点的属性的切削加工物体的方法
公开(公告)号：EP2324948A1
公开(公告)日：2011-05-25
申请号：EP10182671.7
申请日：2001-09-13
申请人： HAMAMATSU PHOTONICS K. K.
发明人： Fukuyo, Fumitsugu , Fukumitsu, Kenshi , Uchiyama, Naoki , Wakuda, Toshimitsu
IPC分类号： B23K26/00 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , B23K26/40 , B23K26/06 , B23K26/08 , B23K26/04 , B23K26/073
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam process method and of cutting an object (1) without producing a fusing and a cracking out of a predetermined cutting line on the surface of the object (1), wherein a pulse laser beam (L) is radiated on the predetermined cut line (5) on the surface (3) of the object (1) under the conditions causing a multiple photon absorption and with a condensed point (P) aligned to the inside of the object (1), and a modified area (9) is formed inside the object (1) along the predetermined determined cut line (5) by moving the condensed point along the predetermined cut line (5), whereby the object (1) can be cut with a rather small force by cracking the object (1) along the predetermined cut line (5) starting from the modified area and, because the pulse laser beam (L) radiated is not almost absorbed onto the surface (3) of the object (1), the surface (3) is not fused even if the modified area is formed.
摘要翻译：和切割到对象（1），而不会产生定影和所述对象（1）的表面上的龟裂出预定的切割线，worin一个脉冲激光束（L）的激光束工艺方法被照射上切割预定线（5）使多光子吸收的条件下，并用对准对象（1）的内部的冷凝点（P）的对象（1）的表面（3）和经修改的区域（9）上通过沿着切割预定线（5），从而，所述物体（1）可具有相当小的力通过裂解物（切移动的冷凝点沿着预定确定性开采切割线（5）的对象（1）的内部，形成 1）沿着所述切割预定线（5）从所述经修改的区域开始并且，由于脉冲激光束（L）照射几乎不到该表面上吸收的（3）所述对象的（1），所述表面（3）是不融合即使修改后的区域形成。

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