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1. 发明授权

EP3550310B1 CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICE 有权转让
公开(公告)号：EP3550310B1
公开(公告)日：2021-10-20
申请号：EP17875451.1
申请日：2017-11-28
发明人： OTA Norihiro
IPC分类号： G01R1/067

2. 发明授权

EP3425745B1 CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION APPARATUS 有权
公开(公告)号：EP3425745B1
公开(公告)日：2020-03-04
申请号：EP18181358.5
申请日：2018-07-03
申请人： Nidec-Read Corporation
发明人： OTA, Norihiro
IPC分类号： H01R13/24

3. 发明公开

EP3550310A1 CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICE 有权转让
公开(公告)号：EP3550310A1
公开(公告)日：2019-10-09
申请号：EP17875451.1
申请日：2017-11-28
申请人： Nidec-Read Corporation
发明人： OTA Norihiro
IPC分类号： G01R1/067 , G01R1/073 , G01R31/26
摘要： A contact terminal defined by a probe Pr includes a tubular body Pa which is made of an electrically conductive material and is tubular and central conductors Pb and Pc each of which is made of an electrically conductive material and is a shape of a stick. The central conductors Pb and Pc include stick-shaped bodies Pb1 and Pc1 inserted into the tubular body Pa. The tubular body Pa includes spring portions Pe1 and Pe2 which are defined by helical bodies configured such that helical grooves Pg1 and Pg2 are formed along a circumference thereof and clasping portions Pd1 and Pd2 which are fitted onto proximal end portions of the stick-shaped bodies Pb1 and Pc1 to fit the proximal end portions. The clasping portions Pd1 and Pd2 are defined by a circumferential wall of the tubular body Pa by a slit Ph1 extending from end portions of the helical grooves Pg1 and Pg2 which define the spring portions Pe1 and Pe2 in an axial direction of the tubular body Pa at which portions are separated in a circumferential direction of the tubular body Pa.

4. 发明授权

EP2811304B1 Circuit board inspection method, circuit board inspection apparatus and circuit board inspection tool 有权
标题翻译： PCB测试方法，电路板检查和Leiterplattenprüfwerkzeug
公开(公告)号：EP2811304B1
公开(公告)日：2016-07-27
申请号：EP14170256.3
申请日：2014-05-28
申请人： Nidec-Read Corporation
发明人： Matsuoka, Shinji
IPC分类号： G01R1/067 , G01R31/28
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2808 , G01R31/2812

5. 发明公开

EP2535726A4 MANUFACTURING METHOD FOR CONTACT FOR CURRENT INSPECTION JIG, CONTACT FOR CURRENT INSPECTION JIG MANUFACTURED USING SAID METHOD, AND CURRENT INSPECTION JIG PROVIDED WITH SAID CONTACT 有权转让
标题翻译： FOR请联系电流测试装置的方法，请联系使用这种方法产生的电流测试装置及电流测试仪与所述联系
公开(公告)号：EP2535726A4
公开(公告)日：2015-12-30
申请号：EP11742118
申请日：2011-01-27
申请人： NIDEC READ CORP
发明人： KOJIMA KESAO , ICHIKAWA YUTAKA
IPC分类号： G01R1/067 , C23F1/02 , C25D1/02
CPC分类号： C25D1/02 , C25D1/04 , C25D3/12 , C25D3/48 , C25D5/12 , G01R1/06722 , G01R1/06738 , G01R3/00 , Y10T29/49213 , Y10T29/49224
摘要： Disclosed is a manufacturing method which enables more accurate and precise manufacturing of an ultra-fine, thin contact for current inspection jigs which is provided with a spring structure. After a gold or gold alloy plating layer is formed by plating the outer periphery of a core material, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer.

6. 发明授权

EP0826969B1 Substrate inspection apparatus and method therefore 失效
标题翻译：因此基板检查设备和方法
公开(公告)号：EP0826969B1
公开(公告)日：2002-11-20
申请号：EP97115019.8
申请日：1997-08-29
申请人： Nidec-Read Corporation
发明人： Nishikawa, Hideo
IPC分类号： G01R1/073
CPC分类号： G01R31/2887 , G01R1/07328

7. 发明公开

EP1233275A2 Circuit board testing apparatus and method 有权
标题翻译： Vorrichtung und Verfahren zumPrüfenvon Leiterplatten
公开(公告)号：EP1233275A2
公开(公告)日：2002-08-21
申请号：EP02003210.8
申请日：2002-02-19
申请人： Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation)
发明人： Tsuji, Yoshio, Nihon Densan Read Kabushiki Kaisha , Yamada, Masayoshi
IPC分类号： G01R31/28
CPC分类号： G01R31/2805 , G01R31/309
摘要： A circuit board testing apparatus for testing continuity and/or short-circuit of wirings formed on a circuit board, includes an electromagnetic wave irradiator which irradiates first terminals of the wirings with an electromagnetic wave so that electrons are discharged from the first terminals by photoelectric effect. Discharged electrons are trapped by an electrode which is electrically biased to have a higher potential than that of the second terminals of the wirings, thereby causing an electric current to flow through the wirings via the electrode. Existence of open-circuit and/or short-circuit of the wirings is judged based on the current flowing the wirings.
摘要翻译：用于测试形成在电路板上的布线的连续性和/或短路的电路板测试装置包括电磁波照射器，其利用电磁波照射布线的第一端子，使得电子通过光电效应从第一端子排出。放电的电子被被电偏压以具有比布线的第二端的电位更高的电位的电极捕获，从而使电流通过电极流过布线。基于流动布线的电流来判断布线的开路和/或短路的存在。

8. 发明公开

EP1055930A2 Printed circuit board testing apparatus and probe device for use in the same 审中-公开
标题翻译：一种用于测试印刷电路板和探针的使用在这种设备中
公开(公告)号：EP1055930A2
公开(公告)日：2000-11-29
申请号：EP00110969.3
申请日：2000-05-26
申请人： Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation)
发明人： Nishikawa, Hideo, Nihon Densan Read K.K.
IPC分类号： G01R1/067
CPC分类号： G01R1/0675 , G01R1/06705 , G01R1/06738
摘要： A probe device is mounted on a circuit provided with a holder mountable to a circuit board testing apparatus, a contact needle attachable to the holder. The contact needle is operable to resiliently bend in a specified direction immediately after coming into contact with a circuit board. The bending absorbs a contact impact to ensure accurate measurement.

9. 发明公开

EP0919820A2 Circuit board testing apparatus and method 审中-公开
标题翻译： Vorrichtung und Verfahren zurPrüfungvon Leiterplatten
公开(公告)号：EP0919820A2
公开(公告)日：1999-06-02
申请号：EP98120161.9
申请日：1998-10-28
申请人： Nidec-Read Corporation
发明人： Yamashita, Munehiro , Kaida, Mitio
IPC分类号： G01R31/28
CPC分类号： G01R31/312 , G01R1/07385 , G01R31/2805 , G01R31/304
摘要： To conduct a continuity test in a short period of time using a moving head type testing apparatus a probe is made to contact one end of the test wiring of a circuit board (32), with a head (52) electrostatically coupled to the other end of the wiring, a pulse-like DC voltage is suplied from a signal source (46). Simultaneously with a switch section (SWp) turning on, the maximum voltage is applied to the test wiring. If a detection signal is below a specified value a computer (44) will determine this as "openning" or "shorting". Further, a tip (52a) of the head (52) may touch the circuit board (32) through an insulating sheet (33), so that the tip (52a) is kept away from each pad of a pad section (38) in the circuit board (32) at a fixed distance equivalent to the thickness of the insulating sheet (33). Thus a continuity test may be performed in a non-contact manner by moving the head (52) only along the X and Y directions without additional movement along the Z-direction.
摘要翻译：为了使用移动头式测试装置在短时间内进行连续性测试，使得探针与电路板（32）的测试布线的一端接触，其中静电耦合到另一端的头部（52）的布线，从信号源（46）中可以看到脉冲状的直流电压。同时开关部分（SWp）接通，最大电压被施加到测试接线。如果检测信号低于指定值，则计算机（44）将确定为“开启”或“短路”。此外，头部（52）的尖端（52a）可以通过绝缘片（33）接触电路板（32），使得尖端（52a）远离焊盘部分（38）的每个焊盘电路板（32）的距离等于绝缘片（33）的厚度。因此，可以以非接触的方式通过仅沿着X和Y方向移动头部（52）而不沿着Z方向的附加移动来执行连续性测试。

10. 发明公开

EP0862062A2 Circuit board inspection apparatus and method 失效
标题翻译：电路板检查装置和方法
公开(公告)号：EP0862062A2
公开(公告)日：1998-09-02
申请号：EP98103455.6
申请日：1998-02-27
申请人： Nidec-Read Corporation
发明人： Takahashi, Tadashi
IPC分类号： G01R31/312 , G01R31/28
CPC分类号： H05K1/0268 , G01R31/312
摘要： The present invention provides an inexpensive and reliable circuit board inspection apparatus and method that is applicable to a densely wired circuit board. [Solution] A sensor module 50 is disposed on a pad section 38 on an inspected circuit board. The sensor module 50 is formed by integrating four sensor units 52, 54, 56 and 58 together. Each sensor unit is capacitively coupled to a plurality of corresponding pads so that a signal can be independently obtained from each sensor unit. By selecting a pad 36b of a pad section 36 and a sensor unit 54 and providing a predetermined signal between them to inspect the continuity, it can be determined whether a printed pattern 34x is open-circuited between a pad 38b and a pad 38x. This invention enables the continuity of complicated or irregular printed patterns to be inspected accurately and inexpensively.
摘要翻译：本发明提供一种适用于密集布线的电路板的廉价且可靠的电路板检查设备和方法。 [解决方案]传感器模块50设置在被检查电路板上的焊盘部分38上。传感器模块50通过将四个传感器单元52,54,56和58集成在一起而形成。每个传感器单元电容耦合到多个相应的焊盘，使得可以从每个传感器单元独立地获得信号。通过选择焊盘部分36和传感器单元54的焊盘36b并在它们之间提供预定信号以检查连续性，可以确定印刷图案34x是否在焊盘38b和焊盘38x之间开路。本发明能够精确且便宜地检查复杂或不规则印刷图案的连续性。

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