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1. 发明授权

EP3085549B2 THERMAL TRANSFER IMAGE-RECEIVING SHEET 有权
公开(公告)号：EP3085549B2
公开(公告)日：2024-10-16
申请号：EP14872625.0
申请日：2014-12-09
IPC分类号： B32B27/08 , B32B27/18 , B32B27/32 , B41M5/41 , B41M5/42 , B41M5/44
CPC分类号： B32B27/18 , B32B27/32 , B41M5/41 , B41M5/42 , B41M2205/3220130101 , B41M2205/3820130101 , B32B27/08 , B32B2307/2120130101 , B32B2307/51820130101 , Y10T428/31909 , Y10T428/31913 , Y10T428/25 , B41M5/44 , B41M2205/0220130101 , B41M2205/3620130101

2. 发明授权

EP3439024B1 ADHESIVE FILM FOR PROCESSING SEMICONDUCTOR WAFER 有权
公开(公告)号：EP3439024B1
公开(公告)日：2024-04-24
申请号：EP17774499.2
申请日：2017-03-21
IPC分类号： H01L21/304 , H01L21/683 , C09J7/29 , C09J7/30
CPC分类号： H01L21/304 , H01L21/683 , C09J7/30 , C09J2433/0020130101 , C09J2203/32620130101 , C09J7/29 , C09J2301/31220200801

3. 发明授权

EP3316280B1 USE OF A FILM FOR MANUFACTURING SEMICONDUCTOR PARTS 有权
公开(公告)号：EP3316280B1
公开(公告)日：2024-02-28
申请号：EP16817719.4
申请日：2016-06-14
发明人： HAYASHISHITA, Eiji
IPC分类号： H01L21/301 , C09J7/25 , C09J7/00

4. 发明授权

EP3572478B1 USE OF ADHESIVE FILM AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS 有权
公开(公告)号：EP3572478B1
公开(公告)日：2024-01-10
申请号：EP18741559.1
申请日：2018-01-17
发明人： IGARASHI, Kouji , KINOSHITA, Jin , KURIHARA, Hiroyoshi
IPC分类号： C09J7/20 , C09J11/06 , C09J133/00 , H01L21/56 , C09J7/30 , C08K5/11 , C08K5/12 , C08K5/00 , H01L23/31 , C09J133/06

5. 发明公开

EP3657532A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP3657532A1
公开(公告)日：2020-05-27
申请号：EP18835150.6
申请日：2018-07-09
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： UNEZAKI Takashi , KAMADA Jun , MORIMOTO Akimitsu , KINOSHITA Jin
IPC分类号： H01L21/301 , H01L23/00 , H05K9/00
摘要： Provided is a method of producing an electronic device, including a step (A) of preparing a structure (60) which includes an electronic component (10) having a circuit forming surface (10A), and an adhesive laminated film (50) which includes a base material layer (20), an unevenness-absorptive resin layer (30), and an adhesive resin layer (40) in this order and in which the adhesive resin layer (40) is attached to the circuit forming surface (10A) of the electronic component (10) such that the circuit forming surface (10A) is protected; and a step (B) of forming an electromagnetic wave-shielding layer (70) on the electronic component (10) in a state of being attached to the adhesive laminated film (50).

6. 发明公开

EP3546540A1 ADHESIVE LAMINATED FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP3546540A1
公开(公告)日：2019-10-02
申请号：EP17873047.9
申请日：2017-11-16
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA, Eiji
IPC分类号： C09J7/20 , C09J133/06 , B32B27/00 , H01L21/301
摘要： An adhesive laminate film (50) of the present invention has a heat-resistant resin layer (10), a flexible resin layer (20), and an adhesive resin layer (30) in this order, a peel strength P 0 between the heat-resistant resin layer (10) and the flexible resin layer (20), which is based on JIS Z0237 and measured using a method described below, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P 1 between the heat-resistant resin layer (10) and the flexible resin layer (20) after a thermal treatment of the adhesive laminate film (50) at 160°C for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm,
(method for measuring peel strength) the adhesive laminate film (50) is attached to a silicon wafer so that the adhesive resin layer (30) comes into contact with the silicon wafer. Next, the heat-resistant resin layer (10) is peeled off from the flexible resin layer (20) using a tensile tester in a 180-degree direction under conditions of 25°C and a tensile rate of 300 mm/minute, a strength (N/25 mm) at this time is measured twice, and an average value is regarded as the peel strength.

7. 发明公开

EP3533850A1 ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE 审中-公开
公开(公告)号：EP3533850A1
公开(公告)日：2019-09-04
申请号：EP17863464.8
申请日：2017-10-24
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： C09J7/20 , G01R31/26 , H01L21/301 , H01L21/66
摘要： A method for manufacturing electronic apparatus of the present invention includes: a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to an adhesive surface of the adhesive film (50); a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from the adhesive film (50) after the step (C). In addition, at least in the step (C), the structure (100) is disposed within a frame (150), an end portion (55) of the adhesive film (50) is fixed to the frame (150), and an upper surface (155) of the frame (150) is disposed below an upper surface (88) of the electronic component installation region (85) of the sample stand (80) in a perpendicular direction X of the sample stand (80).

8. 发明公开

EP3333220A1 PHOTO-CROSSLINKABLE ETHYLENE-BASED RESIN COMPOSITION 审中-公开
公开(公告)号：EP3333220A1
公开(公告)日：2018-06-13
申请号：EP16835044.5
申请日：2016-08-03
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： MUROFUSHI Takanobu , TOKUHIRO Jun , IKENAGA Shigenobu
IPC分类号： C08L23/04 , B32B27/32
CPC分类号： C08L23/08 , B32B15/085 , B32B27/08 , B32B27/32 , B32B2323/04 , C08J5/18 , C08J2323/08 , C08L23/04 , C08L23/0853 , C08L2312/00
摘要： A photo-crosslinkable ethylene-based resin composition of the present invention includes an ethylene-based copolymer having a Shore A hardness measured in accordance with ASTM D2240 of equal to or more than 55 and equal to or less than 95, a photo-crosslinking initiator, and a crosslinking aid, in which the content of the crosslinking aid is equal to or more than 0.1 parts by mass and less than 2.0 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.

9. 发明公开

EP3202568A4 LAMINATE FILM, OUTER PACKAGING BAG FOR TRANSFUSION BAG, AND TRANSFUSION BAG PACKAGING BODY 审中-公开
公开(公告)号：EP3202568A4
公开(公告)日：2018-05-23
申请号：EP15846393
申请日：2015-09-29
申请人： MITSUI CHEMICALS TOHCELLO INC
发明人： MATOBA DAISUKE , KIDOKORO MASAKO , NOMOTO AKIRA , SHIMAKAGE AIKO
IPC分类号： C08J7/04 , A61J1/10 , B65D65/40 , B65D77/04 , C08J7/06
CPC分类号： B65D65/40 , A61J1/00 , A61J1/10 , B32B9/005 , B32B27/06 , B32B2439/80 , B65D77/04 , C08J7/045 , C08J7/06 , C08J2323/08 , C08J2367/02 , C08J2427/08 , C08J2429/04 , C08J2433/02 , C08J2475/04
摘要： A laminate film (100) of the present invention includes a substrate layer (101) ; and a metal oxide layer (103) which is provided on one surface or both surfaces of the substrate layer (101) and contains a metal oxide. Further, the oxygen permeability measured under conditions of a temperature of 20°C and a humidity of 90% RH in conformity with JIS K 7126-2:2006 is 20 ml/m 2 ·day·MPa or less and the water vapor permeability measured under conditions of a temperature of 40°C and a humidity of 90% RH is 2.5 g/m 2 day or greater. In addition, when the K± beam intensity of a metal constituting the metal oxide which is obtained by performing fluorescence X-ray analysis on the metal oxide layer (103) is set to A and the K± beam intensity of the metal which is obtained by performing fluorescence X-ray analysis on a metal layer formed of the metal constituting the metal oxide is set to B, A/B is equal to or greater than 0.20 and equal to or less than 0.97.

10. 发明授权

EP2833415B1 SOLAR CELL SEALING MATERIAL AND SOLAR CELL MODULE 有权转让
标题翻译：太阳能电池密封材料和太阳能电池模块
公开(公告)号：EP2833415B1
公开(公告)日：2018-05-02
申请号：EP13767543.5
申请日：2013-03-13
申请人： Mitsui Chemicals, Inc. , Mitsui Chemicals Tohcello, Inc.
发明人： IKENAGA, Shigenobu , TAKEUCHI, Fumito , ITO, Tomoaki
IPC分类号： H01L31/048 , C08L23/08
CPC分类号： H01L31/0203 , C08F210/16 , C08L23/0807 , C08L23/16 , C08L2203/204 , C08L2203/206 , H01L31/0481 , Y02E10/50
摘要： An encapsulating material for solar cell of the invention contains an ethylene/±-olefin copolymer, and a content of a fluorine element in the ethylene/±-olefin copolymer, which is determined using a combustion method and an ion chromatograph method, is equal to or less than 30 ppm.

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