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1. 发明授权

EP2515352B1 A MANUFACTURE METHOD FOR A SURFACE MOUNTED POWER LED SUPPORT 有权
公开(公告)号：EP2515352B1
公开(公告)日：2018-12-05
申请号：EP10852393.7
申请日：2010-08-25
申请人： Foshan Nationstar Optoelectronics Co., Ltd , Zhu Hai Bontech Electronic Technology Co., Ltd.
发明人： YU, Binhai , SUN, Bairong , LI, Weiping , XIA, Xunli , LI, Cheng , LONG, Menghua , LIANG, Lifang
IPC分类号： H01L33/48 , H05K1/18 , H01L33/62
CPC分类号： F21V21/00 , B23P11/00 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H05K1/183 , H05K2201/0394 , H05K2201/10106 , Y10T29/49996 , H01L2224/48091 , H01L2924/00014
摘要： A manufacture method for a surface mounted power LED support comprises steps: providing a wiring board (1) having both sided metal layers (11, 12); forming a hole (13); setting a metal layer (131) in the surface of the hole; thickening the metal layer (11, 12) of the wiring board; etching the metal layer of the wiring board; cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board (10, 11, 12), a hole (13) formed in the wiring board and wiring layers (16, 17) set on the surface of the wiring board. The invention can increase the heat dissipation effect of the chip.

2. 发明公开

EP2515352A1 A MANUFACTURE METHOD FOR A SURFACE MOUNTED POWER LED SUPPORT AND ITS PRODUCT 审中-公开
标题翻译：方法A POWER的表贴LED持有人及其产品
公开(公告)号：EP2515352A1
公开(公告)日：2012-10-24
申请号：EP10852393.7
申请日：2010-08-25
申请人： Foshan Nationstar Optoelectronics Co., Ltd , Zhu Hai Bontech Electronic Technology Co., Ltd.
发明人： YU, Binhai , SUN, Bairong , LI, Weiping , XIA, Xunli , LI, Cheng , LONG, Menghua , LIANG, Lifang
IPC分类号： H01L33/48
CPC分类号： F21V21/00 , B23P11/00 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H05K1/183 , H05K2201/0394 , H05K2201/10106 , Y10T29/49996 , H01L2224/48091 , H01L2924/00014
摘要： A manufacture method for a surface mounted power LED support comprises steps: providing a wiring board (1) having both sided metal layers (11, 12); forming a hole (13); setting a metal layer (131) in the surface of the hole; thickening the metal layer (11, 12) of the wiring board; etching the metal layer of the wiring board; cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board (10, 11, 12), a hole (13) formed in the wiring board and wiring layers (16, 17) set on the surface of the wiring board. The invention can increase the heat dissipation effect of the chip.
摘要翻译：用于表面安装的功率的制造方法的LED支撑件包括步骤：提供具有两个面的金属层（11，12）（1）的布线基板; 形成孔（13）; 设置的金属层中的所述表面（131）孔; 加厚布线基板的金属层（11，12）; 蚀刻所述布线基板的金属层; 切割布线板，以形成单个支撑单元。表面安装的LED功率支撑件包括两个单面布线基板（10，11，12），在布线板的表面上设置的布线基板及布线层（16，17）形成的孔（13）。本发明可以提高芯片的散热效果。

3. 发明公开

EP2202809A1 A STRUCTURE OF HEAT DISSIPATION SUBSTRATE FOR POWER LED AND A DEVICE MANUFACTURED BY IT 审中-公开
标题翻译： STRUKTUR EINESWÄRMEABLEITSUBSTRATSFÜRLEISTUNGS-LED UND DAMIT HERGESTELLTE VORRICHTUNG
公开(公告)号：EP2202809A1
公开(公告)日：2010-06-30
申请号：EP08841900.7
申请日：2008-10-15
申请人： Foshan Nationstar Optoelectronics Co., Ltd
发明人： YU, Binhai , LI, Junzheng , XIA, Xunli
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： The invention discloses a structure of heat dissipation substrate of power LED and a device made thereof. The invention overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate of the invention comprises: an one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate comprises: a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device.
摘要翻译：本发明公开了一种功率LED散热基板的结构及其制造装置。本发明克服了功率LED复杂结构，制造工艺严格，生产效率低，生产成本高，产品质量不可靠等缺点。本发明的散热基板的结构包括：一体式电路板，其上具有沉孔和金属线，其中沉孔由通孔和彼此连通的盲孔形成，通孔小于盲孔，两者共轴方向相同; 散热器具有由上部露台和下部露台形成的一体式梯形结构; 散热器与沉孔匹配形成牢固的配合; 可以在电路板上布置多个沉孔; 电路板还可以包括用于切割的多个位置线和多个槽和/或孔。使用散热基板制造的电力LED装置包括：散热器，具有沉孔的电路板，LED芯片，接合线和封装胶体。封装胶体覆盖承载芯片和引线的电路板的一侧，外部电极部分保持在外部。封装胶体不仅用作密封芯片和接合线的密封层，而且还作为与该器件集成的光学透镜。

4. 发明公开

EP2421038A1 RADIATION SUBSTRATE FOR POWER LED AND POWER LED PRODUCTION AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译： STRAHLUNGSSUBSTRATFÜREINE LEISTUNGS-LED UND LEISTUNGS-LED-PRODUKTION UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP2421038A1
公开(公告)日：2012-02-22
申请号：EP09842857.6
申请日：2009-04-10
申请人： Foshan Nationstar Optoelectronics Co., Ltd
发明人： YU, Binhai , LI, Junzheng , XIA, Xunli
IPC分类号： H01L25/075 , H01L25/13 , H01L23/367 , H01L33/00
CPC分类号： H01L33/486 , H01L23/3677 , H01L25/0753 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2933/0075 , Y10T29/49124 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides manufacturing methods for a power LED substrate with a mounting hole and a heat sink and for its power LED product and products thereof. The disclosed fabrication methods for power LED heat-dissipating substrate include the following steps a) selecting substrate material and processing; b) fabricating heat sink; c) assembling substrate and heat sink. The manufacturing methods of power LED products are based upon the manufacturing methods for heat-dissipating substrate, including the following steps: mounting LED die, bonding wire, packaging, post hardening, separating components, testing, classifying, and taping.
摘要翻译：本发明提供了具有安装孔和散热器以及其功率LED产品及其产品的功率LED基板的制造方法。所公开的功率LED散热基板的制造方法包括以下步骤：a）选择基板材料和加工; b）制造散热器; c）组装基板和散热片。电源LED产品的制造方法基于散热基板的制造方法，包括以下步骤：安装LED管芯，接合线，封装，后固化，分离部件，测试，分类和胶带。

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