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    • 6. 发明公开
    • POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME
    • POLYAMIDHARZ-ZUSAMMENSETZUNG UND VERFAHREN ZUR HERSTELLUNG
    • EP1022314A1
    • 2000-07-26
    • EP99933131.7
    • 1999-07-28
    • TORAY INDUSTRIES, INC.
    • KATO, KoyaNISHIMURA, ToruYAMANAKA, Toru
    • C08L77/00C08K9/04
    • C08K9/04C08L77/00C08L77/06C08L23/00
    • Provided is a polyamide resin composition comprising a melt blend of (A) a polyamide resin, (B) a phyllosilicate, and (C) an olefin compound having a carboxylic acid anhydride group in the molecule or a polymer of the olefin compound, in which the phyllosilicate (B) has a reactive functional group bonded thereto and is such that the exchangeable metal ions existing in the interlayers are ion-exchanged with organic onium ions. The composition has a reduced inorganic ash content and has both high stiffness and high ductility. Optionally, the composition contains an inorganic filler apart from the phyllosilicate, an impact modifier, and a flame retardant, still having high stiffness and high ductility.
    • 提供一种聚酰胺树脂组合物,其包含(A)聚酰胺树脂,(B)页硅酸盐和(C)分子中具有羧酸酐基团的烯烃化合物或烯烃化合物的聚合物的熔融共混物,其中 页硅酸盐(B)具有与其结合的反应性官能团,并且使得存在于中间层中的可交换金属离子与有机鎓离子进行离子交换。 该组合物具有降低的无机灰分含量,具有高刚度和高延展性。 任选地,组合物包含除了页硅酸盐之外的无机填料,抗冲改性剂和阻燃剂,仍然具有高刚度和高延展性。
    • 9. 发明公开
    • THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME
    • 卡尔登热带热带昆虫KENSTSTOFFZUSAMMENSETZUNG,DARAUS HERGESTELLTE FILME
    • EP0857749A1
    • 1998-08-12
    • EP97933891.0
    • 1997-08-01
    • TORAY INDUSTRIES, INC.
    • SUGIE, RyuichiNISHIMURA, ToruHIRATSUKA, Motoki
    • C08J5/18C08K7/00C08K3/34B32B27/36B42D15/10
    • C08J5/18B32B3/30B32B27/36B32B38/06B32B2305/22B32B2425/00C08J2367/02Y10S428/90Y10T428/24372Y10T428/24479Y10T428/251Y10T428/2911Y10T428/31507Y10T428/31786
    • Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability:

      I. A composition consisting of the following ingredients (A) and (B)
      II. A composition consisting of the following ingredients (A), (B) and (D)
      III. A composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C)
      (In the above I to III,

      the ingredient A is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 or more;
      the ingredient B is an aromatic polycarbonate;
      the ingredient C is an inorganic sheet-like filler of 0.5 to 20 µm in average grain size; and
      the ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)
    • 在其材料中含有以下热塑性树脂组合物I至III中的任一种的卡可以用作磁卡,IC卡等,因为它们具有优异的耐热性,加工性和压花性:I.由以下成分组成的组合物 (A)和(B)二。 由以下成分(A),(B)和(D)III组成的组合物。 一种由100重量份的选自以下成分(A),(B)和(D)中的一种或多种组成的组合物和2至25重量份的以下成分(C>(上述I至III) 成分A是以对苯二甲酸成分为主要二羧酸成分的二羧酸成分和乙二醇成分(I)和作为主要二醇成分的1,4-环己烷二甲醇成分(II)构成的聚酯,其摩尔比(I) 乙二醇组分(I)/ 1,4-环己烷二甲醇组分(II)保持在1或更高的组分(II);成分B是芳族聚碳酸酯;成分C是0.5至20微米的无机片状填料 平均粒径为m;成分(D)为由二羧酸成分与对苯二甲酸成分作为主要二羧酸成分,乙二醇成分(I)和作为主要二醇的1,4-环己烷二甲醇成分(II)构成的聚酯 组分,摩尔比(I)/ (II)与保持在小于1的1,4-环己烷二甲醇组分(II)的摩尔比(II)