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    • 10. 发明公开
    • PRINTHEAD THERMAL COMPENSATION METHOD AND APPARATUS
    • VERFAHREN UND VORRICHTUNG ZUR THERMISCHEN KOMPENSATIONFÜREINEN DRUCKKOPF
    • EP1084039A4
    • 2001-10-04
    • EP99955245
    • 1999-05-28
    • LEXMARK INT INC
    • CORNELL ROBERT WILSON
    • B41J2/05B41J2/14B41J2/375
    • B41J2/04563B41J2/0458B41J2/1408B41J2/375B41J2002/14387B41J2202/20
    • The invention described in the specification relates to an apparatus and method for cooling a print head containing multiple semiconductor substrates. The substrates which contain a plurality of energy imparting devices (156) for energizing ink are attached to a metal substrate carrier for providing efficient heat transfer from the substrates. A temperature sensing device (140) is attached to the carrier for measuring a temperature of the substrate carrier during a printing operation and for generating an input signal to a controller (150). The controller, in turn, sends an output signal to the print head to selectively energize one or more of the energy imparting devices (156) on each substrate in response to the input signal and a thermal expansion value based on the temperature of the heat transfer member.
    • 本说明书中描述的本发明涉及用于冷却包含多个半导体衬底的打印头的设备和方法。 包含多个能量赋予装置用于激励墨水的基板被附接到金属基板载体上,以从基板提供有效的热传递。 温度感测装置附接到载体,用于在打印操作期间测量衬底载体的温度并且用于向控制器生成输入信号。 控制器又向打印头发送输出信号,以响应于输入信号和基于传热构件的温度的热膨胀值来选择性地激励每个基板上的一个或多个能量赋予装置。 由于响应于载体温度及其膨胀特性来控制能量赋予装置的通电的定时,因此可以使用用于载体的更具成本效益的材料。