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    • 1. 发明公开
    • A STRUCTURE OF HEAT DISSIPATION SUBSTRATE FOR POWER LED AND A DEVICE MANUFACTURED BY IT
    • STRUKTUR EINESWÄRMEABLEITSUBSTRATSFÜRLEISTUNGS-LED UND DAMIT HERGESTELLTE VORRICHTUNG
    • EP2202809A1
    • 2010-06-30
    • EP08841900.7
    • 2008-10-15
    • Foshan Nationstar Optoelectronics Co., Ltd
    • YU, BinhaiLI, JunzhengXIA, Xunli
    • H01L33/00
    • H01L33/642H01L33/483H01L2224/48091H01L2924/00014
    • The invention discloses a structure of heat dissipation substrate of power LED and a device made thereof. The invention overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate of the invention comprises: an one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate comprises: a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device.
    • 本发明公开了一种功率LED散热基板的结构及其制造装置。 本发明克服了功率LED复杂结构,制造工艺严格,生产效率低,生产成本高,产品质量不可靠等缺点。 本发明的散热基板的结构包括:一体式电路板,其上具有沉孔和金属线,其中沉孔由通孔和彼此连通的盲孔形成,通孔小于 盲孔,两者共轴方向相同; 散热器具有由上部露台和下部露台形成的一体式梯形结构; 散热器与沉孔匹配形成牢固的配合; 可以在电路板上布置多个沉孔; 电路板还可以包括用于切割的多个位置线和多个槽和/或孔。 使用散热基板制造的电力LED装置包括:散热器,具有沉孔的电路板,LED芯片,接合线和封装胶体。 封装胶体覆盖承载芯片和引线的电路板的一侧,外部电极部分保持在外部。 封装胶体不仅用作密封芯片和接合线的密封层,而且还作为与该器件集成的光学透镜。