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1. 发明公开

EP2848707A1 METHOD FOR PREPARING HIGH-STRENGTH HIGH-CONDUCTIVITY AND DISPERSION-STRENGTHENED COPPER 审中-公开
标题翻译：用于生产高强度，高导电性及铜弥散强化
公开(公告)号：EP2848707A1
公开(公告)日：2015-03-18
申请号：EP13761973.0
申请日：2013-01-17
申请人： Universtiy of Science & Technology Beijing
发明人： HAO, Junjie , GUO, Zhimeng , CHEN, Cunguang , LUO, Ji , GUO, Leichen , YANG, Weiwei , WANG, Wenwen
IPC分类号： C22C1/05 , C22C9/00 , C22B5/12
CPC分类号： C22F1/08 , B22F1/0018 , B22F8/00 , B22F9/22 , B22F9/30 , B22F2003/208 , B22F2998/10 , B22F2999/00 , C22C1/02 , C22C9/00 , C22C32/0021 , Y02P10/24 , Y02W30/541 , B22F3/02 , B22F3/10 , B22F2201/013 , B22F2201/20 , B22F3/20
摘要： The present invention provides a method for preparing high-strength and high-conductivity dispersion-strengthened copper, belonging to the technical field of oxide dispersion-strengthened materials. By taking an electronic circuit board copper-containing waste etching solution (HW22) as a raw material, and adding soluble salt corresponding to a dispersed phase (one, two or more of Al 2 O 3 , Y 2 O 3 , MgO, ZrO 2 and ThO 2 ), Cu(OH) 2 /X(OH) n composite powder is prepared by a chemical neutralization and precipitation process, and nano-oxide dispersion-strengthened copper is obtained through processes such as calcination, selective reduction and densification. The prepared nano-oxide dispersion-strengthened copper material has high strength, high conductivity and excellent high temperature softening resistance: its room temperature tensile strength is greater than 600MPa, its electrical conductivity is greater than 80% IACS (International Annealed Copper Standard), and the softening temperature is higher than 700 DEG C. The method provided by the present invention is simple in process, short in flow, low in energy consumption, and low in cost due to abundant and easily available raw materials, thereby being suitable for large-scale industrial production.
摘要翻译：本发明提供了一种制备高强度和高电导率的弥散强化铜，属于氧化物弥散强化材料的技术领域中的方法。通过取在电子电路板的含铜蚀刻废液（HW22）作为原料，并添加可溶性盐对应于分散相（一个，两个或更多的Al 2 O 3的，Y 2 O 3，MgO的，ZrO 2的和的ThO 2），和Cu（OH）2 / X（OH）N复合粉末由化学中和及沉淀方法制备，和纳米氧化物弥散强化铜是通过方法获得：例如煅烧，还原和选择性致密化。所制备的纳米氧化物弥散强化铜材料具有高强度，高导电性和优异的高温软化性：其室温抗拉强度大于600MPa的，其导电性大于80％IACS（国际退火铜标准），和软化温度高于700℃，按本发明提供的方法是在过程简单，短于流量，能耗低，并且在低由于丰富且容易获得的原材料成本，从而适合适用于大规模以上工业生产。

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