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    • 4. 发明公开
    • LIQUID SUPPLY MECHANISM AND LIQUID COOLING SYSTEM
    • 液体供应机构和液体冷却系统
    • EP3104009A3
    • 2017-05-03
    • EP16151592.9
    • 2016-01-15
    • Cooler Master Co., Ltd.
    • Liao, Pen-HungHuang, Shih-Wei
    • F04B23/02H01L23/473F04B11/00
    • F04B53/16F04B11/0008F04B11/0033F04B17/04F04B19/22F04B23/02F04B53/08F04B53/14F28D15/00F28D2021/0028F28D2021/0031F28F2250/08F28F2265/10H01L23/473
    • A liquid supply mechanism (20, 20', 30, 30') includes a lower cover (200), an upper cover (202, 202'), a plunger (204), a driving unit (206) and at least one damping member (208). The lower cover (200) has a liquid outlet (2000) and the upper cover (202, 202') is connected to the lower cover (200). A chamber (210) is formed between the lower cover (200) and the upper cover (202, 202'). The chamber (210) communicates with the liquid outlet (2000). The upper cover (202, 202') has an axial hole (2020, 2020'). The plunger (204) is movably disposed in the chamber (210). The plunger (204) has an axial rod (2040) and the axial rod (2040) is inserted into the axial hole (2020, 2020'). The driving unit (206, 306) is disposed in the chamber (210) and drives the plunger (204) to move. The damping member (208) is disposed on the axial rod (2040) and abuts against an inner wall of the axial hole (2020, 2020').
    • 液体供应机构(20,20',30,30')包括下盖(200),上盖(202,202'),柱塞(204),驱动单元(206)和至少一个阻尼器 成员(208)。 下盖(200)具有液体出口(2000),并且上盖(202,202')连接到下盖(200)。 在下盖(200)和上盖(202,202')之间形成腔室(210)。 腔室(210)与液体出口(2000)连通。 上盖(202,202')具有轴向孔(2020,2020')。 柱塞(204)可移动地设置在腔室(210)中。 柱塞(204)具有轴杆(2040),轴杆(2040)插入轴孔(2020,2020')。 驱动单元(206,306)设置于腔室(210)内并驱动​​柱塞(204)移动。 阻尼件208设置在轴杆2040上并与轴孔2020,2020'的内壁抵接。
    • 7. 发明公开
    • ELECTRONIC SYSTEM AND EXTERNAL AUXILIARY HEAT DISSIPATION DEVICE THEREOF
    • ZUSÄTZLICHEEXTERNEWÄRMEABLEITUNGSVORRICHTUNGDAFÜR的ELEKTRONISCHES系统
    • EP3141980A2
    • 2017-03-15
    • EP16153316.1
    • 2016-01-29
    • Cooler Master Co., Ltd.
    • TSAI, Shui-FaHUANG, Shih-WeiCHEN, Hsin-Hung
    • G06F1/16G06F1/20H05K7/20
    • H05K7/20263G06F1/1632G06F1/20H05K7/20272
    • An external auxiliary heat dissipation device (D) includes an external connection head module (M1), a fluid driving module (M2), a heat dissipation module (M3), and a plurality of first pipes (T1). The external connection head module (M1) includes a first carrier body (1) and at least two first fluid connector (2)s disposed on the first carrier body (1). The first pipes (T1) connect to the first fluid connector (2), the fluid driving module (M2), and the heat dissipation module (M3) to form a first fluid pathway. The electronic system (S) includes an internal connection head module (M9) and a plurality of second pipes (T2). The second pipes (T2) connect to the internal connection head module (M9) to form a second fluid pathway. The internal connection head module (M9) is detachably connected to the external connection head module (M1), so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.
    • 外部辅助散热装置(D)包括外部连接头模块(M1),流体驱动模块(M2),散热模块(M3)和多个第一管道(T1)。 外部连接头模块(M1)包括第一载体主体(1)和设置在第一载体主体(1)上的至少两个第一流体连接器(2)。 第一管(T1)连接到第一流体连接器(2),流体驱动模块(M2)和散热模块(M3)以形成第一流体通路。 电子系统(S)包括内部连接头模块(M9)和多个第二管道(T2)。 第二管(T2)连接到内部连接头模块(M9)以形成第二流体通路。 内部连接头模块(M9)可拆卸地连接到外部连接头模块(M1),使得第一和第二流体路径彼此流体连通以形成环路流体通路。