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1. 发明公开

EP1942179A1 CHIP PROVIDED WITH FILM HAVING HOLE PATTERN WITH THE USE OF THERMORESPONSIVE POLYMER AND METHOD OF PRODUCING THE SAME 有权
标题翻译：与孔图形芯片提供，使用其制造的温度下反应性聚合物和方法FILM
公开(公告)号：EP1942179A1
公开(公告)日：2008-07-09
申请号：EP06798370.0
申请日：2006-09-27
申请人： Toyama Prefecture , Nissan Chemical Industries, Ltd.
发明人： TAMIYA, Eiichi , YOKOYAMA, Yoshiyuki , FUJIKI, Satoshi , TANINO, Katsumi , MURAGUCHI, Atsushi , KISHI, Hiroyuki , TOKIMITSU, Yoshiharu , YAMAMURA, Shohei
IPC分类号： C12M3/00 , C12N5/06
CPC分类号： C12N5/0068 , C12N2533/12 , C12N2535/10 , C12N2537/10 , C12N2539/10 , Y10T428/24273 , Y10T436/25 , Y10T436/25375
摘要： [PROBLEMS] To provide a novel chip useful for tretaing cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation. [MEANS FOR SOLVING PROBLEMS A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
摘要翻译： [问题]提供一种具有一个机构的新型芯片等，用于tretaing细胞是有用的，并和结构worin孔图案的尺寸被任意地改变，以便做细胞可以很容易地移进和散射或收集细胞从孔走出但几乎不能从孔洗涤或抗原刺激过程中全身而退。用于解决技术问题的芯片，包括一个温度响应性聚合物作为构成部件的交联产物和设置有具有基板的表面上的孔图案的膜。制造芯片，它包括一个温度响应性聚合物的交联产物，其为构成构件和设置有具有该基板的表面上的孔图案的膜的方法。该方法包括将含有可交联的温度响应性聚合物的组合物，含有交联性温度响应性聚合物和交联剂或含有温度响应性聚合物的组合物和基板的表面上的交联剂的组合物，从而形成涂层电影，交联的涂膜，从而形成如上述，然后描述在所述膜交联产品的涂层的孔图案的交联产物。

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