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1. 发明公开

EP3950226A1 METHOD FOR PRODUCING ELECTRONIC DEVICE AND ADHESIVE FILM 审中-公开
公开(公告)号：EP3950226A1
公开(公告)日：2022-02-09
申请号：EP20781959.0
申请日：2020-03-18
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： B24B27/06 , H01L21/301
摘要： A method for manufacturing an electronic device includes a step (A) of preparing a structure (100) provided with an electronic component (70) and an adhesive film (50) attached to the electronic component (70), and a step (B) of dicing the electronic component (70) with a dicing blade in a state of being attached to the adhesive film (50), in which the adhesive film (50) is provided with a base material layer (10), an intermediate layer (20), and an adhesive resin layer (30) in this order, and when a thickness of the base material layer (10) is X 1 and a thickness of the intermediate layer (20) is X 2 , a relationship of X 2 > X 1 is satisfied.

2. 发明公开

EP3533850A1 ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE 审中-公开
公开(公告)号：EP3533850A1
公开(公告)日：2019-09-04
申请号：EP17863464.8
申请日：2017-10-24
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： C09J7/20 , G01R31/26 , H01L21/301 , H01L21/66
摘要： A method for manufacturing electronic apparatus of the present invention includes: a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to an adhesive surface of the adhesive film (50); a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from the adhesive film (50) after the step (C). In addition, at least in the step (C), the structure (100) is disposed within a frame (150), an end portion (55) of the adhesive film (50) is fixed to the frame (150), and an upper surface (155) of the frame (150) is disposed below an upper surface (88) of the electronic component installation region (85) of the sample stand (80) in a perpendicular direction X of the sample stand (80).

3. 发明公开

EP3309822A1 ELECTRONIC-DEVICE-PROTECTING FILM, ELECTRONIC-DEVICE-PROTECTING MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PACKAGE 审中-公开
标题翻译：电子器件保护膜，电子器件保护部件，制造电子器件的方法以及制造封装的方法
公开(公告)号：EP3309822A1
公开(公告)日：2018-04-18
申请号：EP16807525.7
申请日：2016-06-08
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： H01L21/56 , B32B27/00 , C09J7/02 , C09J201/00
CPC分类号： H01L21/56 , B32B27/04 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/308 , B32B27/36 , B32B2307/306 , B32B2307/54 , B32B2405/00 , B32B2457/14 , C09J7/20 , C09J201/00 , H01L23/3107
摘要： The present invention provides: an electronic-device-protecting film used when semiconductor parts obtained by segmentation are to be sealed in the form of an array using a sealant after the semiconductor parts are rearranged, wherein the curing temperature of the sealant does not need to be adjusted downward; an electronic-device-protecting member; a method for manufacturing an electronic device; and a method for manufacturing a package. Specifically, provided is an electronic-device-protecting film 1 including a base layer 11 and an adhesive layer 12, which is used in a method including: bonding the adhesive layer 12 of the electronic-device-protecting film 1 to one surface 7a of a frame 7 having an opening 71, the adhesive layer 12 being bonded so as to cover the opening 71 of the frame 7; subsequently bonding a plurality of semiconductor parts to the surface 12a of the adhesive layer 12 that is exposed via the opening 71 with the semiconductor parts set apart from each other; subsequently covering the semiconductor parts and the surface 12a of the adhesive layer 12 with a sealant; and heat-curing the sealant to obtain an electronic device in which the semiconductor parts are sealed in an array configuration, wherein the ratio R E of the tensile elastic modulus of the base layer 11 at 160°C to the tensile elastic modulus of the base layer 11 at 50°C is such that 0.05 E
摘要翻译：本发明提供：在半导体部件重新排列之后使用密封剂以阵列形式密封通过分割获得的半导体部件时使用的电子器件保护膜，其中密封剂的固化温度不需要向下调整; 电子设备保护部件; 一种用于制造电子器件的方法; 以及用于制造包装的方法。具体而言，提供包括基底层11和粘合剂层12的电子器件保护膜1，其用于包括以下步骤的方法：将电子器件保护膜1的粘合剂层12粘合到具有开口71的框架7，粘合剂层12粘合以覆盖框架7的开口71; 随后将多个半导体部件结合到通过开口71暴露的粘合剂层12的表面12a上，其中半导体部件彼此分离; 随后用密封剂覆盖半导体部件和粘合层12的表面12a; 并热固化密封剂以获得其中半导体部件以阵列构造密封的电子器件，其中基底层11在160℃下的拉伸弹性模量与基底层的拉伸弹性模量之比RE 11在50℃是0.05

4. 发明公开

EP3439021A1 FILM FOR COMPONENT MANUFACTURE AND COMPONENT MANUFACTURING METHOD 审中-公开
公开(公告)号：EP3439021A1
公开(公告)日：2019-02-06
申请号：EP17774291.3
申请日：2017-03-14
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00 , H01L21/683
摘要： Provided are a film for manufacturing semiconductor component and a film for electronic component manufacture which can be easily removed from the table surface after stopping suction even when used in an environment accompanied by a change in temperature, and can stabilize the close contact state with the table surface. Furthermore, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture are provided. The present film 1 for component manufacture is a film used for a method for manufacturing a semiconductor component or an electronic component, and comprises a base layer 11 and an adhesive layer 12 provided on one surface 11a side of the base layer 11, and the Ra (µm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (µm) is 1.0 to 15. The present method uses the film 1 for component manufacture, and includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

5. 发明公开

EP3533852A1 ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE 审中-公开
公开(公告)号：EP3533852A1
公开(公告)日：2019-09-04
申请号：EP17866122.9
申请日：2017-10-24
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： C09J7/20
摘要： A method for manufacturing electronic apparatus includes : a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to an adhesive surface of the adhesive film (50) ; a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from the adhesive film (50) after the step (C). In addition, the sample stand (80) is provided with a first vacuum suction unit (210) in a region (89) on an outer peripheral side which is different from the electronic component installation region (85), the first vacuum suction unit (210) vacuum-sucking the adhesive film (50), and at least in the step (C), the first vacuum suction unit (210) vacuum-sucks a region (58) of the adhesive film (50) to which no electronic component (70) is affixed.

6. 发明公开

EP3439023A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
公开(公告)号：EP3439023A1
公开(公告)日：2019-02-06
申请号：EP17774987.6
申请日：2017-03-27
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： H01L21/301 , B32B27/00 , H01L21/67 , H01L21/683
摘要： A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).

7. 发明公开

EP3316280A1 FILM FOR MANUFACTURING SEMICONDUCTOR PARTS 有权
标题翻译：用于制造半导体部件的电影
公开(公告)号：EP3316280A1
公开(公告)日：2018-05-02
申请号：EP16817719.4
申请日：2016-06-14
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA Eiji
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00
CPC分类号： C09J7/255 , C09J7/20 , C09J7/25 , C09J7/30 , C09J133/08 , C09J133/12 , C09J201/00 , C09J2203/326 , C09J2205/302 , C09J2433/00 , C09J2467/006 , C09J2477/006 , H01L21/6836 , H01L21/78
摘要： The present invention provides a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. That is, a film 1 for manufacturing a semiconductor part includes a base layer 11, and an adhesive layer 12 disposed on one surface side of the base layer 11, wherein the ratio R E (= E'(160)/E'(-40)) of the elastic modulus of E'(160) of the base layer 11 at 160°C to the elastic modulus of E'(-40) of the base layer 11 at -40°C is such that R E ≥ 0.01, and the elastic modulus E'(-40) is 10 MPa or more and less than 1000 MPa. The present method includes a step of bonding the adhesive layer 12 to a back surface of the semiconductor wafer having circuits formed thereon, a step of separating the semiconductor wafer into segments to obtain semiconductor parts, and a pickup step of separating the semiconductor parts from the adhesive layer 12, and includes a step of evaluating the semiconductor wafer or the semiconductor parts prior to the pickup step.
摘要翻译：本发明提供一种用于制造半导体部件的膜，其中可以共同执行伴随着温度变化的评估步骤，分段步骤和拾取步骤，用于制造半导体部件的方法，半导体部件以及评估方法。即，用于制造半导体部件的膜1包括基底层11和设置在基底层11的一个表面侧上的粘合剂层12，其中比率RE（= E'（160）/ E'（ - 40 ））为160℃时的基材层11的E'（160）的弹性模量与-40℃下的基材层11的E'（ - 40）的弹性模量的关系，RE≥0.01，弹性模量E'（ - 40）为10MPa以上且小于1000MPa。本方法包括以下步骤：将粘合剂层12粘合到其上形成有电路的半导体晶片的背面;将半导体晶片分割成段以获得半导体部件的步骤;以及拾取步骤，将半导体部件从并且包括在拾取步骤之前评估半导体晶片或半导体部件的步骤。

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