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1. 发明公开

EP3324429A4 SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP3324429A4
公开(公告)日：2018-06-20
申请号：EP15898324
申请日：2015-07-16
申请人： PEZY COMPUTING K K
发明人： SAITO MOTOAKI
IPC分类号： H01L21/822 , H01L25/065 , H01L25/18 , H01L27/04 , H04L12/933
CPC分类号： H01L21/822 , H01L25/065 , H01L25/18 , H01L27/04 , H04L49/109
摘要： A semiconductor device that has a plurality of layered semiconductor chips 11 and a control unit 12. Each of the semiconductor chips 11 has a plurality of signal processing units 17, 18 that can be connected to each other, a plurality of in-chip signal lines 14, 15 that can be connected to each other, a connection-state changing unit 13 that can change the connection state between the plurality of in-chip signal lines 14, 15 in accordance with instructions from the control unit 12, and a plurality of non-contact communication units 16 that are respectively connected to the plurality of in-chip signal lines 14, 15. Each of the non-contact communication units 16 of each of the semiconductor chips 11 can communicate in the layering direction in a non-contact manner with the non-contact communication units 16 of one or more of the other semiconductor chips 11. The connection state between the plurality of signal processing units 17, 18 is changed as a result of the connection-state changing unit 13 of each of the semiconductor chips 11 changing the connection state between the plurality of in-chip signal lines 14, 15 in accordance with instructions from the control unit 12.

2. 发明公开

EP3324428A4 SEMICONDUCTOR SWITCH DEVICE 审中-公开
公开(公告)号：EP3324428A4
公开(公告)日：2018-06-20
申请号：EP15898323
申请日：2015-07-16
申请人： PEZY COMPUTING K K
发明人： SAITO MOTOAKI
IPC分类号： H01L21/822 , H01L25/065 , H01L25/18 , H01L27/04 , H04L12/933
CPC分类号： H01L21/822 , H01L25/065 , H01L25/18 , H01L27/04 , H04L49/109
摘要： A semiconductor switch device includes a semiconductor switch main body unit 10 that has a plurality of layered semiconductor switch chips 11 and a control unit 12, a plurality of first terminals 20, and a plurality of second terminals 30. The connection state of each of the first terminals 20 and each of the second terminals 30 is changed by the semiconductor switch main body unit 10. Each of the semiconductor switch chips 11 has a plurality of in-chip signal lines 14, 15, a connection-state changing unit 13, and a plurality of non-contact communication units 16. Each of the non-contact communication units 16 can communicate in the layering direction in a non-contact manner with another non-contact communication units 16. The first terminals 20 and the second terminals 30 are respectively connected to the in-chip signal lines 14, 15 of the semiconductor switch chips 11. The connection state between the plurality of first terminals 20 and the plurality of second terminals 30 is changed as a result of the connection-state changing unit 13 of each of the semiconductor switch chips 11 changing the connection state between the plurality of in-chip signal lines 14, 15.

3. 发明公开

EP3261263A4 SIGNAL PROCESSING DEVICE 审中-公开
公开(公告)号：EP3261263A4
公开(公告)日：2018-03-14
申请号：EP15882620
申请日：2015-02-19
申请人： PEZY COMPUTING K K
发明人： SAITO MOTOAKI
IPC分类号： H04B5/02 , G06F13/38 , H01L23/522 , H01L23/538 , H01L25/065 , H04B5/00
CPC分类号： G06K7/10178 , G06F13/382 , H01L23/5227 , H01L23/538 , H01L25/0657 , H04B5/0031 , H04B5/0087 , H04B5/02
摘要： The purpose of the present invention is to provide a signal processing device that performs processing suitable for a signal processing device that transmits and receives signals without contact. A signal processing device is provided with a plurality of signal transmission/reception units (13A-13C), a plurality of signal processing units (11A-11C), and a signal distribution unit (12). The signal transmission/reception units (13A-13C) can transmit and receive signals, without contact, between signal processing device-side signal transmission/reception units (41A-43A). Reception signals (Sin1-Sin3) received by the signal transmission/reception units (13A-13C) are inputted to the signal distribution unit (12). Output signals (Sout1-Sout3) outputted by the signal processing units (11A-11C) are inputted to the signal distribution unit (12). The signal distribution unit (12) can output the reception signals (Sin1-Sin3) to the signal processing units (11A-11C), and can output the output signals (Sout1-Sout3) to the signal transmission/reception units (13A-13C) .

4. 发明公开

EP3279938A4 SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP3279938A4
公开(公告)日：2018-04-11
申请号：EP15887540
申请日：2015-03-30
申请人： PEZY COMPUTING K K
发明人： SAITO MOTOAKI
IPC分类号： H01L23/522 , H01L21/822 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/04 , H04B5/02
CPC分类号： H01L23/645 , H01F5/003 , H01F38/14 , H01L21/822 , H01L23/147 , H01L23/49816 , H01L23/49838 , H01L23/5227 , H01L23/5381 , H01L23/5385 , H01L24/16 , H01L25/065 , H01L25/0655 , H01L25/07 , H01L25/18 , H01L27/04 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H04B5/02
摘要： A semiconductor device equipped with a base board 10, a first element 20, a second element 30, and an interposer board 40, wherein: the first element 20 is positioned on the base board 10; a signal transmitting/receiving terminal 24 of the first element and a plurality of base board terminals 13 contact one another and are capable of transmitting and receiving a signal; the second element 30 is positioned on the base board 10; a signal transmitting/receiving terminal 34 of the second element and the plurality of base board terminals 13 contact one another and are capable of transmitting and receiving a signal; the interposer board 40 is positioned so as to extend on the first element 20 and the second element 30; a first contactless signal transmitting/receiving unit 43 of the interposer board is capable of contactlessly transmitting and receiving a signal to and from a contactless signal transmitting/receiving unit 25 of the first element via a first element board; and a second contactless signal transmitting/receiving unit 44 of the interposer board is capable of contactlessly transmitting and receiving a signal to and from a contactless signal transmitting/receiving unit 35 of the second element via a second element board 31.

5. 发明公开

EP3261264A4 SIGNAL BRIDGE DEVICE 有权
公开(公告)号：EP3261264A4
公开(公告)日：2018-03-21
申请号：EP15882621
申请日：2015-02-19
申请人： PEZY COMPUTING K K
发明人： SAITO MOTOAKI
IPC分类号： H04B5/02
CPC分类号： H04B5/02
摘要： The purpose of the present invention is to provide a signal bridge device that allows signals to be transmitted and received between a signal processing device that can transmit and receive signals without contact and a signal processing device that cannot transmit and receive signals without contact. A signal bridge device is provided with a plurality of bridge signal transmission/reception units (33A-33C), a plurality of bridge signal transmission/reception terminals (31A-31C), and a bridge signal distribution unit (32). Non-contact reception signals (U1-U3) received by the bridge signal transmission/reception units (33A-33C) are input into the bridge signal distribution unit (32). Contact reception signals (T1-T3) received by the bridge signal transmission/reception terminals (31A-31C) are input into the bridge signal distribution unit (32). The bridge signal distribution unit (32) can output the non-contact reception signals (U1-U3) to the bridge signal transmission/reception terminals (31A-31C) and can output the contact reception signals (T1-T3) to the bridge signal transmission/reception units (33A-33C).

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