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1. 发明公开

EP1301838A2 APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE IN A WAFER AND A DEVICE UNDER TEST USING INTEGRATED TEMPERATURE SENSITIVE DIODE 审中-公开
标题翻译：方法和设备，用于控制的半导体晶片和温度之一被测对象集成温度光敏二极管
公开(公告)号：EP1301838A2
公开(公告)日：2003-04-16
申请号：EP01950901.7
申请日：2001-07-06
申请人： Temptronic Corporation
发明人： OLSEN, Douglas, S. , STURA, David
IPC分类号： G05D23/00
CPC分类号： G05D23/20 , G01R31/2891 , G05D23/1934
摘要： An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit (23) senses a signal from the diode (204) indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system (24) used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control (241) the temperature of the DUT.

2. 发明授权

EP3891573B1 SYSTEM AND METHOD FOR CONTROLLING TEMPERATURE AT TEST SITES 有权
公开(公告)号：EP3891573B1
公开(公告)日：2023-07-12
申请号：EP19824110.1
申请日：2019-11-27
发明人： ELSDOERFER, Norbert , WENG, Chuan
IPC分类号： G05D23/19 , F24F11/81 , G01R31/28

3. 发明授权

EP3344882B1 APPARATUS FOR ATTACHMENT OF ACCESSORIES TO PROCESSING EQUIPMENT 有权
公开(公告)号：EP3344882B1
公开(公告)日：2019-08-28
申请号：EP16767074.4
申请日：2016-08-30
申请人： Temptronic Corporation
发明人： BUTCHER, Dana
IPC分类号： F16L37/10 , F16B21/06 , F16L37/086 , F16L37/22 , F16B21/16 , F16L37/05

4. 发明公开

EP2769164A2 TEMPERATURE SYSTEM HAVING AN IMPURITY FILTER 有权
标题翻译：与污染过滤器的温度SYSTEM
公开(公告)号：EP2769164A2
公开(公告)日：2014-08-27
申请号：EP12787215.8
申请日：2012-10-17
申请人： Temptronic Corporation
发明人： WARD, Britton, N. , ELSDOERFER, Norbert, W.
IPC分类号： F28F19/01 , F25B43/00 , H01L23/34 , F25B19/00
CPC分类号： F25B43/003 , F25B19/005 , F25D2400/02 , H01L23/467 , H01L23/473 , H01L2924/0002 , H05K7/20272 , H01L2924/00
摘要： A temperature control system for controlling a temperature of a device under test includes a fluid source and a cooling device reducing a temperature of the fluid supplied by the fluid source and outputting the fluid having the reduced temperature to a device under test. A filter is positioned between the device under test and the cooling device to filter out ice particles that lead to significant charge generation in order to prevent the device under test from being subjected to high voltages as a result of static charge generation.

5. 发明公开

EP3427071A1 SYSTEM AND METHOD FOR TEMPERATURE FORCING WITH CONDUCTIVE THERMAL PROBES 有权
公开(公告)号：EP3427071A1
公开(公告)日：2019-01-16
申请号：EP17709304.4
申请日：2017-02-24
申请人： Temptronic Corporation
发明人： ELSDOERFER, Norbert
IPC分类号： G01R1/04 , G01R31/28 , G05D23/19 , G05D23/22 , F28D15/00
CPC分类号： G01R31/2874 , F28D15/00 , F28F3/12 , F28F2200/00 , G01R1/067 , G05D23/192 , G05D23/22 , H01L23/473
摘要： A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat exchanger, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes contact with a device under test (DUT), heat is conducted to or from DUT.

6. 发明授权

EP2771668B1 ENVIRONMENTAL TEST SYSTEM AND METHOD WITH IN-SITU TEMPERATURE SENSING OF DEVICE UNDER TEST (DUT) 有权
公开(公告)号：EP2771668B1
公开(公告)日：2018-10-03
申请号：EP12790725.1
申请日：2012-10-26
申请人： Temptronic Corporation
发明人： PELRIN, James , ELSDOERFER, Norbert, W.
IPC分类号： G01N17/00
CPC分类号： G01N17/002
摘要： An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.

7. 发明公开

EP1692714A1 APPARATUS AND METHOD FOR REDUCING ELECTRICAL NOISE IN A THERMALLY CONTROLLED CHUCK 审中-公开
标题翻译： DEVICE AND METHOD FOR电噪声处于受控热卡盘还原
公开(公告)号：EP1692714A1
公开(公告)日：2006-08-23
申请号：EP04812337.6
申请日：2004-11-23
申请人： Temptronic Corporation
发明人： HUDSON, Douglas, E. , PERLIN, James , PATEL, Sanjiv , TEE, Chin, Chien , COLE, Kenneth, M., Sr.
IPC分类号： H01L21/00
CPC分类号： H01L21/67248
摘要： A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow are technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate. When the temperature of the chuck is being maintained at a set point temperature, the flow rate of the fluid can be reduced such that electrical noise introduced by the motion of the fluid, such as by the triboelectric effect, can be reduced. A capillary tube can be connected between the first fluid carrying path and the second fluid carrying path. First and second valves can be connected in the first and second fluid carrying paths to prevent the flow of fluid into the chuck when the chuck is at high temperature such that motion induced by boiling of the fluid is eliminated.

8. 发明公开

EP1356499A2 WAFER CHUCK WITH INTERLEAVED HEATING AND COOLING ELEMENTS 审中-公开
标题翻译：盘夹持器嵌套热和冷却元件
公开(公告)号：EP1356499A2
公开(公告)日：2003-10-29
申请号：EP01950961.1
申请日：2001-07-06
申请人： Temptronic Corporation
发明人： COLE, Kenneth, M., Sr. , STONE, William, M. , OLSEN, Douglas, S.
IPC分类号： H01L21/00
CPC分类号： H01L21/67109 , G01R31/2891 , H01L21/67103 , H01L21/68785
摘要： A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element (12) can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes (14) which are also disposed in a coiled configuration in a plane. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. In another aspect, the chuck of the invention provides for interchangeable top surface assemblies used to support the workpiece chuck. The thermal plate assembly includes mechanical mounting for the top surface assembly. The interchangeable nature of the top surface assemblies permits the user to use multiple top surfaces with a single thermal plate.

9. 发明公开

EP1312106A1 TEMPERATURE-CONTROLLED THERMAL PLATFORM FOR AUTOMATED TESTING 审中-公开
标题翻译：，抗热控制温度的持有人自动测试系统
公开(公告)号：EP1312106A1
公开(公告)日：2003-05-21
申请号：EP01984365.5
申请日：2001-07-18
申请人： Temptronic Corporation
发明人： STONE, William, M.
IPC分类号： H01L21/00
CPC分类号： H01L21/67103
摘要： A thermal platform and method for supporting a wafer or packaged integrated circuit (IC) under test are described. The platform includes a top surface assembly on which the wafer or IC can be mounted. A thermal plate is located under and in thermal communication with the top surface assembly. The thermal plate is made of a porous thermally conductive material. A temperature-controlled fluid such as air enters and propagates radially through the porous material of the thermal plate. The temperature of the wafer or IC is controlled by controlling the temperature of the air passing through the thermal plate. The plate can be made of a sintered metal such as copper or a reticulated foam or a carbon or graphite foam.

10. 发明授权

EP3427071B1 SYSTEM AND METHOD FOR TEMPERATURE FORCING WITH CONDUCTIVE THERMAL PROBES 有权
公开(公告)号：EP3427071B1
公开(公告)日：2020-04-08
申请号：EP17709304.4
申请日：2017-02-24
申请人： Temptronic Corporation
发明人： ELSDOERFER, Norbert
IPC分类号： H01L23/473 , G05D23/19 , G05D23/22 , F28F3/12

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