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    • 3. 发明公开
    • TRÄGERFOLIE EINER PRÄGEFOLIE
    • 载体膜印记箔
    • EP1776244A1
    • 2007-04-25
    • EP04766166.5
    • 2004-07-08
    • Kronospan Technical Company Ltd.
    • DÖHRING, Dieter
    • B44B5/02B44B5/00C14B1/56E04F15/10
    • B44B5/0071B44B5/0052B44B5/026B44C1/1704B44C1/24C14B1/56E04F15/10Y10T428/31529
    • The invention relates to an embossing film, in addition to an associated carrier film for applying surface structures, in particular to fibreboard. The invention also relates to a press and to a production method that uses the embossing film. The advantages of the inventive embossing film are that its use during the pressing process is low-maintenance and obtains a particularly even surface structure. In an additional embodiment, the embossing film has one or more metallic additives, in particular aluminium additives. This improves the strength of the film, in particular during the pressing process and improves the thermal conductivity of the embossing film. The heat that occurs or is produced during the pressing process for curing the resins that are used can thus be dissipated more efficiently from the panel. In a further embodiment, the embossing film comprises an acrylate, which increases the mechanical stability of said film. The acrylate can be applied in the form of a dispersion to the carrier film or paper and is pressed into the film or paper in a roller pressing process. The high mechanical stability permits the film to undergo the embossing operation several times, thus reducing production costs. In addition, the thickness of the film can be reduced, without any detrimental effect on the required stability. Said reduction also increases the thermal conductivity of the film, again reducing production costs.
    • 10. 发明公开
    • Metal colloid particles, metal colloid and use of the colloid
    • Metallkolloidpartikel,Metallkolloid und Verwendung des Kolloids
    • EP2329902A1
    • 2011-06-08
    • EP11159706.8
    • 2005-06-22
    • Mitsubishi Materials CorporationJemco Inc.
    • Kiyoshima, ReikoHayashi, Toshiharu
    • B22F9/00B44C1/17C09C1/62C09D201/00C09D7/12C09D11/00H01B5/14B43K5/14B32B27/18
    • C09C1/62A61K8/02A61K8/19A61Q3/02B22F1/0022B22F7/06B44C1/1704B82Y30/00C01P2004/84C08K3/08C08K9/04C09D7/62C09D7/67C09D11/037C09D11/322Y10T428/2991
    • Metal colloidal particles are disclosed, which are capable of forming a metal colloid by dispersing in either or both of an aqueous dispersion medium and a nonaqueous dispersion medium in a range of 5 to 50 % by weight while mixing, comprising metal particles and a protective agent coordination-modified on the surface of the particles, wherein the particles constituting the metal colloidal particles are one or two or more metal particles made of a metal selected from the group consisting of A, Ag, Pt, Cu, Pd, Ni, Zn, Ru, Rh and Ir, and the protective agent having a carbon skeleton containing nitrogen in the molecule, and having a structure of being coordination-modified on the surface of the metal particles using nitrogen or an atomic group including nitrogen as an anchor, wherein the protective agent has one, or two or more functional groups selected from the group consisting of alkoxysilyl group, silanol group and hydroxyalkyl group in a molecular structure, and
      the metal particles contain an Au component as a main component contain one, or two or more metal components other than the Au component as an accessory component, and also satisfy at least obe selected from the following (A) to (E):
      (A) the accessory component constituting the metal particles contains at least an Ag component and a Cu component, and the content of the accessory component in the metal particles is from 5 to 40% by weight and the content of the Ag component in the accessory component is from 40 to 60% by weight,
      (B) the accessory component constituting the metal particles contains at least an Ag component and a Cu component, and
      the content of the accessory component in the metal particles is from 5 to 40% by weight and the content of Ag component in the accessory component is 65% by weight or more,
      (C) the accessory component constituting the metal particles contains at least an Ag component and a Cu component, and
      the content of the accessory component in the metal particles is from 5 to 40% by weight and the content of Ag component in the accessory component is 30% by weight or less,
      (D) the accessory component constituting the metal particles contains at least an Ag component, a Cu component, and a Pd component, and the content of the accessory component in the metal particles is from 5 to 40% by weight and the content of the Ag component in the accessory component is 30% by weight or less,
      (E) the accessory component constituting the metal particles contains at least a Pd component, and
      the content of the accessory component in the metal particles is from 5 to 40% by weight.
      Further, a metal colloid-containing coat formed article, a transfer sheet, a metal colloid-containing coat formed article comprising a transfer film transferred from the transfer sheet, a pen, a brush-pencil, a cartridge for pen and a disposable ampoule, each being filled with the metal colloid and a base material with a conductive film, having resistivity of 1 × 10 -3 Ω•cm or less wherein the metal colloidal particles are contained, a stamp pad and a seal impression pad wherein the metal colloidal particles are contained, a drawn material comprising said metal colloidal particles are disclosed.
    • 公开了能够通过在水分散介质和非水分散介质中的一种或两种中分散形成金属胶体的金属胶体颗粒,其中在混合的同时混合5至50重量%的范围,包括金属颗粒和保护剂 其中构成金属胶体颗粒的颗粒是由选自A,Ag,Pt,Cu,Pd,Ni,Zn等的金属制成的一种或两种以上的金属颗粒, Ru,Rh和Ir,以及在分子中具有含有氮的碳骨架的保护剂,并且使用氮或包含氮作为锚的原子团在金属颗粒的表面上具有配位改性的结构,其中, 保护剂在分子结构中具有一个或两个以上选自烷氧基甲硅烷基,硅烷醇基和羟烷基的官能团,金属颗粒c 作为主要成分的Au成分含有除Au成分以外的一种或两种以上的金属成分作为辅助成分,还至少满足从以下(A)〜(E)中选择的至少obe:(A)附件 构成金属粒子的成分至少含有Ag成分和Cu成分,金属粒子中的辅助成分的含量为5〜40重量%,辅助成分中Ag成分的含量为40〜 60重量%,(B)构成金属粒子的辅助成分至少含有Ag成分和Cu成分,金属粒子中的辅助成分的含量为5〜40重量%,Ag的含量 辅助部件中的成分为65重量%以上,(C)构成金属粒子的辅助成分至少含有Ag成分和Cu成分,金属粒子中的附属成分的含量为5〜 40重量%,辅助成分中Ag成分的含量为30重量%以下,(D)构成金属粒子的辅助成分至少含有Ag成分,Cu成分和Pd成分, 金属颗粒中的附属成分的含量为5〜40重量%,辅助成分中的Ag成分的含量为30重量%以下,(E)构成金属粒子的附属成分至少含有 Pd成分,金属粒子中的辅助成分的含量为5〜40重量%。 此外,含有金属胶体的涂层成型体,转印片,含金属胶体的涂膜成型体,其包含从转印片转印的转印膜,笔,笔铅笔,笔用笔和一次性安瓿, 每个都填充有金属胶体和具有导电膜的基底材料,其电阻率为1×10 -3 cm或更小,其中包含金属胶体颗粒,印模垫和密封压印垫,其中金属胶体 包含颗粒,公开了包含所述金属胶体颗粒的拉伸材料。